JPWO2022114205A5 - - Google Patents
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- Publication number
- JPWO2022114205A5 JPWO2022114205A5 JP2022565497A JP2022565497A JPWO2022114205A5 JP WO2022114205 A5 JPWO2022114205 A5 JP WO2022114205A5 JP 2022565497 A JP2022565497 A JP 2022565497A JP 2022565497 A JP2022565497 A JP 2022565497A JP WO2022114205 A5 JPWO2022114205 A5 JP WO2022114205A5
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- conductor layer
- multilayer substrate
- holes
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 150
- 125000006850 spacer group Chemical group 0.000 claims description 96
- 239000000758 substrate Substances 0.000 claims description 87
- 239000012212 insulator Substances 0.000 claims description 58
- 239000000463 material Substances 0.000 claims description 23
- 230000005484 gravity Effects 0.000 claims description 18
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 139
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- ORMDVQRBTFCOGC-UHFFFAOYSA-N (2-hydroperoxy-4-methylpentan-2-yl)benzene Chemical compound CC(C)CC(C)(OO)C1=CC=CC=C1 ORMDVQRBTFCOGC-UHFFFAOYSA-N 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 101100505291 Arabidopsis thaliana GC2 gene Proteins 0.000 description 2
- 101100506740 Arabidopsis thaliana GL2 gene Proteins 0.000 description 2
- 101100068989 Arabidopsis thaliana GLYR2 gene Proteins 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 101100504426 Homo sapiens SLC25A18 gene Proteins 0.000 description 2
- 101100123071 Oryza sativa subsp. japonica GRC2 gene Proteins 0.000 description 2
- 101100337779 Oryza sativa subsp. japonica GRF4 gene Proteins 0.000 description 2
- 101100283949 Plasmodium falciparum (isolate K1 / Thailand) GR2 gene Proteins 0.000 description 2
- 101100477857 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SNF1 gene Proteins 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020198381 | 2020-11-30 | ||
| JP2020198381 | 2020-11-30 | ||
| PCT/JP2021/043729 WO2022114205A1 (ja) | 2020-11-30 | 2021-11-30 | 多層基板及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022114205A1 JPWO2022114205A1 (https=) | 2022-06-02 |
| JPWO2022114205A5 true JPWO2022114205A5 (https=) | 2023-08-08 |
| JP7327691B2 JP7327691B2 (ja) | 2023-08-16 |
Family
ID=81755677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022565497A Active JP7327691B2 (ja) | 2020-11-30 | 2021-11-30 | 多層基板及び電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230299453A1 (https=) |
| JP (1) | JP7327691B2 (https=) |
| CN (1) | CN219979788U (https=) |
| WO (1) | WO2022114205A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119342681A (zh) * | 2023-07-20 | 2025-01-21 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制造方法 |
| WO2026048599A1 (ja) * | 2024-09-02 | 2026-03-05 | 株式会社村田製作所 | 多層基板及び電子機器 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192022U (https=) * | 1981-05-29 | 1982-12-06 | ||
| JPH09298407A (ja) * | 1996-05-08 | 1997-11-18 | Nec Corp | マイクロストリップライン |
| KR100339373B1 (ko) * | 1998-10-13 | 2002-07-18 | 구자홍 | 마이크로스트립카플러및그의제조방법 |
| US6535088B1 (en) * | 2000-04-13 | 2003-03-18 | Raytheon Company | Suspended transmission line and method |
| US7755445B2 (en) * | 2004-08-03 | 2010-07-13 | Banpil Photonics, Inc. | Multi-layered high-speed printed circuit boards comprised of stacked dielectric systems |
| JP2008067153A (ja) * | 2006-09-08 | 2008-03-21 | Omron Corp | 誘電体伝送線路とそれを用いた高周波回路装置 |
| US7975378B1 (en) * | 2010-01-06 | 2011-07-12 | Banpil Photonics, Inc. | Method of manufacturing high speed printed circuit board interconnects |
| JP5666270B2 (ja) * | 2010-11-29 | 2015-02-12 | 株式会社ヨコオ | 信号伝送媒体、高周波信号伝送媒体 |
| JP6285638B2 (ja) * | 2013-04-25 | 2018-02-28 | 日本メクトロン株式会社 | プリント配線板およびプリント配線板製造方法 |
| CN208608339U (zh) * | 2016-01-27 | 2019-03-15 | 株式会社村田制作所 | 信号传输线路 |
| WO2021000075A1 (zh) * | 2019-06-29 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | 一种传输线 |
-
2021
- 2021-11-30 WO PCT/JP2021/043729 patent/WO2022114205A1/ja not_active Ceased
- 2021-11-30 CN CN202190000840.1U patent/CN219979788U/zh active Active
- 2021-11-30 JP JP2022565497A patent/JP7327691B2/ja active Active
-
2023
- 2023-05-24 US US18/201,212 patent/US20230299453A1/en active Pending
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