JPWO2022113818A1 - - Google Patents

Info

Publication number
JPWO2022113818A1
JPWO2022113818A1 JP2022565249A JP2022565249A JPWO2022113818A1 JP WO2022113818 A1 JPWO2022113818 A1 JP WO2022113818A1 JP 2022565249 A JP2022565249 A JP 2022565249A JP 2022565249 A JP2022565249 A JP 2022565249A JP WO2022113818 A1 JPWO2022113818 A1 JP WO2022113818A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022565249A
Other languages
Japanese (ja)
Other versions
JP7355256B2 (ja
JPWO2022113818A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022113818A1 publication Critical patent/JPWO2022113818A1/ja
Publication of JPWO2022113818A5 publication Critical patent/JPWO2022113818A5/ja
Application granted granted Critical
Publication of JP7355256B2 publication Critical patent/JP7355256B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/02Disposition of insulation
    • H01B7/0208Cables with several layers of insulating material
    • H01B7/0225Three or more layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/04Flexible cables, conductors, or cords, e.g. trailing cables

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
JP2022565249A 2020-11-30 2021-11-16 伝送線路及び電子機器 Active JP7355256B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020198385 2020-11-30
JP2020198385 2020-11-30
JP2021033558 2021-03-03
JP2021033558 2021-03-03
PCT/JP2021/042035 WO2022113818A1 (ja) 2020-11-30 2021-11-16 伝送線路及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2022113818A1 true JPWO2022113818A1 (https=) 2022-06-02
JPWO2022113818A5 JPWO2022113818A5 (https=) 2023-07-13
JP7355256B2 JP7355256B2 (ja) 2023-10-03

Family

ID=81756010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565249A Active JP7355256B2 (ja) 2020-11-30 2021-11-16 伝送線路及び電子機器

Country Status (3)

Country Link
US (1) US12230423B2 (https=)
JP (1) JP7355256B2 (https=)
WO (1) WO2022113818A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048599A1 (ja) * 2024-09-02 2026-03-05 株式会社村田製作所 多層基板及び電子機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62269401A (ja) * 1986-05-16 1987-11-21 Mitsubishi Electric Corp サスペンデツド線路
JPH09246813A (ja) * 1996-03-05 1997-09-19 Motorola Inc マイクロストリップから懸垂ストリップ線路への集積移行構造とその製造方法
JPH1041710A (ja) * 1996-04-12 1998-02-13 Harris Corp 空気誘電体ストリップ線路
US20020084876A1 (en) * 2000-12-29 2002-07-04 Wright Mitchel E. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
JP2017123740A (ja) * 2016-01-07 2017-07-13 シャープ株式会社 スイッチング電源
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE27089E (en) * 1969-10-24 1971-03-23 Planar coaxial circuitry
JP2007123740A (ja) * 2005-10-31 2007-05-17 Sony Corp フレキシブル基板、光送受信モジュール及び光送受信装置
US8889999B2 (en) * 2011-10-24 2014-11-18 Cisco Technology, Inc. Multiple layer printed circuit board with unplated vias

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62269401A (ja) * 1986-05-16 1987-11-21 Mitsubishi Electric Corp サスペンデツド線路
JPH09246813A (ja) * 1996-03-05 1997-09-19 Motorola Inc マイクロストリップから懸垂ストリップ線路への集積移行構造とその製造方法
JPH1041710A (ja) * 1996-04-12 1998-02-13 Harris Corp 空気誘電体ストリップ線路
US20020084876A1 (en) * 2000-12-29 2002-07-04 Wright Mitchel E. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
JP2017123740A (ja) * 2016-01-07 2017-07-13 シャープ株式会社 スイッチング電源
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Also Published As

Publication number Publication date
WO2022113818A1 (ja) 2022-06-02
JP7355256B2 (ja) 2023-10-03
US12230423B2 (en) 2025-02-18
US20230290537A1 (en) 2023-09-14

Similar Documents

Publication Publication Date Title
JPWO2022113591A1 (https=)
JPWO2022114205A1 (https=)
JPWO2022113818A1 (https=)
CN305866670S (https=)
CN305768612S (https=)
CN305862073S (https=)
CN305755710S (https=)
CN305536749S (https=)
CN305536513S (https=)
CN305536136S (https=)
CN305535269S (https=)
CN305534528S (https=)
CN305861473S (https=)
CN305534511S (https=)
CN305754228S (https=)
CN305861234S (https=)
CN305859555S (https=)
CN305533783S (https=)
CN305533747S (https=)
CN305533482S (https=)
CN305857074S (https=)
CN305854910S (https=)
CN305854343S (https=)
CN305850041S (https=)
CN305848756S (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230515

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230515

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230515

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230822

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230904

R150 Certificate of patent or registration of utility model

Ref document number: 7355256

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150