TWI859458B - 導電性接著劑 - Google Patents

導電性接著劑 Download PDF

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Publication number
TWI859458B
TWI859458B TW110126625A TW110126625A TWI859458B TW I859458 B TWI859458 B TW I859458B TW 110126625 A TW110126625 A TW 110126625A TW 110126625 A TW110126625 A TW 110126625A TW I859458 B TWI859458 B TW I859458B
Authority
TW
Taiwan
Prior art keywords
metal particles
conductive adhesive
adhesive
particles
printed wiring
Prior art date
Application number
TW110126625A
Other languages
English (en)
Chinese (zh)
Other versions
TW202208575A (zh
Inventor
春名裕介
Original Assignee
日商拓自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW202208575A publication Critical patent/TW202208575A/zh
Application granted granted Critical
Publication of TWI859458B publication Critical patent/TWI859458B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW110126625A 2020-07-31 2021-07-20 導電性接著劑 TWI859458B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-130313 2020-07-31
JP2020130313 2020-07-31

Publications (2)

Publication Number Publication Date
TW202208575A TW202208575A (zh) 2022-03-01
TWI859458B true TWI859458B (zh) 2024-10-21

Family

ID=80036314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110126625A TWI859458B (zh) 2020-07-31 2021-07-20 導電性接著劑

Country Status (6)

Country Link
US (1) US11597858B1 (https=)
JP (1) JP7037004B1 (https=)
KR (1) KR102823854B1 (https=)
CN (1) CN114830843B (https=)
TW (1) TWI859458B (https=)
WO (1) WO2022024757A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240168301A (ko) * 2022-03-24 2024-11-29 타츠타 전선 주식회사 열전도성 도전층
TW202415715A (zh) 2022-09-30 2024-04-16 日商拓自達電線股份有限公司 導電性接著劑層

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板
TW202006750A (zh) * 2018-06-26 2020-02-01 日商日立化成股份有限公司 各向異性導電膜及其製造方法以及連接結構體的製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3561748B2 (ja) * 1994-10-14 2004-09-02 綜研化学株式会社 異方導電性接着剤
JP4107769B2 (ja) * 1999-07-15 2008-06-25 信越ポリマー株式会社 異方導電性接着剤用導電性付与粒子及びこれを用いた異方導電性接着剤
JP4825830B2 (ja) * 2008-03-11 2011-11-30 住友電気工業株式会社 金属補強板を備えたフレキシブルプリント配線板
JP5395854B2 (ja) 2011-08-11 2014-01-22 タツタ電線株式会社 プリント配線板及びプリント配線板の製造方法
TWI704196B (zh) * 2016-03-29 2020-09-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
TWI770013B (zh) * 2016-03-29 2022-07-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
WO2019013231A1 (ja) * 2017-07-11 2019-01-17 田中貴金属工業株式会社 導電性接着剤組成物
TWI796476B (zh) * 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板
TW202006750A (zh) * 2018-06-26 2020-02-01 日商日立化成股份有限公司 各向異性導電膜及其製造方法以及連接結構體的製造方法

Also Published As

Publication number Publication date
TW202208575A (zh) 2022-03-01
US20230048469A1 (en) 2023-02-16
JP7037004B1 (ja) 2022-03-15
KR20230043820A (ko) 2023-03-31
JPWO2022024757A1 (https=) 2022-02-03
US11597858B1 (en) 2023-03-07
WO2022024757A1 (ja) 2022-02-03
KR102823854B1 (ko) 2025-06-20
CN114830843B (zh) 2024-06-18
CN114830843A (zh) 2022-07-29

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