CN114830843B - 导电性胶粘剂 - Google Patents

导电性胶粘剂 Download PDF

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Publication number
CN114830843B
CN114830843B CN202180007266.7A CN202180007266A CN114830843B CN 114830843 B CN114830843 B CN 114830843B CN 202180007266 A CN202180007266 A CN 202180007266A CN 114830843 B CN114830843 B CN 114830843B
Authority
CN
China
Prior art keywords
conductive adhesive
metal particles
adhesive
particles
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180007266.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN114830843A (zh
Inventor
春名裕介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of CN114830843A publication Critical patent/CN114830843A/zh
Application granted granted Critical
Publication of CN114830843B publication Critical patent/CN114830843B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202180007266.7A 2020-07-31 2021-07-14 导电性胶粘剂 Active CN114830843B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-130313 2020-07-31
JP2020130313 2020-07-31
PCT/JP2021/026413 WO2022024757A1 (ja) 2020-07-31 2021-07-14 導電性接着剤

Publications (2)

Publication Number Publication Date
CN114830843A CN114830843A (zh) 2022-07-29
CN114830843B true CN114830843B (zh) 2024-06-18

Family

ID=80036314

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180007266.7A Active CN114830843B (zh) 2020-07-31 2021-07-14 导电性胶粘剂

Country Status (6)

Country Link
US (1) US11597858B1 (https=)
JP (1) JP7037004B1 (https=)
KR (1) KR102823854B1 (https=)
CN (1) CN114830843B (https=)
TW (1) TWI859458B (https=)
WO (1) WO2022024757A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240168301A (ko) * 2022-03-24 2024-11-29 타츠타 전선 주식회사 열전도성 도전층
TW202415715A (zh) 2022-09-30 2024-04-16 日商拓自達電線股份有限公司 導電性接著劑層

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3561748B2 (ja) * 1994-10-14 2004-09-02 綜研化学株式会社 異方導電性接着剤
JP4107769B2 (ja) * 1999-07-15 2008-06-25 信越ポリマー株式会社 異方導電性接着剤用導電性付与粒子及びこれを用いた異方導電性接着剤
JP4825830B2 (ja) * 2008-03-11 2011-11-30 住友電気工業株式会社 金属補強板を備えたフレキシブルプリント配線板
JP5395854B2 (ja) 2011-08-11 2014-01-22 タツタ電線株式会社 プリント配線板及びプリント配線板の製造方法
TWI704196B (zh) * 2016-03-29 2020-09-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
TWI770013B (zh) * 2016-03-29 2022-07-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
WO2019013231A1 (ja) * 2017-07-11 2019-01-17 田中貴金属工業株式会社 導電性接着剤組成物
CN112313032A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 各向异性导电膜及其制造方法以及连接结构体的制造方法
TWI796476B (zh) * 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板

Also Published As

Publication number Publication date
TW202208575A (zh) 2022-03-01
US20230048469A1 (en) 2023-02-16
JP7037004B1 (ja) 2022-03-15
TWI859458B (zh) 2024-10-21
KR20230043820A (ko) 2023-03-31
JPWO2022024757A1 (https=) 2022-02-03
US11597858B1 (en) 2023-03-07
WO2022024757A1 (ja) 2022-02-03
KR102823854B1 (ko) 2025-06-20
CN114830843A (zh) 2022-07-29

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