JPWO2022044585A1 - - Google Patents
Info
- Publication number
- JPWO2022044585A1 JPWO2022044585A1 JP2022545520A JP2022545520A JPWO2022044585A1 JP WO2022044585 A1 JPWO2022044585 A1 JP WO2022044585A1 JP 2022545520 A JP2022545520 A JP 2022545520A JP 2022545520 A JP2022545520 A JP 2022545520A JP WO2022044585 A1 JPWO2022044585 A1 JP WO2022044585A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/20—Electrolytic after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/26—Anodisation of refractory metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020140860 | 2020-08-24 | ||
| JP2020140860 | 2020-08-24 | ||
| PCT/JP2021/026287 WO2022044585A1 (ja) | 2020-08-24 | 2021-07-13 | 金属充填微細構造体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022044585A1 true JPWO2022044585A1 (https=) | 2022-03-03 |
| JPWO2022044585A5 JPWO2022044585A5 (https=) | 2023-04-27 |
| JP7506753B2 JP7506753B2 (ja) | 2024-06-26 |
Family
ID=80353165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022545520A Active JP7506753B2 (ja) | 2020-08-24 | 2021-07-13 | 金属充填微細構造体の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7506753B2 (https=) |
| KR (1) | KR102723699B1 (https=) |
| CN (1) | CN115956144B (https=) |
| TW (1) | TW202208695A (https=) |
| WO (1) | WO2022044585A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021033467A1 (ja) * | 2019-08-16 | 2021-02-25 | 富士フイルム株式会社 | 構造体の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011090865A (ja) * | 2009-10-22 | 2011-05-06 | Shinko Electric Ind Co Ltd | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 |
| WO2017057150A1 (ja) * | 2015-09-29 | 2017-04-06 | 富士フイルム株式会社 | 金属充填微細構造体の製造方法 |
| WO2018037805A1 (ja) * | 2016-08-24 | 2018-03-01 | 富士フイルム株式会社 | 保管方法 |
| WO2019039071A1 (ja) * | 2017-08-25 | 2019-02-28 | 富士フイルム株式会社 | 構造体、構造体の製造方法、積層体および半導体パッケージ |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019065095A1 (ja) * | 2017-09-26 | 2019-04-04 | 富士フイルム株式会社 | 金属充填微細構造体の製造方法および絶縁性基材 |
-
2021
- 2021-07-13 KR KR1020237006062A patent/KR102723699B1/ko active Active
- 2021-07-13 JP JP2022545520A patent/JP7506753B2/ja active Active
- 2021-07-13 WO PCT/JP2021/026287 patent/WO2022044585A1/ja not_active Ceased
- 2021-07-13 CN CN202180050316.XA patent/CN115956144B/zh active Active
- 2021-08-09 TW TW110129211A patent/TW202208695A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011090865A (ja) * | 2009-10-22 | 2011-05-06 | Shinko Electric Ind Co Ltd | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 |
| WO2017057150A1 (ja) * | 2015-09-29 | 2017-04-06 | 富士フイルム株式会社 | 金属充填微細構造体の製造方法 |
| WO2018037805A1 (ja) * | 2016-08-24 | 2018-03-01 | 富士フイルム株式会社 | 保管方法 |
| WO2019039071A1 (ja) * | 2017-08-25 | 2019-02-28 | 富士フイルム株式会社 | 構造体、構造体の製造方法、積層体および半導体パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115956144B (zh) | 2025-07-18 |
| KR102723699B1 (ko) | 2024-10-30 |
| JP7506753B2 (ja) | 2024-06-26 |
| TW202208695A (zh) | 2022-03-01 |
| CN115956144A (zh) | 2023-04-11 |
| KR20230043153A (ko) | 2023-03-30 |
| WO2022044585A1 (ja) | 2022-03-03 |
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