JP2007522679A - プリント回路基板用の三つ組構成を有する優先的ビア延出構造 - Google Patents
プリント回路基板用の三つ組構成を有する優先的ビア延出構造 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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Abstract
【選択図】図19
Description
図6は、本明細書において「5ダイ(5-die )」ビアパターンと呼ぶものが形成された他の回路基板200を示す。このパターンは、単一の介在接地ビア205の両側に配設された2対の差動信号ビア202、204を有する。そのような差動信号ビアの各ペアは、2個の別個のビア202a、202bと、204a、204bとを有する。そのような各差動ペアの2個のビアは、通常、(図7で左下から右上に延在するように示された)第1の軸L1の方向に位置合せされている。このパターンは、第1の軸L1と交わる方向に沿って繰返される。差動信号ビア202a−b、204a−bは、通常、これらのビアから回路基板200の他の箇所に至る導電トレースを有し、接地ビア205は、通常、回路基板205内の内側面に配設され、図6には示されていない接地面層に接続されている。
また、トレースがビアから出て回路基板上の伝送経路を構成する領域内の伝送線路のインピーダンスを制御することが望ましい。それらの延出部で問題が起こる。従来、導電トレースペアの間隔を差動信号ビアのペア間に延在する中心線に対して対称的な構成で維持しようとすることは知られていた。これを図14に示す。ここで、一対の差動信号ビアの2個のビア501、502が距離Dだけ互いに離されている。一対の導電トレース503が、ビア501、502に接続されそこから出ている。それらの延出経路は、最初、トレースが均一な間隔DDだけ離れるまで、トレースの延出部504に沿って2個のビア501を分ける中心線Cの方に斜めに延在する。
図18〜18Bは、ビア延出構造の「三つ組」型配置800を示す。図18において、一対の差動信号ビア802が、図の左右方向に互いに離間されるように示されている。これらの2個のビア802の延出構造は、旗部804、湾曲部805及びトレース部806を有する。一対の接地ビア810が、一対の差動信号ビア802の外側に設けられてもよく、水平方向の線に沿って信号ビア802と位置合せされてもよい。これらの接地ビア810は、図18に仮想線で示されており、接地ビア延出構造が始まる斜めのトレース部812、拡大部813、細い部分814、及び、比較的幅が広い中央トレース部815を有する。該幅広トレース部815は、その縁が一対の差動信号トレース部806の縁の下又は外側になるような幅を有することが好ましい。この関係は、図18Aに最もよく示されており、接地ビア延出構造と信号ビア延出構造の垂直方向の離間は、図18Bに最もよく示されている。
Claims (9)
- 差動信号用途に使用される回路基板であって、該回路基板を通して差動信号を伝えるために使用される一対のめっきされたビアを有し、
接地面層であって、両方の差動信号ビアを包囲し、更に他の対のビアに隣接する開口部が形成された接地面層と、
前記一対の差動信号ビアから回路基板の前記接地面層と異なる層上の2本の対応する回路トレースまでの導電経路を画定する延出構造であって、前記ビアからそれらの間にある第1の軸に向かって延出する2つの拡大された旗部と、該旗部を前記回路トレースに相互接続する2つの斜めの部分と、伝送線路部とを備え、回路トレース伝送線路部の一方が、接地面開口部の縁に沿って延在し、前記回路トレース伝送線路部の他方が、一方の回路トレースに沿い、かつ、前記接地面開口部の外側において延在する延出構造とを有する回路基板。 - 前記差動信号ビアと前記他の対のビアが、第2の共通軸に沿って位置合せされた、請求項1に記載の回路基板。
- 前記第1と第2の軸とが互いに交差する、請求項1に記載の回路基板。
- 前記回路トレース伝送線路部が、前記旗部の幅よりも狭い幅を備える、請求項1に記載の回路基板。
- 前記2つの差動信号ビアの前記旗部が、第1のあらかじめ選択された間隔の介在スペースによって分離され、前記回路トレース伝送線路部が、第1のあらかじめ選択された間隔と等しい第2のあらかじめ選択された間隔により分離されている、請求項1に記載の回路基板。
- 回路基板の差動信号回路用の高速ビアシステムであって、
回路基板内に配設されるとともに軸に沿って互に離間された一対の差動信号ビアであって、導電トレース延出部がこれらの差動信号ビアから前記軸に沿って互いに近付く方向に延在し、信号導電トレース延出部が、前記回路基板の他の場所に至る対応する信号導電伝送線路部につながっている、一対の差動信号ビアと、
前記回路基板内に配設され、前記軸に沿って差動信号ビア対の外側で互いに離間された一対の接地ビアであって、一対の導電トレース接地延出部がこれらの接地ビアから延出するとともに前記信号導電トレース延出部から離間されており、2つの導電トレース接地延出部が互いにつながって、前記導電信号トレースの少なくとも一部の間に延在する単一の導電接地トレースを形成する、一対の接地ビアとを有する高速ビアシステム。 - 前記単一の導電接地トレースが、前記信号導電トレース伝送線路部と前記信号導電トレース延出部の一部との間に延在する、請求項6に記載の回路基板。
- 前記導電トレース接地部の幅が、前記導電トレース接地部が前記差動信号ビアの近くを通るときに狭くなる、請求項6に記載の回路基板。
- 前記導電トレース接地部が、前記軸から離間された、請求項6に記載の回路基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54452204P | 2004-02-13 | 2004-02-13 | |
US58388004P | 2004-06-29 | 2004-06-29 | |
PCT/US2005/004469 WO2005081596A2 (en) | 2004-02-13 | 2005-02-14 | Preferential ground and via exit structures for printed circuit boards |
Publications (2)
Publication Number | Publication Date |
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JP2007522679A true JP2007522679A (ja) | 2007-08-09 |
JP4354489B2 JP4354489B2 (ja) | 2009-10-28 |
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Application Number | Title | Priority Date | Filing Date |
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JP2006553287A Expired - Fee Related JP4354489B2 (ja) | 2004-02-13 | 2005-02-14 | 回路基板及び高速ビアシステム |
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US (2) | US7448909B2 (ja) |
EP (1) | EP1721496A2 (ja) |
JP (1) | JP4354489B2 (ja) |
SG (1) | SG135183A1 (ja) |
WO (1) | WO2005081596A2 (ja) |
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- 2005-02-14 JP JP2006553287A patent/JP4354489B2/ja not_active Expired - Fee Related
- 2005-02-14 SG SG200705887-8A patent/SG135183A1/en unknown
- 2005-02-14 WO PCT/US2005/004469 patent/WO2005081596A2/en not_active Application Discontinuation
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2008
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US9859603B2 (en) | 2013-01-24 | 2018-01-02 | Nec Corporation | Printed wiring board, electronic device, and wiring connection method |
WO2019116468A1 (ja) * | 2017-12-13 | 2019-06-20 | 株式会社日立製作所 | 配線基板及び電子機器 |
JPWO2019116468A1 (ja) * | 2017-12-13 | 2020-06-11 | 株式会社日立製作所 | 配線基板及び電子機器 |
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Also Published As
Publication number | Publication date |
---|---|
EP1721496A2 (en) | 2006-11-15 |
WO2005081596A3 (en) | 2005-12-22 |
US7633766B2 (en) | 2009-12-15 |
US20050202722A1 (en) | 2005-09-15 |
SG135183A1 (en) | 2007-09-28 |
JP4354489B2 (ja) | 2009-10-28 |
US20080318450A1 (en) | 2008-12-25 |
WO2005081596A2 (en) | 2005-09-01 |
US7448909B2 (en) | 2008-11-11 |
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