JPWO2022044585A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2022044585A5 JPWO2022044585A5 JP2022545520A JP2022545520A JPWO2022044585A5 JP WO2022044585 A5 JPWO2022044585 A5 JP WO2022044585A5 JP 2022545520 A JP2022545520 A JP 2022545520A JP 2022545520 A JP2022545520 A JP 2022545520A JP WO2022044585 A5 JPWO2022044585 A5 JP WO2022044585A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- insulating film
- filled microstructure
- microstructure according
- atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 238000010438 heat treatment Methods 0.000 claims 8
- 239000004020 conductor Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000010953 base metal Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020140860 | 2020-08-24 | ||
| JP2020140860 | 2020-08-24 | ||
| PCT/JP2021/026287 WO2022044585A1 (ja) | 2020-08-24 | 2021-07-13 | 金属充填微細構造体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022044585A1 JPWO2022044585A1 (https=) | 2022-03-03 |
| JPWO2022044585A5 true JPWO2022044585A5 (https=) | 2023-04-27 |
| JP7506753B2 JP7506753B2 (ja) | 2024-06-26 |
Family
ID=80353165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022545520A Active JP7506753B2 (ja) | 2020-08-24 | 2021-07-13 | 金属充填微細構造体の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7506753B2 (https=) |
| KR (1) | KR102723699B1 (https=) |
| CN (1) | CN115956144B (https=) |
| TW (1) | TW202208695A (https=) |
| WO (1) | WO2022044585A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021033467A1 (ja) * | 2019-08-16 | 2021-02-25 | 富士フイルム株式会社 | 構造体の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011090865A (ja) * | 2009-10-22 | 2011-05-06 | Shinko Electric Ind Co Ltd | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 |
| WO2017057150A1 (ja) * | 2015-09-29 | 2017-04-06 | 富士フイルム株式会社 | 金属充填微細構造体の製造方法 |
| JP6644895B2 (ja) | 2016-08-24 | 2020-02-12 | 富士フイルム株式会社 | 保管方法 |
| JP6906616B2 (ja) * | 2017-08-25 | 2021-07-21 | 富士フイルム株式会社 | 構造体、構造体の製造方法、積層体および半導体パッケージ |
| WO2019065095A1 (ja) * | 2017-09-26 | 2019-04-04 | 富士フイルム株式会社 | 金属充填微細構造体の製造方法および絶縁性基材 |
-
2021
- 2021-07-13 KR KR1020237006062A patent/KR102723699B1/ko active Active
- 2021-07-13 JP JP2022545520A patent/JP7506753B2/ja active Active
- 2021-07-13 WO PCT/JP2021/026287 patent/WO2022044585A1/ja not_active Ceased
- 2021-07-13 CN CN202180050316.XA patent/CN115956144B/zh active Active
- 2021-08-09 TW TW110129211A patent/TW202208695A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5183294B2 (ja) | 焼結されたパワー半導体基板並びにそのための製造方法 | |
| JP2006278557A (ja) | 積層セラミック電子部品 | |
| JPWO2022044585A5 (https=) | ||
| JPWO2021131643A5 (https=) | ||
| KR20180037865A (ko) | 세라믹 기판 및 세라믹 기판 제조 방법 | |
| CN103531273B (zh) | 异型换位导线 | |
| WO2021111508A1 (ja) | 接合基板及び接合基板の製造方法 | |
| JP2002368422A (ja) | 多層セラミック基板及びその製造方法 | |
| CN103247395A (zh) | 一种多层高梯度绝缘子及其制备方法 | |
| JP2507343B2 (ja) | 樹脂封止型半導体装置 | |
| JPH11240706A5 (https=) | ||
| CN116283294B (zh) | 一种厚度可调节的复合石墨散热膜及其制备方法 | |
| CN110111952B (zh) | 一种石墨烯导电材料的制备方法 | |
| JPWO2021095401A5 (https=) | ||
| WO1999053504A1 (en) | Ptc thermistor chip | |
| JP2017054754A5 (https=) | ||
| JP5593625B2 (ja) | 多層配線基板の製造方法 | |
| JP2024012673A5 (ja) | プリント配線板及びプリント配線板の製造方法 | |
| JPWO2021100747A5 (https=) | ||
| JP2018129523A5 (https=) | ||
| JP2022051283A5 (https=) | ||
| CN113594348A (zh) | 复合超导线及其制备方法与连接方法、一种连接超导线 | |
| TWI748852B (zh) | 電路板結構及其製作方法 | |
| JPS5810810A (ja) | 積層インダクタの製造方法 | |
| JP5176740B2 (ja) | 多層セラミック基板 |