JPWO2022024757A5 - - Google Patents
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- Publication number
- JPWO2022024757A5 JPWO2022024757A5 JP2022506844A JP2022506844A JPWO2022024757A5 JP WO2022024757 A5 JPWO2022024757 A5 JP WO2022024757A5 JP 2022506844 A JP2022506844 A JP 2022506844A JP 2022506844 A JP2022506844 A JP 2022506844A JP WO2022024757 A5 JPWO2022024757 A5 JP WO2022024757A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- metal particles
- film portion
- adhesive
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 26
- 230000001070 adhesive effect Effects 0.000 claims 26
- 239000002923 metal particle Substances 0.000 claims 14
- 239000010408 film Substances 0.000 claims 6
- 239000011241 protective layer Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- 230000003014 reinforcing effect Effects 0.000 claims 5
- 239000010409 thin film Substances 0.000 claims 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 230000008018 melting Effects 0.000 claims 4
- 238000002844 melting Methods 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020130313 | 2020-07-31 | ||
| JP2020130313 | 2020-07-31 | ||
| PCT/JP2021/026413 WO2022024757A1 (ja) | 2020-07-31 | 2021-07-14 | 導電性接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022024757A1 JPWO2022024757A1 (https=) | 2022-02-03 |
| JP7037004B1 JP7037004B1 (ja) | 2022-03-15 |
| JPWO2022024757A5 true JPWO2022024757A5 (https=) | 2022-07-12 |
Family
ID=80036314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022506844A Active JP7037004B1 (ja) | 2020-07-31 | 2021-07-14 | 導電性接着剤 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11597858B1 (https=) |
| JP (1) | JP7037004B1 (https=) |
| KR (1) | KR102823854B1 (https=) |
| CN (1) | CN114830843B (https=) |
| TW (1) | TWI859458B (https=) |
| WO (1) | WO2022024757A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240168301A (ko) * | 2022-03-24 | 2024-11-29 | 타츠타 전선 주식회사 | 열전도성 도전층 |
| TW202415715A (zh) | 2022-09-30 | 2024-04-16 | 日商拓自達電線股份有限公司 | 導電性接著劑層 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3561748B2 (ja) * | 1994-10-14 | 2004-09-02 | 綜研化学株式会社 | 異方導電性接着剤 |
| JP4107769B2 (ja) * | 1999-07-15 | 2008-06-25 | 信越ポリマー株式会社 | 異方導電性接着剤用導電性付与粒子及びこれを用いた異方導電性接着剤 |
| JP4828151B2 (ja) * | 2005-04-15 | 2011-11-30 | タツタ電線株式会社 | 導電性接着シート及び回路基板 |
| JP4825830B2 (ja) * | 2008-03-11 | 2011-11-30 | 住友電気工業株式会社 | 金属補強板を備えたフレキシブルプリント配線板 |
| JP5395854B2 (ja) | 2011-08-11 | 2014-01-22 | タツタ電線株式会社 | プリント配線板及びプリント配線板の製造方法 |
| TWI704196B (zh) * | 2016-03-29 | 2020-09-11 | 日商拓自達電線股份有限公司 | 導電性塗料及使用其之屏蔽封裝體之製造方法 |
| TWI770013B (zh) * | 2016-03-29 | 2022-07-11 | 日商拓自達電線股份有限公司 | 導電性塗料及使用其之屏蔽封裝體之製造方法 |
| WO2019013231A1 (ja) * | 2017-07-11 | 2019-01-17 | 田中貴金属工業株式会社 | 導電性接着剤組成物 |
| CN112313032A (zh) * | 2018-06-26 | 2021-02-02 | 昭和电工材料株式会社 | 各向异性导电膜及其制造方法以及连接结构体的制造方法 |
| TWI796476B (zh) * | 2018-10-22 | 2023-03-21 | 日商拓自達電線股份有限公司 | 導電性接著片 |
-
2021
- 2021-07-14 WO PCT/JP2021/026413 patent/WO2022024757A1/ja not_active Ceased
- 2021-07-14 KR KR1020237001080A patent/KR102823854B1/ko active Active
- 2021-07-14 JP JP2022506844A patent/JP7037004B1/ja active Active
- 2021-07-14 CN CN202180007266.7A patent/CN114830843B/zh active Active
- 2021-07-14 US US17/783,918 patent/US11597858B1/en active Active
- 2021-07-20 TW TW110126625A patent/TWI859458B/zh active
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