JPWO2021200197A5 - - Google Patents
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- Publication number
- JPWO2021200197A5 JPWO2021200197A5 JP2022511874A JP2022511874A JPWO2021200197A5 JP WO2021200197 A5 JPWO2021200197 A5 JP WO2021200197A5 JP 2022511874 A JP2022511874 A JP 2022511874A JP 2022511874 A JP2022511874 A JP 2022511874A JP WO2021200197 A5 JPWO2021200197 A5 JP WO2021200197A5
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- external electrode
- electrolytic capacitor
- electrically connected
- exterior body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 60
- 239000011888 foil Substances 0.000 claims description 44
- 239000007784 solid electrolyte Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 2
- 239000003792 electrolyte Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 20
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020064791 | 2020-03-31 | ||
| JP2020183105 | 2020-10-30 | ||
| PCT/JP2021/011000 WO2021200197A1 (ja) | 2020-03-31 | 2021-03-18 | 電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021200197A1 JPWO2021200197A1 (https=) | 2021-10-07 |
| JPWO2021200197A5 true JPWO2021200197A5 (https=) | 2022-12-13 |
Family
ID=77928684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022511874A Pending JPWO2021200197A1 (https=) | 2020-03-31 | 2021-03-18 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12374505B2 (https=) |
| JP (1) | JPWO2021200197A1 (https=) |
| CN (1) | CN115335935A (https=) |
| WO (1) | WO2021200197A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118742986A (zh) * | 2022-03-15 | 2024-10-01 | 松下知识产权经营株式会社 | 电容器和电源模块 |
| WO2026058571A1 (ja) * | 2024-09-11 | 2026-03-19 | 株式会社村田製作所 | 固体電解コンデンサおよび固体電解コンデンサの製造方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830121A (ja) * | 1981-08-14 | 1983-02-22 | 日本電気株式会社 | 有極性チツプ型電子部品 |
| JPH04367212A (ja) * | 1991-06-14 | 1992-12-18 | Nec Corp | チップ型固体電解コンデンサの製造方法 |
| JP3199871B2 (ja) * | 1992-09-30 | 2001-08-20 | ニチコン株式会社 | チップ型固体電解コンデンサ |
| JPH07226342A (ja) * | 1994-02-09 | 1995-08-22 | Matsushita Electric Ind Co Ltd | チップ状固体電解コンデンサ |
| US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
| US6292350B1 (en) * | 1997-11-10 | 2001-09-18 | Murata Manufacturing, Co., Ltd | Multilayer capacitor |
| JP3515698B2 (ja) * | 1998-02-09 | 2004-04-05 | 松下電器産業株式会社 | ４端子コンデンサ |
| US6185091B1 (en) | 1998-02-09 | 2001-02-06 | Matsushita Electric Industrial Co., Ltd. | Four-terminal capacitor |
| US6590762B2 (en) * | 2001-08-06 | 2003-07-08 | Intel Corporation | Layered polymer on aluminum stacked capacitor |
| JP2003178933A (ja) * | 2001-10-05 | 2003-06-27 | Matsushita Electric Ind Co Ltd | コンデンサ |
| US6661644B2 (en) | 2001-10-05 | 2003-12-09 | Matsushita Electric Industrial Co., Ltd. | Capacitor |
| JP2003289018A (ja) * | 2002-03-28 | 2003-10-10 | Tdk Corp | チップ型積層コンデンサ |
| US7099145B2 (en) | 2002-06-18 | 2006-08-29 | Tdk Corporation | Solid electrolytic capacitor and method for manufacturing solid electrolytic capacitor |
| JP2004095816A (ja) * | 2002-08-30 | 2004-03-25 | Matsushita Electric Ind Co Ltd | チップ形コンデンサ |
| US7046500B2 (en) * | 2004-07-20 | 2006-05-16 | Samsung Electro-Mechanics Co., Ltd. | Laminated ceramic capacitor |
| EP1830372B1 (en) | 2004-12-24 | 2018-01-24 | Murata Manufacturing Co., Ltd. | Multilayer capacitor and mounting structure of same |
| JP3832505B2 (ja) * | 2004-12-24 | 2006-10-11 | 株式会社村田製作所 | 積層コンデンサおよびその実装構造 |
| JP2008021773A (ja) * | 2006-07-12 | 2008-01-31 | Matsushita Electric Ind Co Ltd | チップ形固体電解コンデンサ |
| JP5040230B2 (ja) | 2006-09-21 | 2012-10-03 | パナソニック株式会社 | チップ形固体電解コンデンサ |
| TW200828371A (en) | 2006-09-21 | 2008-07-01 | Matsushita Electric Industrial Co Ltd | Chip-type filter |
| JP2009010068A (ja) * | 2007-06-27 | 2009-01-15 | Panasonic Corp | チップ形固体電解コンデンサ |
| KR100925603B1 (ko) * | 2007-09-28 | 2009-11-06 | 삼성전기주식회사 | 적층형 캐패시터 |
| US8421557B2 (en) | 2007-11-15 | 2013-04-16 | Panasonic Corporation | Chip-type solid electrolytic capacitor and chip-type filter |
| JP5034887B2 (ja) | 2007-11-15 | 2012-09-26 | パナソニック株式会社 | チップ形固体電解コンデンサ |
| JP5073011B2 (ja) * | 2010-06-10 | 2012-11-14 | 佐賀三洋工業株式会社 | 固体電解コンデンサ及びその製造方法 |
| JP6024483B2 (ja) * | 2013-01-29 | 2016-11-16 | 株式会社村田製作所 | 積層型セラミック電子部品 |
| KR20150031759A (ko) * | 2013-09-16 | 2015-03-25 | 삼성전기주식회사 | 고체 전해 캐패시터 |
| KR101548865B1 (ko) * | 2014-05-07 | 2015-08-31 | 삼성전기주식회사 | 탄탈륨 캐패시터 |
| KR102281461B1 (ko) * | 2015-08-07 | 2021-07-27 | 삼성전기주식회사 | 고체 전해커패시터 및 그 실장 기판 |
| JP6798560B2 (ja) * | 2016-10-17 | 2020-12-09 | 株式会社村田製作所 | 固体電解コンデンサ |
| JP2025030121A (ja) * | 2023-08-23 | 2025-03-07 | 株式会社三共 | 遊技機 |
-
2021
- 2021-03-18 US US17/905,637 patent/US12374505B2/en active Active
- 2021-03-18 JP JP2022511874A patent/JPWO2021200197A1/ja active Pending
- 2021-03-18 WO PCT/JP2021/011000 patent/WO2021200197A1/ja not_active Ceased
- 2021-03-18 CN CN202180023543.3A patent/CN115335935A/zh active Pending
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