FR3025691B1 - Module electronique haute puissance et procede de fabrication d'un tel module - Google Patents

Module electronique haute puissance et procede de fabrication d'un tel module

Info

Publication number
FR3025691B1
FR3025691B1 FR1458390A FR1458390A FR3025691B1 FR 3025691 B1 FR3025691 B1 FR 3025691B1 FR 1458390 A FR1458390 A FR 1458390A FR 1458390 A FR1458390 A FR 1458390A FR 3025691 B1 FR3025691 B1 FR 3025691B1
Authority
FR
France
Prior art keywords
module
manufacturing
high power
power electronic
electronic module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1458390A
Other languages
English (en)
Other versions
FR3025691A1 (fr
Inventor
Cong Martin Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schneider Electric Industries SAS
Original Assignee
Schneider Electric Industries SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schneider Electric Industries SAS filed Critical Schneider Electric Industries SAS
Priority to FR1458390A priority Critical patent/FR3025691B1/fr
Priority to EP15183186.4A priority patent/EP2993694B1/fr
Priority to US14/845,736 priority patent/US9907199B2/en
Priority to CN201510566300.0A priority patent/CN105405837B/zh
Publication of FR3025691A1 publication Critical patent/FR3025691A1/fr
Application granted granted Critical
Publication of FR3025691B1 publication Critical patent/FR3025691B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inverter Devices (AREA)
FR1458390A 2014-09-08 2014-09-08 Module electronique haute puissance et procede de fabrication d'un tel module Expired - Fee Related FR3025691B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1458390A FR3025691B1 (fr) 2014-09-08 2014-09-08 Module electronique haute puissance et procede de fabrication d'un tel module
EP15183186.4A EP2993694B1 (fr) 2014-09-08 2015-08-31 Module électronique haute puissance et procédé de fabrication d'un tel module
US14/845,736 US9907199B2 (en) 2014-09-08 2015-09-04 High-power electronic module and method for making such a module
CN201510566300.0A CN105405837B (zh) 2014-09-08 2015-09-08 高功率电子模块以及制造这样的模块的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1458390A FR3025691B1 (fr) 2014-09-08 2014-09-08 Module electronique haute puissance et procede de fabrication d'un tel module

Publications (2)

Publication Number Publication Date
FR3025691A1 FR3025691A1 (fr) 2016-03-11
FR3025691B1 true FR3025691B1 (fr) 2016-10-07

Family

ID=51897302

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1458390A Expired - Fee Related FR3025691B1 (fr) 2014-09-08 2014-09-08 Module electronique haute puissance et procede de fabrication d'un tel module

Country Status (4)

Country Link
US (1) US9907199B2 (fr)
EP (1) EP2993694B1 (fr)
CN (1) CN105405837B (fr)
FR (1) FR3025691B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3025691B1 (fr) * 2014-09-08 2016-10-07 Schneider Electric Ind Sas Module electronique haute puissance et procede de fabrication d'un tel module
JP6781021B2 (ja) * 2016-11-29 2020-11-04 モレックス エルエルシー 電子部品
FR3095778B1 (fr) 2019-05-06 2022-06-03 Safran Procede de fabrication d’un module electronique de puissance

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072240A (en) * 1998-10-16 2000-06-06 Denso Corporation Semiconductor chip package
US7045884B2 (en) * 2002-10-04 2006-05-16 International Rectifier Corporation Semiconductor device package
US7999369B2 (en) * 2006-08-29 2011-08-16 Denso Corporation Power electronic package having two substrates with multiple semiconductor chips and electronic components
US20110024896A1 (en) * 2008-07-07 2011-02-03 Mitsubishi Electric Corporation Power semiconductor device
US9041183B2 (en) * 2011-07-19 2015-05-26 Ut-Battelle, Llc Power module packaging with double sided planar interconnection and heat exchangers
DE112012003296B4 (de) * 2011-08-10 2020-03-05 Denso Corporation Halbleitermodul und Halbleitervorrichtung mit dem Halbleitermodul
FR3025691B1 (fr) * 2014-09-08 2016-10-07 Schneider Electric Ind Sas Module electronique haute puissance et procede de fabrication d'un tel module

Also Published As

Publication number Publication date
EP2993694A1 (fr) 2016-03-09
CN105405837A (zh) 2016-03-16
US9907199B2 (en) 2018-02-27
FR3025691A1 (fr) 2016-03-11
US20160073535A1 (en) 2016-03-10
CN105405837B (zh) 2019-06-25
EP2993694B1 (fr) 2018-02-28

Similar Documents

Publication Publication Date Title
PL3444889T3 (pl) Sposób wytwarzania modułu akumulatorowego
FR3043852B1 (fr) Dispositif laser et procede de fabrication d’un tel dispositif laser
FR2996054B1 (fr) Module electronique et procede connexe
FR3007573B1 (fr) Declencheur et procede de fabrication d'un tel declencheur
FR3025056B1 (fr) Dispositif laser et procede de fabrication d'un tel dispositif laser
KR102389859B9 (ko) 태양광 모듈 백시트 및 이의 제조방법
FR3009476B1 (fr) Module electronique et procede de fabrication de celui-ci
FR3032064B1 (fr) Dispositif optoelectronique et son procede de fabrication
FR3016266B1 (fr) Dispositif electronique de puissance a refroidissement ameliore
FR3023064B1 (fr) Dispositif photovoltaique et son procede de fabrication
FR3039706B1 (fr) Procede de fabrication d'un module photovoltaique ayant des pertes resistives faibles
TWI563613B (en) Method of manufacturing electronic package module and electronic package module manufactured by the same
FR2977944B1 (fr) Dispositif electronique et son procede de fabrication
FR3052595B1 (fr) Procede de fabrication d'un module photovoltaique
FR3023491B1 (fr) Volant de badminton et procede de fabrication d'un tel volant
FR3024283B1 (fr) Module photovoltaique comprenant une pluralite de cellules bifaciales et procede de fabrication d'un tel module
FR3025691B1 (fr) Module electronique haute puissance et procede de fabrication d'un tel module
DK3220421T3 (da) Fremgangsmåde til fremstilling af trykte fotovoltaiske moduler
FR3036918B1 (fr) Carte electronique et procede de fabrication associe
FR3061404B1 (fr) Procede de fabrication collective de modules electroniques hermetiques
FR3043376B1 (fr) Volant et procede de fabrication d'un tel volant.
FR3024591B1 (fr) Procede de fabrication d’un panneau photovoltaique
FR3043253B1 (fr) Procede de fabrication d'un module photovoltaique
FR3002813B1 (fr) Procede de fabrication d'un transistor mos a ailette
FR3040822B1 (fr) Procede de fabrication d'un dispositif a jonction electronique et dispositif associe

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20160311

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

ST Notification of lapse

Effective date: 20200910