JPWO2022114205A1 - - Google Patents

Info

Publication number
JPWO2022114205A1
JPWO2022114205A1 JP2022565497A JP2022565497A JPWO2022114205A1 JP WO2022114205 A1 JPWO2022114205 A1 JP WO2022114205A1 JP 2022565497 A JP2022565497 A JP 2022565497A JP 2022565497 A JP2022565497 A JP 2022565497A JP WO2022114205 A1 JPWO2022114205 A1 JP WO2022114205A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022565497A
Other languages
Japanese (ja)
Other versions
JPWO2022114205A5 (https=
JP7327691B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022114205A1 publication Critical patent/JPWO2022114205A1/ja
Publication of JPWO2022114205A5 publication Critical patent/JPWO2022114205A5/ja
Application granted granted Critical
Publication of JP7327691B2 publication Critical patent/JP7327691B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/003—Coplanar lines
    • H01P3/006—Conductor backed coplanar waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/082—Multilayer dielectric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022565497A 2020-11-30 2021-11-30 多層基板及び電子機器 Active JP7327691B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020198381 2020-11-30
JP2020198381 2020-11-30
PCT/JP2021/043729 WO2022114205A1 (ja) 2020-11-30 2021-11-30 多層基板及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2022114205A1 true JPWO2022114205A1 (https=) 2022-06-02
JPWO2022114205A5 JPWO2022114205A5 (https=) 2023-08-08
JP7327691B2 JP7327691B2 (ja) 2023-08-16

Family

ID=81755677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565497A Active JP7327691B2 (ja) 2020-11-30 2021-11-30 多層基板及び電子機器

Country Status (4)

Country Link
US (1) US20230299453A1 (https=)
JP (1) JP7327691B2 (https=)
CN (1) CN219979788U (https=)
WO (1) WO2022114205A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119342681A (zh) * 2023-07-20 2025-01-21 鹏鼎控股(深圳)股份有限公司 电路板及其制造方法
WO2026048599A1 (ja) * 2024-09-02 2026-03-05 株式会社村田製作所 多層基板及び電子機器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192022U (https=) * 1981-05-29 1982-12-06
JPH09298407A (ja) * 1996-05-08 1997-11-18 Nec Corp マイクロストリップライン
US6323741B1 (en) * 1998-10-13 2001-11-27 Lg Electronics Inc. Microstrip coupler with a longitudinal recess
US20060028305A1 (en) * 2004-08-03 2006-02-09 Banpil Photonics, Inc. High-Speed Printed Circuit Boards (PCBs) and Manufacturing
JP2008067153A (ja) * 2006-09-08 2008-03-21 Omron Corp 誘電体伝送線路とそれを用いた高周波回路装置
US7975378B1 (en) * 2010-01-06 2011-07-12 Banpil Photonics, Inc. Method of manufacturing high speed printed circuit board interconnects
JP2012119786A (ja) * 2010-11-29 2012-06-21 Yokowo Co Ltd 信号伝送媒体、高周波信号伝送媒体
JP2014216449A (ja) * 2013-04-25 2014-11-17 日本メクトロン株式会社 プリント配線板およびプリント配線板製造方法
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535088B1 (en) * 2000-04-13 2003-03-18 Raytheon Company Suspended transmission line and method
WO2021000075A1 (zh) * 2019-06-29 2021-01-07 瑞声声学科技(深圳)有限公司 一种传输线

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192022U (https=) * 1981-05-29 1982-12-06
JPH09298407A (ja) * 1996-05-08 1997-11-18 Nec Corp マイクロストリップライン
US6323741B1 (en) * 1998-10-13 2001-11-27 Lg Electronics Inc. Microstrip coupler with a longitudinal recess
US20060028305A1 (en) * 2004-08-03 2006-02-09 Banpil Photonics, Inc. High-Speed Printed Circuit Boards (PCBs) and Manufacturing
JP2008067153A (ja) * 2006-09-08 2008-03-21 Omron Corp 誘電体伝送線路とそれを用いた高周波回路装置
US7975378B1 (en) * 2010-01-06 2011-07-12 Banpil Photonics, Inc. Method of manufacturing high speed printed circuit board interconnects
JP2012119786A (ja) * 2010-11-29 2012-06-21 Yokowo Co Ltd 信号伝送媒体、高周波信号伝送媒体
JP2014216449A (ja) * 2013-04-25 2014-11-17 日本メクトロン株式会社 プリント配線板およびプリント配線板製造方法
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Also Published As

Publication number Publication date
WO2022114205A1 (ja) 2022-06-02
CN219979788U (zh) 2023-11-07
JP7327691B2 (ja) 2023-08-16
US20230299453A1 (en) 2023-09-21

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