JPWO2022009582A5 - - Google Patents

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Publication number
JPWO2022009582A5
JPWO2022009582A5 JP2022534960A JP2022534960A JPWO2022009582A5 JP WO2022009582 A5 JPWO2022009582 A5 JP WO2022009582A5 JP 2022534960 A JP2022534960 A JP 2022534960A JP 2022534960 A JP2022534960 A JP 2022534960A JP WO2022009582 A5 JPWO2022009582 A5 JP WO2022009582A5
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JP
Japan
Prior art keywords
wiring member
module according
semiconductor element
semiconductor module
plan
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JP2022534960A
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English (en)
Japanese (ja)
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JPWO2022009582A1 (https=
JP7294540B2 (ja
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Priority claimed from PCT/JP2021/021617 external-priority patent/WO2022009582A1/ja
Publication of JPWO2022009582A1 publication Critical patent/JPWO2022009582A1/ja
Publication of JPWO2022009582A5 publication Critical patent/JPWO2022009582A5/ja
Application granted granted Critical
Publication of JP7294540B2 publication Critical patent/JP7294540B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022534960A 2020-07-07 2021-06-07 半導体モジュール Active JP7294540B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020117233 2020-07-07
JP2020117233 2020-07-07
PCT/JP2021/021617 WO2022009582A1 (ja) 2020-07-07 2021-06-07 半導体モジュール

Publications (3)

Publication Number Publication Date
JPWO2022009582A1 JPWO2022009582A1 (https=) 2022-01-13
JPWO2022009582A5 true JPWO2022009582A5 (https=) 2022-08-18
JP7294540B2 JP7294540B2 (ja) 2023-06-20

Family

ID=79552410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022534960A Active JP7294540B2 (ja) 2020-07-07 2021-06-07 半導体モジュール

Country Status (5)

Country Link
US (2) US12424583B2 (https=)
JP (1) JP7294540B2 (https=)
CN (1) CN114902407A (https=)
DE (1) DE112021000198T5 (https=)
WO (1) WO2022009582A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3253808B2 (ja) * 1994-07-07 2002-02-04 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JPH1032218A (ja) 1996-07-16 1998-02-03 Mitsubishi Electric Corp 半導体装置
US5767567A (en) * 1996-09-10 1998-06-16 Magemos Corporation Design of device layout for integration with power mosfet packaging to achieve better lead wire connections and lower on resistance
US20020024134A1 (en) 2000-08-28 2002-02-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2006066704A (ja) 2004-08-27 2006-03-09 Toyota Motor Corp 半導体装置
JP2010016103A (ja) 2008-07-02 2010-01-21 Panasonic Corp 半導体装置
EP2966683B1 (en) * 2013-10-04 2020-12-09 Fuji Electric Co., Ltd. Semiconductor device
JP6686398B2 (ja) * 2015-12-03 2020-04-22 富士電機株式会社 半導体装置
JP6830767B2 (ja) * 2016-06-14 2021-02-17 株式会社デンソー 半導体装置
JP6805776B2 (ja) * 2016-12-09 2020-12-23 富士電機株式会社 半導体装置
WO2018225571A1 (ja) 2017-06-09 2018-12-13 富士電機株式会社 半導体装置および半導体装置の製造方法
CN111033751B (zh) * 2018-02-14 2023-08-18 富士电机株式会社 半导体装置
CN110323273B (zh) * 2018-03-30 2025-02-25 富士电机株式会社 半导体装置、半导体封装、半导体模块及半导体电路装置
JP7060104B2 (ja) * 2018-09-20 2022-04-26 富士電機株式会社 半導体装置
JP7326750B2 (ja) 2019-01-18 2023-08-16 大日本印刷株式会社 包装体

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