JP7327691B2 - 多層基板及び電子機器 - Google Patents

多層基板及び電子機器 Download PDF

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Publication number
JP7327691B2
JP7327691B2 JP2022565497A JP2022565497A JP7327691B2 JP 7327691 B2 JP7327691 B2 JP 7327691B2 JP 2022565497 A JP2022565497 A JP 2022565497A JP 2022565497 A JP2022565497 A JP 2022565497A JP 7327691 B2 JP7327691 B2 JP 7327691B2
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Japan
Prior art keywords
laminate
multilayer substrate
conductor layer
holes
spacer
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JP2022565497A
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English (en)
Japanese (ja)
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JPWO2022114205A1 (https=
JPWO2022114205A5 (https=
Inventor
伸郎 池本
健太朗 川辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2022114205A1 publication Critical patent/JPWO2022114205A1/ja
Publication of JPWO2022114205A5 publication Critical patent/JPWO2022114205A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/003—Coplanar lines
    • H01P3/006—Conductor backed coplanar waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/082—Multilayer dielectric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022565497A 2020-11-30 2021-11-30 多層基板及び電子機器 Active JP7327691B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020198381 2020-11-30
JP2020198381 2020-11-30
PCT/JP2021/043729 WO2022114205A1 (ja) 2020-11-30 2021-11-30 多層基板及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2022114205A1 JPWO2022114205A1 (https=) 2022-06-02
JPWO2022114205A5 JPWO2022114205A5 (https=) 2023-08-08
JP7327691B2 true JP7327691B2 (ja) 2023-08-16

Family

ID=81755677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565497A Active JP7327691B2 (ja) 2020-11-30 2021-11-30 多層基板及び電子機器

Country Status (4)

Country Link
US (1) US20230299453A1 (https=)
JP (1) JP7327691B2 (https=)
CN (1) CN219979788U (https=)
WO (1) WO2022114205A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119342681A (zh) * 2023-07-20 2025-01-21 鹏鼎控股(深圳)股份有限公司 电路板及其制造方法
WO2026048599A1 (ja) * 2024-09-02 2026-03-05 株式会社村田製作所 多層基板及び電子機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323741B1 (en) 1998-10-13 2001-11-27 Lg Electronics Inc. Microstrip coupler with a longitudinal recess
US20060028305A1 (en) 2004-08-03 2006-02-09 Banpil Photonics, Inc. High-Speed Printed Circuit Boards (PCBs) and Manufacturing
US7975378B1 (en) 2010-01-06 2011-07-12 Banpil Photonics, Inc. Method of manufacturing high speed printed circuit board interconnects
JP2012119786A (ja) 2010-11-29 2012-06-21 Yokowo Co Ltd 信号伝送媒体、高周波信号伝送媒体
JP2014216449A (ja) 2013-04-25 2014-11-17 日本メクトロン株式会社 プリント配線板およびプリント配線板製造方法
WO2017130731A1 (ja) 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192022U (https=) * 1981-05-29 1982-12-06
JPH09298407A (ja) * 1996-05-08 1997-11-18 Nec Corp マイクロストリップライン
US6535088B1 (en) * 2000-04-13 2003-03-18 Raytheon Company Suspended transmission line and method
JP2008067153A (ja) * 2006-09-08 2008-03-21 Omron Corp 誘電体伝送線路とそれを用いた高周波回路装置
WO2021000075A1 (zh) * 2019-06-29 2021-01-07 瑞声声学科技(深圳)有限公司 一种传输线

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323741B1 (en) 1998-10-13 2001-11-27 Lg Electronics Inc. Microstrip coupler with a longitudinal recess
US20060028305A1 (en) 2004-08-03 2006-02-09 Banpil Photonics, Inc. High-Speed Printed Circuit Boards (PCBs) and Manufacturing
US7975378B1 (en) 2010-01-06 2011-07-12 Banpil Photonics, Inc. Method of manufacturing high speed printed circuit board interconnects
JP2012119786A (ja) 2010-11-29 2012-06-21 Yokowo Co Ltd 信号伝送媒体、高周波信号伝送媒体
JP2014216449A (ja) 2013-04-25 2014-11-17 日本メクトロン株式会社 プリント配線板およびプリント配線板製造方法
WO2017130731A1 (ja) 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Also Published As

Publication number Publication date
WO2022114205A1 (ja) 2022-06-02
CN219979788U (zh) 2023-11-07
JPWO2022114205A1 (https=) 2022-06-02
US20230299453A1 (en) 2023-09-21

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