JP7355256B2 - 伝送線路及び電子機器 - Google Patents
伝送線路及び電子機器 Download PDFInfo
- Publication number
- JP7355256B2 JP7355256B2 JP2022565249A JP2022565249A JP7355256B2 JP 7355256 B2 JP7355256 B2 JP 7355256B2 JP 2022565249 A JP2022565249 A JP 2022565249A JP 2022565249 A JP2022565249 A JP 2022565249A JP 7355256 B2 JP7355256 B2 JP 7355256B2
- Authority
- JP
- Japan
- Prior art keywords
- hollow
- transmission line
- conductor layer
- hollow parts
- viewed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005540 biological transmission Effects 0.000 title claims description 174
- 239000010410 layer Substances 0.000 claims description 255
- 239000004020 conductor Substances 0.000 claims description 232
- 239000012212 insulator Substances 0.000 claims description 100
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 239000011148 porous material Substances 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- 239000011229 interlayer Substances 0.000 description 58
- 238000005452 bending Methods 0.000 description 31
- 230000004048 modification Effects 0.000 description 19
- 238000012986 modification Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 11
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
- H01B7/0225—Three or more layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Waveguides (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020198385 | 2020-11-30 | ||
| JP2020198385 | 2020-11-30 | ||
| JP2021033558 | 2021-03-03 | ||
| JP2021033558 | 2021-03-03 | ||
| PCT/JP2021/042035 WO2022113818A1 (ja) | 2020-11-30 | 2021-11-16 | 伝送線路及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022113818A1 JPWO2022113818A1 (https=) | 2022-06-02 |
| JPWO2022113818A5 JPWO2022113818A5 (https=) | 2023-07-13 |
| JP7355256B2 true JP7355256B2 (ja) | 2023-10-03 |
Family
ID=81756010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022565249A Active JP7355256B2 (ja) | 2020-11-30 | 2021-11-16 | 伝送線路及び電子機器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12230423B2 (https=) |
| JP (1) | JP7355256B2 (https=) |
| WO (1) | WO2022113818A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026048599A1 (ja) * | 2024-09-02 | 2026-03-05 | 株式会社村田製作所 | 多層基板及び電子機器 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020084876A1 (en) | 2000-12-29 | 2002-07-04 | Wright Mitchel E. | Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
| JP2017123740A (ja) | 2016-01-07 | 2017-07-13 | シャープ株式会社 | スイッチング電源 |
| WO2017130731A1 (ja) | 2016-01-27 | 2017-08-03 | 株式会社村田製作所 | 信号伝送線路 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE27089E (en) * | 1969-10-24 | 1971-03-23 | Planar coaxial circuitry | |
| JPS62269401A (ja) * | 1986-05-16 | 1987-11-21 | Mitsubishi Electric Corp | サスペンデツド線路 |
| US5844450A (en) * | 1996-03-05 | 1998-12-01 | Motorola, Inc. | Integrated microstrip to suspend stripline transition structure and method of fabrication |
| US5712607A (en) | 1996-04-12 | 1998-01-27 | Dittmer; Timothy W. | Air-dielectric stripline |
| JP2007123740A (ja) * | 2005-10-31 | 2007-05-17 | Sony Corp | フレキシブル基板、光送受信モジュール及び光送受信装置 |
| US8889999B2 (en) * | 2011-10-24 | 2014-11-18 | Cisco Technology, Inc. | Multiple layer printed circuit board with unplated vias |
-
2021
- 2021-11-16 WO PCT/JP2021/042035 patent/WO2022113818A1/ja not_active Ceased
- 2021-11-16 JP JP2022565249A patent/JP7355256B2/ja active Active
-
2023
- 2023-05-17 US US18/198,475 patent/US12230423B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020084876A1 (en) | 2000-12-29 | 2002-07-04 | Wright Mitchel E. | Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
| JP2017123740A (ja) | 2016-01-07 | 2017-07-13 | シャープ株式会社 | スイッチング電源 |
| WO2017130731A1 (ja) | 2016-01-27 | 2017-08-03 | 株式会社村田製作所 | 信号伝送線路 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022113818A1 (ja) | 2022-06-02 |
| JPWO2022113818A1 (https=) | 2022-06-02 |
| US12230423B2 (en) | 2025-02-18 |
| US20230290537A1 (en) | 2023-09-14 |
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