JPWO2021106255A1 - Rficモジュール、rfidタグ及びそれらの製造方法 - Google Patents
Rficモジュール、rfidタグ及びそれらの製造方法 Download PDFInfo
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- 239000000463 material Substances 0.000 claims abstract description 66
- 230000001681 protective effect Effects 0.000 claims abstract description 46
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000012943 hotmelt Substances 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims description 70
- 239000012212 insulator Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 13
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- 238000003825 pressing Methods 0.000 claims description 4
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 238000005476 soldering Methods 0.000 description 1
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- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
- H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
- H01Q9/40—Element having extended radiating surface
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
図1(A)は第1の実施形態に係るRFIDタグ201の平面図である。図1(B)は、RFIDタグ201が備えるRFICモジュール101の搭載部分の拡大平面図である。
第2の実施形態では、RFICとアンテナとの間にインピーダンス整合回路を持たないRFICモジュール及びそれを備えるRFIDタグについて例示する。ここでは、第1の実施形態で示した構成と異なる点について説明する。
L11,L12…第1インダクタの導体パターン
L2…第2インダクタ
L21,L22…第2インダクタの導体パターン
L3…第3インダクタ
L4…第4インダクタ
L5…第5インダクタ
MS11…基材の第1面
MS12…基材の第2面
MS61…絶縁体フィルムの第1面
MS62…絶縁体フィルムの第2面
V1,V2…ビア導体
1…基材
2…RFIC
3…保護膜
4…カバーレイフィルム
5…接着剤層
6…アンテナ
7…インピーダンス整合回路
8…ラベル紙
11…アンテナ側第1端子電極
12…アンテナ側第2端子電極
21,22…RFIC端子
31…RFIC側第1端子電極
32…RFIC側第2端子電極
60…絶縁体フィルム
61,62…導体パターン(アンテナパターン)
61P,61L,61C…導体パターン
62P,62L,62C…導体パターン
70…支持フィルム
101,102…RFICモジュール
201,202…RFIDタグ
Claims (5)
- 基材と、
前記基材に搭載されたRFICと、
前記基材に形成され、アンテナに接続又は結合されるアンテナ側端子電極と、
前記基材の第1面及び前記RFICを覆う絶縁性の保護膜と、
を備え、
前記保護膜はホットメルト樹脂であることを特徴とするRFICモジュール。 - 前記ホットメルト樹脂は、R&B法によって測定される軟化点が60℃以上である、
請求項1に記載のRFICモジュール。 - 柔軟性を有し、アンテナパターンが形成された絶縁体フィルムと、
前記絶縁体フィルムの第1面に搭載されたRFICモジュールと、
前記RFICモジュールが搭載された前記絶縁体フィルムの第1面を覆うラベル紙と、
を備え、
前記RFICモジュールは、基材と、前記基材に搭載されたRFICと、前記基材に形成され、アンテナに接続又は結合されるアンテナ側端子電極と、前記基材の第1面及び前記RFICを覆うホットメルト樹脂による絶縁性の保護膜と、を備え、
前記保護膜は当該保護膜の軟化により、前記絶縁体フィルムと前記ラベル紙との間に拡がっていることを特徴とするRFIDタグ。 - アンテナパターンへの接続用又は結合用の導体パターン及びRFIC接続用導体パターンがそれぞれ形成された、複数のRFICモジュール用の基材の第1面に、複数のRFICを搭載し、
前記基材の第1面にホットメルト樹脂による保護膜を形成し、
前記基材及び前記保護膜を加熱プレスすることで前記保護膜を平坦化し、
前記基材、前記RFIC及び前記保護膜をRFICモジュールの単位に分離する、
RFICモジュールの製造方法。 - アンテナパターンが形成された柔軟性を有する絶縁体フィルムの第1面にRFICモジュールが設けられたRFIDタグの製造方法であって、
前記RFICモジュールは、基材と、前記基材に搭載されたRFICと、前記基材に形成され、アンテナに接続又は結合されるアンテナ側端子電極と、前記基材の第1面及び前記RFICを覆うホットメルト樹脂による絶縁性の保護膜と、を備え、
前記絶縁体フィルムの第1面に前記RFICモジュールを搭載し、前記絶縁体フィルムの第1面にラベル紙又は剥離紙を覆って積層体を形成し、
前記積層体を加圧加熱することで、前記保護膜を軟化させる、
RFIDタグの製造方法。
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JP2019211959 | 2019-11-25 | ||
JP2019211959 | 2019-11-25 | ||
PCT/JP2020/025319 WO2021106255A1 (ja) | 2019-11-25 | 2020-06-26 | Rficモジュール、rfidタグ及びそれらの製造方法 |
