JPWO2022168618A1 - - Google Patents

Info

Publication number
JPWO2022168618A1
JPWO2022168618A1 JP2022579433A JP2022579433A JPWO2022168618A1 JP WO2022168618 A1 JPWO2022168618 A1 JP WO2022168618A1 JP 2022579433 A JP2022579433 A JP 2022579433A JP 2022579433 A JP2022579433 A JP 2022579433A JP WO2022168618 A1 JPWO2022168618 A1 JP WO2022168618A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022579433A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022168618A1 publication Critical patent/JPWO2022168618A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07355—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H10W72/3528—Intermetallic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP2022579433A 2021-02-03 2022-01-20 Pending JPWO2022168618A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021015729 2021-02-03
PCT/JP2022/001961 WO2022168618A1 (ja) 2021-02-03 2022-01-20 半導体装置

Publications (1)

Publication Number Publication Date
JPWO2022168618A1 true JPWO2022168618A1 (https=) 2022-08-11

Family

ID=82741446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022579433A Pending JPWO2022168618A1 (https=) 2021-02-03 2022-01-20

Country Status (5)

Country Link
US (1) US20240071875A1 (https=)
JP (1) JPWO2022168618A1 (https=)
CN (1) CN116686086A (https=)
DE (1) DE112022000361T5 (https=)
WO (1) WO2022168618A1 (https=)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304239A (ja) * 1992-04-27 1993-11-16 Kyocera Corp 半導体素子収納用パッケージ
JPH09312368A (ja) * 1996-05-22 1997-12-02 Hitachi Ltd 半導体装置の製造方法およびそれに使用されるリードフレーム
JP2002314030A (ja) * 2001-04-12 2002-10-25 Mitsubishi Electric Corp 半導体装置
JP2004146577A (ja) * 2002-10-24 2004-05-20 Renesas Technology Corp 半導体装置およびその製造方法
JP2004349397A (ja) * 2003-05-21 2004-12-09 Sharp Corp 半導体装置およびそれに用いられるリードフレーム
JP2007305671A (ja) * 2006-05-09 2007-11-22 Matsushita Electric Ind Co Ltd リードフレーム及びそれを用いた半導体装置
JP3146231U (ja) * 2008-08-28 2008-11-06 サンケン電気株式会社 リードフレームおよび半導体装置
JP2014207430A (ja) * 2013-03-21 2014-10-30 ローム株式会社 半導体装置
JP2014216459A (ja) * 2013-04-25 2014-11-17 三菱電機株式会社 半導体装置
JP2015106609A (ja) * 2013-11-29 2015-06-08 サンケン電気株式会社 半導体装置
JP2016072417A (ja) * 2014-09-30 2016-05-09 ルネサスエレクトロニクス株式会社 半導体装置
JP2018116995A (ja) * 2017-01-17 2018-07-26 三菱マテリアル株式会社 パワーモジュールの製造方法
WO2019167284A1 (ja) * 2018-03-02 2019-09-06 新電元工業株式会社 樹脂封止型半導体装置
WO2020012957A1 (ja) * 2018-07-12 2020-01-16 ローム株式会社 半導体装置
JP2020102523A (ja) * 2018-12-21 2020-07-02 トヨタ自動車株式会社 半導体モジュール製造方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4426955B2 (ja) * 2004-11-30 2010-03-03 株式会社ルネサステクノロジ 半導体装置
US7683477B2 (en) * 2007-06-26 2010-03-23 Infineon Technologies Ag Semiconductor device including semiconductor chips having contact elements
JP4924411B2 (ja) 2007-12-27 2012-04-25 三菱電機株式会社 電力半導体装置
US8030743B2 (en) * 2008-01-07 2011-10-04 Fairchild Semiconductor Corporation Semiconductor package with an embedded printed circuit board and stacked die
JP4634498B2 (ja) * 2008-11-28 2011-02-16 三菱電機株式会社 電力用半導体モジュール
JP5793995B2 (ja) * 2011-06-28 2015-10-14 トヨタ自動車株式会社 リードフレーム、及び、パワーモジュール
JP2013258387A (ja) * 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置
DE112014002405T5 (de) * 2013-05-16 2016-05-19 Fuji Electric Co., Ltd Halbleitervorrichtung
JP2015220429A (ja) * 2014-05-21 2015-12-07 ローム株式会社 半導体装置
FR3025691B1 (fr) * 2014-09-08 2016-10-07 Schneider Electric Ind Sas Module electronique haute puissance et procede de fabrication d'un tel module
JP6263108B2 (ja) * 2014-09-11 2018-01-17 株式会社日立製作所 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置
KR102178865B1 (ko) * 2015-02-25 2020-11-18 한국전자통신연구원 고속 스위칭 성능을 갖는 캐스코드 타입의 스위치 회로
US9972569B2 (en) * 2016-04-12 2018-05-15 General Electric Company Robust low inductance power module package
JP6832094B2 (ja) * 2016-08-05 2021-02-24 ローム株式会社 パワーモジュール及びモータ駆動回路
JP6689708B2 (ja) * 2016-08-10 2020-04-28 ルネサスエレクトロニクス株式会社 電子装置
DE102016119485A1 (de) * 2016-10-12 2018-04-12 Infineon Technologies Ag Chipträger mit elektrisch leitfähiger Schicht, die sich über eine wärmeleitfähige dielektrische Sheet-Struktur hinaus erstreckt
US10600727B2 (en) * 2016-10-16 2020-03-24 Alpha And Omega Semiconductor (Cayman) Ltd. Molded intelligent power module for motors
JP2018170362A (ja) * 2017-03-29 2018-11-01 株式会社東芝 半導体モジュール
WO2018235329A1 (ja) * 2017-06-20 2018-12-27 住友電気工業株式会社 半導体装置
JP2019012767A (ja) * 2017-06-30 2019-01-24 ルネサスエレクトロニクス株式会社 半導体モジュールの製造方法および半導体モジュール
EP3499560B1 (en) * 2017-12-15 2021-08-18 Infineon Technologies AG Semiconductor module and method for producing the same
US10347571B1 (en) * 2018-01-09 2019-07-09 Macom Technology Solutions Holdings, Inc. Intra-package interference isolation
US10896869B2 (en) * 2018-01-12 2021-01-19 Amkor Technology Singapore Holding Pte. Ltd. Method of manufacturing a semiconductor device
JP6897869B2 (ja) * 2018-04-18 2021-07-07 三菱電機株式会社 半導体モジュール
JP7077893B2 (ja) * 2018-09-21 2022-05-31 株式会社デンソー 半導体装置
CN118213346A (zh) * 2018-10-24 2024-06-18 罗姆股份有限公司 半导体装置
JP7045975B2 (ja) * 2018-11-20 2022-04-01 三菱電機株式会社 半導体装置およびその製造方法、ならびに電力変換装置
JP6997340B2 (ja) * 2018-11-26 2022-01-17 三菱電機株式会社 半導体パッケージ、その製造方法、及び、半導体装置
JP7170614B2 (ja) * 2019-09-18 2022-11-14 株式会社東芝 半導体装置
JP7358921B2 (ja) * 2019-11-08 2023-10-11 富士電機株式会社 半導体モジュール及び半導体モジュールの製造方法
KR102703392B1 (ko) * 2019-11-25 2024-09-04 현대자동차주식회사 전력모듈 및 전력모듈에 적용되는 기판 구조
JP7729024B2 (ja) * 2020-03-12 2025-08-26 富士電機株式会社 半導体装置の製造方法及び半導体装置
JP7332528B2 (ja) * 2020-04-17 2023-08-23 三菱電機株式会社 半導体装置および半導体装置の製造方法
CN115380378A (zh) * 2020-04-17 2022-11-22 罗姆股份有限公司 半导体装置
CN115552602A (zh) * 2020-04-22 2022-12-30 罗姆股份有限公司 半导体装置

