JPWO2023112743A1 - - Google Patents
Info
- Publication number
- JPWO2023112743A1 JPWO2023112743A1 JP2023567704A JP2023567704A JPWO2023112743A1 JP WO2023112743 A1 JPWO2023112743 A1 JP WO2023112743A1 JP 2023567704 A JP2023567704 A JP 2023567704A JP 2023567704 A JP2023567704 A JP 2023567704A JP WO2023112743 A1 JPWO2023112743 A1 JP WO2023112743A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021205191 | 2021-12-17 | ||
| PCT/JP2022/044721 WO2023112743A1 (ja) | 2021-12-17 | 2022-12-05 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023112743A1 true JPWO2023112743A1 (https=) | 2023-06-22 |
| JPWO2023112743A5 JPWO2023112743A5 (https=) | 2024-08-29 |
Family
ID=86774610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023567704A Pending JPWO2023112743A1 (https=) | 2021-12-17 | 2022-12-05 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240332137A1 (https=) |
| JP (1) | JPWO2023112743A1 (https=) |
| CN (1) | CN118402064A (https=) |
| DE (1) | DE112022005341T5 (https=) |
| WO (1) | WO2023112743A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100306988B1 (ko) * | 1992-10-26 | 2001-12-15 | 윌리엄 비. 켐플러 | 장치패키지 |
| JPH06224353A (ja) * | 1993-01-21 | 1994-08-12 | Kokusai Electric Co Ltd | 電子部品の電極構造 |
| JPH1012790A (ja) * | 1996-06-24 | 1998-01-16 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| US6249041B1 (en) * | 1998-06-02 | 2001-06-19 | Siliconix Incorporated | IC chip package with directly connected leads |
| JP2006203048A (ja) * | 2005-01-21 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP5510746B2 (ja) | 2010-10-26 | 2014-06-04 | 株式会社デンソー | 電子装置 |
| DE212021000245U1 (de) * | 2020-04-17 | 2022-06-08 | Rohm Co., Ltd. | Halbleiterbauteil |
-
2022
- 2022-12-05 JP JP2023567704A patent/JPWO2023112743A1/ja active Pending
- 2022-12-05 CN CN202280082898.4A patent/CN118402064A/zh active Pending
- 2022-12-05 DE DE112022005341.0T patent/DE112022005341T5/de active Pending
- 2022-12-05 WO PCT/JP2022/044721 patent/WO2023112743A1/ja not_active Ceased
-
2024
- 2024-06-12 US US18/741,266 patent/US20240332137A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN118402064A (zh) | 2024-07-26 |
| WO2023112743A1 (ja) | 2023-06-22 |
| DE112022005341T5 (de) | 2024-08-22 |
| US20240332137A1 (en) | 2024-10-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240509 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251127 |