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JP6838688B1 JP6838688B1 (ja) | 2021-03-03 |
JPWO2021106255A1 true JPWO2021106255A1 (ja) | 2021-12-02 |
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JP (1) | JP6838688B1 (ja) |
DE (1) | DE212020000366U1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
JP3489025B2 (ja) * | 2000-01-14 | 2004-01-19 | 大塚化学ホールディングス株式会社 | エポキシ樹脂組成物及びそれを用いた電子部品 |
US6924596B2 (en) * | 2001-11-01 | 2005-08-02 | Nichia Corporation | Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same |
JP2007042087A (ja) * | 2005-07-04 | 2007-02-15 | Hitachi Ltd | Rfidタグ及びその製造方法 |
US7808384B2 (en) * | 2006-07-14 | 2010-10-05 | Eyes Open Corporation | Information carrier arrangement, washable textile goods and electronic ear tag for living beings |
US8608080B2 (en) * | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
US8084130B2 (en) * | 2006-10-02 | 2011-12-27 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing and electronic component device |
JP5470680B2 (ja) * | 2007-02-06 | 2014-04-16 | 日亜化学工業株式会社 | 発光装置及びその製造方法並びに成形体 |
US7994000B2 (en) * | 2007-02-27 | 2011-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP5182512B2 (ja) * | 2008-12-15 | 2013-04-17 | 日亜化学工業株式会社 | 熱硬化性エポキシ樹脂組成物及び半導体装置 |
FR2944124B1 (fr) * | 2009-04-03 | 2012-05-11 | Paragon Identification | Etiquette d'identification de radio frequence(rfid) et procede de fabrication de l'etiquette |
JP5672991B2 (ja) * | 2010-11-09 | 2015-02-18 | 凸版印刷株式会社 | 非接触通信媒体の製造方法 |
CN103717688A (zh) * | 2011-07-22 | 2014-04-09 | H.B.富勒公司 | 在电子器件上使用的反应性热熔粘合剂 |
CN106062785B (zh) | 2014-11-07 | 2019-03-15 | 株式会社村田制作所 | 载带及其制造方法、以及rfid标签的制造方法 |
WO2016072335A1 (ja) | 2014-11-07 | 2016-05-12 | 株式会社 村田製作所 | 無線通信デバイスおよびその製造方法、ならびにrfic素子付きシールおよびその作製方法 |
CN110350296B (zh) | 2014-11-27 | 2021-01-05 | 株式会社村田制作所 | Rfic模块以及具备该rfic模块的rfid标签 |
US9697455B2 (en) * | 2014-12-26 | 2017-07-04 | Avery Dennison Retail Information Services, Llc | Using reactive coupling of a printed RFID chip on a strap to allow the printed material to be over-laminated with a barrier film against oxygen and moisture ingress |
JPWO2020138409A1 (ja) * | 2018-12-27 | 2021-11-04 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
WO2021033418A1 (ja) * | 2019-08-20 | 2021-02-25 | 株式会社村田製作所 | 高周波モジュール |
WO2021131148A1 (ja) * | 2019-12-23 | 2021-07-01 | 株式会社村田製作所 | Rficモジュール及びrfidタグ |
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- 2020-06-26 DE DE212020000366.1U patent/DE212020000366U1/de active Active
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US11621493B2 (en) | 2023-04-04 |
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DE212020000366U1 (de) | 2021-02-23 |
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