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304239A (ja) * 1992-04-27 1993-11-16 Kyocera Corp 半導体素子収納用パッケージ
JPH09312368A (ja) * 1996-05-22 1997-12-02 Hitachi Ltd 半導体装置の製造方法およびそれに使用されるリードフレーム
JP2002314030A (ja) * 2001-04-12 2002-10-25 Mitsubishi Electric Corp 半導体装置
JP2004146577A (ja) * 2002-10-24 2004-05-20 Renesas Technology Corp 半導体装置およびその製造方法
JP2004349397A (ja) * 2003-05-21 2004-12-09 Sharp Corp 半導体装置およびそれに用いられるリードフレーム
JP2007305671A (ja) * 2006-05-09 2007-11-22 Matsushita Electric Ind Co Ltd リードフレーム及びそれを用いた半導体装置
JP3146231U (ja) * 2008-08-28 2008-11-06 サンケン電気株式会社 リードフレームおよび半導体装置
JP2014207430A (ja) * 2013-03-21 2014-10-30 ローム株式会社 半導体装置
JP2014216459A (ja) * 2013-04-25 2014-11-17 三菱電機株式会社 半導体装置
JP2015106609A (ja) * 2013-11-29 2015-06-08 サンケン電気株式会社 半導体装置
JP2016072417A (ja) * 2014-09-30 2016-05-09 ルネサスエレクトロニクス株式会社 半導体装置
JP2018116995A (ja) * 2017-01-17 2018-07-26 三菱マテリアル株式会社 パワーモジュールの製造方法
WO2019167284A1 (ja) * 2018-03-02 2019-09-06 新電元工業株式会社 樹脂封止型半導体装置
WO2020012957A1 (ja) * 2018-07-12 2020-01-16 ローム株式会社 半導体装置
JP2020102523A (ja) * 2018-12-21 2020-07-02 トヨタ自動車株式会社 半導体モジュール製造方法

Also Published As

Publication number Publication date
CN116686086A (zh) 2023-09-01
US20240071875A1 (en) 2024-02-29
DE112022000361T5 (de) 2023-10-12
WO2022168618A1 (ja) 2022-08-11

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112021014123A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023004146A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR102020022030A2 (https=)
JPWO2022168618A1 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)
BR102021016375A2 (https=)
BR102021016200A2 (https=)
BR102021016176A2 (https=)
BR102021015566A2 (https=)
BR102021015450A8 (https=)
BR102021015220A2 (https=)
BR102021015247A2 (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20251007

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251128

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260120

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260313

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260421