JP6894352B2 - プリント回路基板及び当該プリント回路基板を備える光送受信器 - Google Patents
プリント回路基板及び当該プリント回路基板を備える光送受信器 Download PDFInfo
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09636—Details of adjacent, not connected vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10045—Mounted network component having plural terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Description
図1はネットワーク装置(不図示)に実装された本発明の第1の実施形態によるプリント回路基板を備える光送受信器の概略的断面斜視図を表している。図2は当該実施形態によるプリント回路基板の第一面を表している。図3は当該実施形態によるプリント回路基板の第二面を表している。なお図2,3中、本発明の要旨が曖昧になることを回避するため、受信側CDR IC(Rx-CDR IC)207と送信側CDR IC(Tx-CDR IC)209以外のICは省略されている。
図9(a)は本発明の第2の実施形態によるプリント回路基板上に配置した2チャネルの差動信号ビア列の拡大平面図を表し、かつ、図9(b)は比較例1のプリント回路基板上に配置した2チャネルの差動信号ビア列の拡大平面図を表している。当該実施形態は、差動伝送線路のチャネル数が異なる点以外は、第1の実施形態と同じである。
Claims (8)
- 誘電体と、
前記誘電体を貫通するように設けられるN個(Nは2以上の整数)の差動信号ビアの対と、
前記誘電体の第一面上に設けられるN個の第一ストリップ導体対と、
前記誘電体の内部に設けられて前記N個の第一ストリップ導体対および前記誘電体とそれぞれN個の第一差動伝送線路を構成する第一接地導体層と、
前記誘電体の第二面上に設けられるN個の第二ストリップ導体対と、
前記誘電体の内部に設けられて前記N個の第二ストリップ導体対および前記誘電体とそれぞれN個の第二差動伝送線路を構成する第二接地導体層と、
前記第一及び第二接地導体層にそれぞれ接続する複数の接地導体ビアと、
を有し、
前記N個の第一ストリップ導体対と第二ストリップ導体対は前記N個の差動信号ビアの対を介して各々が接続され、
前記第一接地導体層は、前記N個の差動信号ビアの対と絶縁するための単一の第一開口を備え、前記第二接地導体層は、前記N個の差動信号ビアの対と絶縁するための単一の第二開口を備え、
前記N個の差動信号ビアの対は、前記単一の第一及び第二開口を貫通するとともに、前記第一及び第二開口内で一の方向に沿って配置され、
前記複数の接地導体ビアは、前記N個の差動信号ビアの対を取り囲むように、かつ、前記第一及び第二開口の外側に配置される、
プリント回路基板。 - 請求項1に記載のプリント回路基板であって、
前記複数の接地導体ビアは、前記N個の差動信号ビアの対のそれぞれを取り囲むように配置される(2N+2)個の接地導体ビアを含み、
前記(2N+2)個の接地導体ビアのうちの2個の接地導体ビアは、前記N個の差動信号ビアの対のうちの隣接する2つの差動信号ビアの対との間に、前記第一及び第二開口を挟んで対向するよう配置され、
前記(2N+2)個の接地導体ビアは前記第一及び第二開口の外側において前記第一及び第二接地導体層に接続する、
ことを特徴とするプリント回路基板。 - 請求項1に記載のプリント回路基板であって、
前記N個の差動信号ビアの対のうち、隣接する二つの差動信号ビアの対の中心間距離D1、前記隣接する二つの差動信号ビアの対に接続される隣接する二つの第一差動伝送線路の中心間距離Pとする場合、(D1,P)は、(0.6mm,1.2mm)、(0.9mm,1.6mm)、(1.2mm,2.2mm)、(0.6mm,2.2mm)を頂点とする四角形の辺上又は該四角形の範囲の内側に位置する、
ことを特徴とするプリント回路基板。 - 誘電体と、
前記誘電体を貫通するように設けられるN個(Nは2以上の整数)の差動信号ビアの対と、
前記誘電体の第一面上に設けられるN個の第一ストリップ導体対と、
前記誘電体の内部に設けられて前記N個の第一ストリップ導体対および前記誘電体とそれぞれN個の第一差動伝送線路を構成する第一接地導体層と、
前記誘電体の第二面上に設けられるN個の第二ストリップ導体対と、
前記誘電体の内部に設けられて前記N個の第二ストリップ導体対および前記誘電体とそれぞれN個の第二差動伝送線路を構成する第二接地導体層と、
を有し、
前記N個の第一ストリップ導体対と第二ストリップ導体対は前記N個の差動信号ビアの対を介して各々が接続され、
前記N個の差動信号ビアの対のうち、隣接する二つの差動信号ビアの対の中心間距離D1、前記隣接する二つの差動信号ビアの対に接続される隣接する二つの第一差動伝送線路の中心間距離Pとする場合、(D1,P)は、(0.6mm,1.2mm)、(0.9mm,1.6mm)、(1.2mm,2.2mm)、(0.6mm,2.2mm)を頂点とする四角形の辺上又は該四角形の範囲の内側に位置する、
