KR102823854B1 - 도전성 접착제 - Google Patents

도전성 접착제 Download PDF

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Publication number
KR102823854B1
KR102823854B1 KR1020237001080A KR20237001080A KR102823854B1 KR 102823854 B1 KR102823854 B1 KR 102823854B1 KR 1020237001080 A KR1020237001080 A KR 1020237001080A KR 20237001080 A KR20237001080 A KR 20237001080A KR 102823854 B1 KR102823854 B1 KR 102823854B1
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KR
South Korea
Prior art keywords
metal particles
adhesive
conductive adhesive
particles
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237001080A
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English (en)
Korean (ko)
Other versions
KR20230043820A (ko
Inventor
유스케 하루나
Original Assignee
타츠타 전선 주식회사
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Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20230043820A publication Critical patent/KR20230043820A/ko
Application granted granted Critical
Publication of KR102823854B1 publication Critical patent/KR102823854B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020237001080A 2020-07-31 2021-07-14 도전성 접착제 Active KR102823854B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020130313 2020-07-31
JPJP-P-2020-130313 2020-07-31
PCT/JP2021/026413 WO2022024757A1 (ja) 2020-07-31 2021-07-14 導電性接着剤

Publications (2)

Publication Number Publication Date
KR20230043820A KR20230043820A (ko) 2023-03-31
KR102823854B1 true KR102823854B1 (ko) 2025-06-20

Family

ID=80036314

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237001080A Active KR102823854B1 (ko) 2020-07-31 2021-07-14 도전성 접착제

Country Status (6)

Country Link
US (1) US11597858B1 (https=)
JP (1) JP7037004B1 (https=)
KR (1) KR102823854B1 (https=)
CN (1) CN114830843B (https=)
TW (1) TWI859458B (https=)
WO (1) WO2022024757A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240168301A (ko) * 2022-03-24 2024-11-29 타츠타 전선 주식회사 열전도성 도전층
TW202415715A (zh) 2022-09-30 2024-04-16 日商拓自達電線股份有限公司 導電性接著劑層

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035248A (ja) * 1999-07-15 2001-02-09 Shin Etsu Polymer Co Ltd 導電性付与粒子及びこれを用いた異方導電性接着剤
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3561748B2 (ja) * 1994-10-14 2004-09-02 綜研化学株式会社 異方導電性接着剤
JP4825830B2 (ja) * 2008-03-11 2011-11-30 住友電気工業株式会社 金属補強板を備えたフレキシブルプリント配線板
JP5395854B2 (ja) 2011-08-11 2014-01-22 タツタ電線株式会社 プリント配線板及びプリント配線板の製造方法
TWI704196B (zh) * 2016-03-29 2020-09-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
TWI770013B (zh) * 2016-03-29 2022-07-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
WO2019013231A1 (ja) * 2017-07-11 2019-01-17 田中貴金属工業株式会社 導電性接着剤組成物
CN112313032A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 各向异性导电膜及其制造方法以及连接结构体的制造方法
TWI796476B (zh) * 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035248A (ja) * 1999-07-15 2001-02-09 Shin Etsu Polymer Co Ltd 導電性付与粒子及びこれを用いた異方導電性接着剤
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板

Also Published As

Publication number Publication date
TW202208575A (zh) 2022-03-01
US20230048469A1 (en) 2023-02-16
JP7037004B1 (ja) 2022-03-15
TWI859458B (zh) 2024-10-21
KR20230043820A (ko) 2023-03-31
JPWO2022024757A1 (https=) 2022-02-03
US11597858B1 (en) 2023-03-07
WO2022024757A1 (ja) 2022-02-03
CN114830843B (zh) 2024-06-18
CN114830843A (zh) 2022-07-29

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