JPWO2022014334A5 - - Google Patents

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Publication number
JPWO2022014334A5
JPWO2022014334A5 JP2022536238A JP2022536238A JPWO2022014334A5 JP WO2022014334 A5 JPWO2022014334 A5 JP WO2022014334A5 JP 2022536238 A JP2022536238 A JP 2022536238A JP 2022536238 A JP2022536238 A JP 2022536238A JP WO2022014334 A5 JPWO2022014334 A5 JP WO2022014334A5
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JP
Japan
Prior art keywords
conductor layer
signal conductor
section
line portions
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022536238A
Other languages
English (en)
Japanese (ja)
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JPWO2022014334A1 (https=
JP7409508B2 (ja
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Publication date
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Priority claimed from PCT/JP2021/024760 external-priority patent/WO2022014334A1/ja
Publication of JPWO2022014334A1 publication Critical patent/JPWO2022014334A1/ja
Publication of JPWO2022014334A5 publication Critical patent/JPWO2022014334A5/ja
Application granted granted Critical
Publication of JP7409508B2 publication Critical patent/JP7409508B2/ja
Active legal-status Critical Current
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JP2022536238A 2020-07-16 2021-06-30 回路基板 Active JP7409508B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020122128 2020-07-16
JP2020122128 2020-07-16
PCT/JP2021/024760 WO2022014334A1 (ja) 2020-07-16 2021-06-30 回路基板

Publications (3)

Publication Number Publication Date
JPWO2022014334A1 JPWO2022014334A1 (https=) 2022-01-20
JPWO2022014334A5 true JPWO2022014334A5 (https=) 2023-03-08
JP7409508B2 JP7409508B2 (ja) 2024-01-09

Family

ID=79554613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536238A Active JP7409508B2 (ja) 2020-07-16 2021-06-30 回路基板

Country Status (4)

Country Link
US (1) US12289828B2 (https=)
JP (1) JP7409508B2 (https=)
CN (1) CN220456625U (https=)
WO (1) WO2022014334A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250318044A1 (en) * 2024-04-08 2025-10-09 Cisco Technology, Inc. Printed circuit board trace with formations

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3527410B2 (ja) * 1998-06-15 2004-05-17 株式会社リコー コプレーナーストリップライン
US7674987B2 (en) * 2007-03-29 2010-03-09 Ibiden Co., Ltd. Multilayer printed circuit board
US8274307B1 (en) * 2007-06-18 2012-09-25 Marvell Israel (M.I.S.L.) Ltd. Impedance discontinuity compensator for electronic packages
JP2009105630A (ja) 2007-10-23 2009-05-14 Nitto Denko Corp 配線回路基板
US9386690B2 (en) * 2014-03-27 2016-07-05 Intel Corporation First and second differential interconnects having interleaved stub traces
WO2015186720A1 (ja) 2014-06-05 2015-12-10 株式会社村田製作所 伝送線路部材

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