ことを特徴とするプリント回路基板。 - 請求項4に記載のプリント回路基板であって、
前記第一接地導体層は、前記N個の差動信号ビアの対と絶縁するための単一の第一開口を備え、前記第二接地導体層は、前記N個の差動信号ビアの対と絶縁するための単一の第二開口を備え、
前記N個の差動信号ビアの対は、前記単一の第一及び第二開口を貫通するとともに、前記第一及び第二開口内で一の方向に沿って配置される、
ことを特徴とするプリント回路基板。 - 請求項5に記載のプリント回路基板であって、
前記N個の差動信号ビアの対のそれぞれを取り囲むように配置される(2N+2)個の接地導体ビアをさらに有し、
前記(2N+2)個の接地導体ビアのうちの2個の接地導体ビアは、前記N個の差動信号ビアの対のうちの隣接する2つの差動信号ビアの対との間に、前記第一及び第二開口を挟んで対向するよう配置され、
前記(2N+2)個の接地導体ビアは前記第一及び第二開口の外側において前記第一及び第二接地導体層に接続する、
ことを特徴とするプリント回路基板。 - 請求項1または4に記載のプリント回路基板を備える光送受信器。
- 請求項7に記載の光送受信器であって、
光信号を出力する光送信サブアセンブリと、
入力される光信号を電気信号に変換する光受信サブアセンブリと、
N個の第三差動伝送線路が形成されたフレキシブル基板と、
ICと、
前記プリント回路基板、前記光受信サブアセンブリ、前記フレキシブル基板、そして前記ICを格納するケースと、をさらに備え、
前記電気信号は、前記フレキシブル基板の前記第三差動伝送線路を介して前記プリント回路基板の前記第一差動伝送線路に接続される、
ことを特徴とする光送受信器。
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JP2017223643A JP6894352B2 (ja) | 2017-11-21 | 2017-11-21 | プリント回路基板及び当該プリント回路基板を備える光送受信器 |
US16/185,036 US10470293B2 (en) | 2017-11-21 | 2018-11-09 | Printed circuit board and optical transceiver with the printed circuit board |
US16/673,239 US11057986B2 (en) | 2017-11-21 | 2019-11-04 | Printed circuit board and optical transceiver with the printed circuit board |
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JP7151567B2 (ja) * | 2019-03-14 | 2022-10-12 | 株式会社オートネットワーク技術研究所 | 回路装置及び電子制御ユニットと回路装置との接続構造 |
CN113133186A (zh) * | 2021-04-15 | 2021-07-16 | 山东英信计算机技术有限公司 | 一种基于PCIe 5.0协议的高密连接器PCB结构 |
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JP4354489B2 (ja) * | 2004-02-13 | 2009-10-28 | モレックス インコーポレイテド | 回路基板及び高速ビアシステム |
JP2005243864A (ja) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | 配線基板 |
JP4852979B2 (ja) * | 2005-10-31 | 2012-01-11 | ソニー株式会社 | フレックスリジッド基板、光送受信モジュール及び光送受信装置 |
JP4930590B2 (ja) * | 2006-10-13 | 2012-05-16 | 日本電気株式会社 | 多層基板 |
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JP6894352B2 (ja) | 2017-11-21 | 2021-06-30 | 日本ルメンタム株式会社 | プリント回路基板及び当該プリント回路基板を備える光送受信器 |
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US20200068703A1 (en) | 2020-02-27 |
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US20190159334A1 (en) | 2019-05-23 |
US11057986B2 (en) | 2021-07-06 |
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