CN115956144B - 金属填充微细结构体的制造方法 - Google Patents

金属填充微细结构体的制造方法

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Publication number
CN115956144B
CN115956144B CN202180050316.XA CN202180050316A CN115956144B CN 115956144 B CN115956144 B CN 115956144B CN 202180050316 A CN202180050316 A CN 202180050316A CN 115956144 B CN115956144 B CN 115956144B
Authority
CN
China
Prior art keywords
metal
insulating film
resin layer
filled microstructure
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180050316.XA
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English (en)
Chinese (zh)
Other versions
CN115956144A (zh
Inventor
川口顺二
堀田吉则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN115956144A publication Critical patent/CN115956144A/zh
Application granted granted Critical
Publication of CN115956144B publication Critical patent/CN115956144B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/20—Electrolytic after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/26—Anodisation of refractory metals or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN202180050316.XA 2020-08-24 2021-07-13 金属填充微细结构体的制造方法 Active CN115956144B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020140860 2020-08-24
JP2020-140860 2020-08-24
PCT/JP2021/026287 WO2022044585A1 (ja) 2020-08-24 2021-07-13 金属充填微細構造体の製造方法

Publications (2)

Publication Number Publication Date
CN115956144A CN115956144A (zh) 2023-04-11
CN115956144B true CN115956144B (zh) 2025-07-18

Family

ID=80353165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180050316.XA Active CN115956144B (zh) 2020-08-24 2021-07-13 金属填充微细结构体的制造方法

Country Status (5)

Country Link
JP (1) JP7506753B2 (https=)
KR (1) KR102723699B1 (https=)
CN (1) CN115956144B (https=)
TW (1) TW202208695A (https=)
WO (1) WO2022044585A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021033467A1 (ja) * 2019-08-16 2021-02-25 富士フイルム株式会社 構造体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017057150A1 (ja) * 2015-09-29 2017-04-06 富士フイルム株式会社 金属充填微細構造体の製造方法
WO2018037805A1 (ja) * 2016-08-24 2018-03-01 富士フイルム株式会社 保管方法
WO2019039071A1 (ja) * 2017-08-25 2019-02-28 富士フイルム株式会社 構造体、構造体の製造方法、積層体および半導体パッケージ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011090865A (ja) * 2009-10-22 2011-05-06 Shinko Electric Ind Co Ltd 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法
WO2019065095A1 (ja) * 2017-09-26 2019-04-04 富士フイルム株式会社 金属充填微細構造体の製造方法および絶縁性基材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017057150A1 (ja) * 2015-09-29 2017-04-06 富士フイルム株式会社 金属充填微細構造体の製造方法
WO2018037805A1 (ja) * 2016-08-24 2018-03-01 富士フイルム株式会社 保管方法
WO2019039071A1 (ja) * 2017-08-25 2019-02-28 富士フイルム株式会社 構造体、構造体の製造方法、積層体および半導体パッケージ

Also Published As

Publication number Publication date
KR102723699B1 (ko) 2024-10-30
JP7506753B2 (ja) 2024-06-26
TW202208695A (zh) 2022-03-01
CN115956144A (zh) 2023-04-11
KR20230043153A (ko) 2023-03-30
WO2022044585A1 (ja) 2022-03-03
JPWO2022044585A1 (https=) 2022-03-03

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