JPWO2021210402A5 - - Google Patents
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- Publication number
- JPWO2021210402A5 JPWO2021210402A5 JP2022515296A JP2022515296A JPWO2021210402A5 JP WO2021210402 A5 JPWO2021210402 A5 JP WO2021210402A5 JP 2022515296 A JP2022515296 A JP 2022515296A JP 2022515296 A JP2022515296 A JP 2022515296A JP WO2021210402 A5 JPWO2021210402 A5 JP WO2021210402A5
- Authority
- JP
- Japan
- Prior art keywords
- joint
- parallel connection
- connection portion
- main surface
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020074232 | 2020-04-17 | ||
| PCT/JP2021/013848 WO2021210402A1 (ja) | 2020-04-17 | 2021-03-31 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021210402A1 JPWO2021210402A1 (https=) | 2021-10-21 |
| JPWO2021210402A5 true JPWO2021210402A5 (https=) | 2023-01-04 |
Family
ID=78084201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022515296A Pending JPWO2021210402A1 (https=) | 2020-04-17 | 2021-03-31 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12463118B2 (https=) |
| JP (1) | JPWO2021210402A1 (https=) |
| CN (1) | CN115380378A (https=) |
| DE (2) | DE212021000245U1 (https=) |
| WO (1) | WO2021210402A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE212021000219U1 (de) * | 2020-04-01 | 2022-03-03 | Rohm Co., Ltd. | Elektronische Vorrichtung |
| CN116686086A (zh) * | 2021-02-03 | 2023-09-01 | 罗姆股份有限公司 | 半导体装置 |
| USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
| USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| JPWO2023106151A1 (https=) * | 2021-12-10 | 2023-06-15 | ||
| CN118402064A (zh) * | 2021-12-17 | 2024-07-26 | 罗姆股份有限公司 | 电子装置 |
| US20230361087A1 (en) | 2022-05-04 | 2023-11-09 | Infineon Technologies Ag | Molded power semiconductor package |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2776462B1 (fr) * | 1998-03-19 | 2000-05-19 | Schneider Electric Sa | Module de composants electroniques de puissance |
| JP3846699B2 (ja) * | 2001-10-10 | 2006-11-15 | 富士電機ホールディングス株式会社 | 半導体パワーモジュールおよびその製造方法 |
| JP5018702B2 (ja) | 2008-08-28 | 2012-09-05 | トヨタ自動車株式会社 | 半導体装置 |
| JP6070955B2 (ja) | 2011-09-30 | 2017-02-01 | ローム株式会社 | 半導体装置 |
| JP5909396B2 (ja) * | 2012-03-26 | 2016-04-26 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置 |
| EP3343741A4 (en) | 2015-08-28 | 2018-08-29 | Shindengen Electric Manufacturing Co., Ltd. | Power conversion device and semiconductor device |
| CN105207449B (zh) * | 2015-09-29 | 2019-01-29 | 广东美的制冷设备有限公司 | 智能功率模块 |
| US10217690B2 (en) * | 2015-11-30 | 2019-02-26 | Kabushiki Kaisha Toshiba | Semiconductor module that have multiple paths for heat dissipation |
| US10580754B2 (en) | 2016-04-01 | 2020-03-03 | Mitsubishi Electric Corporation | Semiconductor module with temperature detecting element |
| JP6673118B2 (ja) | 2016-09-23 | 2020-03-25 | 株式会社デンソー | 半導体装置 |
| JP6790684B2 (ja) * | 2016-09-30 | 2020-11-25 | 富士電機株式会社 | 半導体装置 |
-
2021
- 2021-03-31 CN CN202180027704.6A patent/CN115380378A/zh active Pending
- 2021-03-31 DE DE212021000245.5U patent/DE212021000245U1/de active Active
- 2021-03-31 US US17/918,287 patent/US12463118B2/en active Active
- 2021-03-31 WO PCT/JP2021/013848 patent/WO2021210402A1/ja not_active Ceased
- 2021-03-31 DE DE112021001035.2T patent/DE112021001035B4/de active Active
- 2021-03-31 JP JP2022515296A patent/JPWO2021210402A1/ja active Pending
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