CN103717688A - 在电子器件上使用的反应性热熔粘合剂 - Google Patents
在电子器件上使用的反应性热熔粘合剂 Download PDFInfo
- Publication number
- CN103717688A CN103717688A CN201280036280.0A CN201280036280A CN103717688A CN 103717688 A CN103717688 A CN 103717688A CN 201280036280 A CN201280036280 A CN 201280036280A CN 103717688 A CN103717688 A CN 103717688A
- Authority
- CN
- China
- Prior art keywords
- tackiness agent
- approximately
- base material
- prepolymer
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004831 Hot glue Substances 0.000 title claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 41
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 39
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 18
- -1 aliphatic isocyanate Chemical class 0.000 claims description 78
- 239000000463 material Substances 0.000 claims description 71
- 239000003795 chemical substances by application Substances 0.000 claims description 60
- 239000000126 substance Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 29
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000012298 atmosphere Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 14
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 14
- 229920013639 polyalphaolefin Polymers 0.000 claims description 12
- 239000012948 isocyanate Substances 0.000 claims description 11
- 238000002444 silanisation Methods 0.000 claims description 8
- 238000013008 moisture curing Methods 0.000 claims description 7
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 239000004902 Softening Agent Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 3
- 239000013543 active substance Substances 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 238000001723 curing Methods 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 230000003641 microbiacidal effect Effects 0.000 claims description 2
- 229940124561 microbicide Drugs 0.000 claims description 2
- 239000002855 microbicide agent Substances 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- 239000006254 rheological additive Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims description 2
- 239000001993 wax Substances 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 6
- 238000000429 assembly Methods 0.000 claims 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims 2
- 239000011112 polyethylene naphthalate Substances 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 42
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 28
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 24
- 229910000077 silane Inorganic materials 0.000 description 20
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 18
- 238000012360 testing method Methods 0.000 description 16
- 229920001577 copolymer Polymers 0.000 description 15
- 229920013640 amorphous poly alpha olefin Polymers 0.000 description 14
- 150000002148 esters Chemical class 0.000 description 14
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 12
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 12
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 12
- 229920005906 polyester polyol Polymers 0.000 description 11
- 229920006270 hydrocarbon resin Polymers 0.000 description 10
- 239000000178 monomer Substances 0.000 description 10
- 239000005056 polyisocyanate Substances 0.000 description 10
- 229920001228 polyisocyanate Polymers 0.000 description 10
- 150000001336 alkenes Chemical class 0.000 description 9
- 229920000570 polyether Polymers 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- 229920002633 Kraton (polymer) Polymers 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 8
- 229920002725 thermoplastic elastomer Polymers 0.000 description 8
- 239000004721 Polyphenylene oxide Substances 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 7
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 6
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 6
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 6
- 239000013032 Hydrocarbon resin Substances 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 150000001721 carbon Chemical group 0.000 description 6
- 238000005984 hydrogenation reaction Methods 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 229920005862 polyol Polymers 0.000 description 6
- 150000003077 polyols Chemical class 0.000 description 6
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000005303 weighing Methods 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 238000010561 standard procedure Methods 0.000 description 5
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 5
- 239000013638 trimer Substances 0.000 description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 150000001408 amides Chemical class 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229920001400 block copolymer Polymers 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000539 dimer Substances 0.000 description 4
- 125000005908 glyceryl ester group Chemical group 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000003209 petroleum derivative Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- LCJHLOJKAAQLQW-UHFFFAOYSA-N acetic acid;ethane Chemical compound CC.CC(O)=O LCJHLOJKAAQLQW-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000005370 alkoxysilyl group Chemical group 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 3
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical group CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920001281 polyalkylene Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 3
- 238000006884 silylation reaction Methods 0.000 description 3
- 238000007655 standard test method Methods 0.000 description 3
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 2
- 241000845082 Panama Species 0.000 description 2
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000001118 alkylidene group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229960003328 benzoyl peroxide Drugs 0.000 description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- DMEGYFMYUHOHGS-UHFFFAOYSA-N cycloheptane Chemical group C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 2
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000006471 dimerization reaction Methods 0.000 description 2
- 150000007520 diprotic acids Chemical class 0.000 description 2
- YCZJVRCZIPDYHH-UHFFFAOYSA-N ditridecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCCCC YCZJVRCZIPDYHH-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- XMGMFRIEKMMMSU-UHFFFAOYSA-N phenylmethylbenzene Chemical group C=1C=CC=CC=1[C]C1=CC=CC=C1 XMGMFRIEKMMMSU-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- ZWVMLYRJXORSEP-LURJTMIESA-N (2s)-hexane-1,2,6-triol Chemical compound OCCCC[C@H](O)CO ZWVMLYRJXORSEP-LURJTMIESA-N 0.000 description 1
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- BKUSIKGSPSFQAC-RRKCRQDMSA-N 2'-deoxyinosine-5'-diphosphate Chemical compound O1[C@H](CO[P@@](O)(=O)OP(O)(O)=O)[C@@H](O)C[C@@H]1N1C(NC=NC2=O)=C2N=C1 BKUSIKGSPSFQAC-RRKCRQDMSA-N 0.000 description 1
- ZEMPKEQAKRGZGQ-AAKVHIHISA-N 2,3-bis[[(z)-12-hydroxyoctadec-9-enoyl]oxy]propyl (z)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(O)CCCCCC)COC(=O)CCCCCCC\C=C/CC(O)CCCCCC ZEMPKEQAKRGZGQ-AAKVHIHISA-N 0.000 description 1
- TYCMAZKWQILOBT-UHFFFAOYSA-N 2,3-diisocyano-1,1,5-trimethylcyclohexane Chemical compound CC1CC(C(C(C1)(C)C)[N+]#[C-])[N+]#[C-] TYCMAZKWQILOBT-UHFFFAOYSA-N 0.000 description 1
- CGLQOIMEUPORRI-UHFFFAOYSA-N 2-(1-benzoyloxypropan-2-yloxy)propyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC(C)OC(C)COC(=O)C1=CC=CC=C1 CGLQOIMEUPORRI-UHFFFAOYSA-N 0.000 description 1
- PMAAOHONJPSASX-UHFFFAOYSA-N 2-butylperoxypropan-2-ylbenzene Chemical group CCCCOOC(C)(C)C1=CC=CC=C1 PMAAOHONJPSASX-UHFFFAOYSA-N 0.000 description 1
- WGRZHLPEQDVPET-UHFFFAOYSA-N 2-methoxyethoxysilane Chemical compound COCCO[SiH3] WGRZHLPEQDVPET-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- ISPIHWORPMENMZ-UHFFFAOYSA-N 3-(1h-imidazol-2-yl)propan-1-ol Chemical class OCCCC1=NC=CN1 ISPIHWORPMENMZ-UHFFFAOYSA-N 0.000 description 1
- QXIQCNFSNJEMOD-UHFFFAOYSA-N 3-hydroxybutan-2-yl prop-2-enoate Chemical compound CC(O)C(C)OC(=O)C=C QXIQCNFSNJEMOD-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- YOABZRCMJMKPFF-UHFFFAOYSA-N 3-triethoxysilylaniline Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC(N)=C1 YOABZRCMJMKPFF-UHFFFAOYSA-N 0.000 description 1
- TZZGHGKTHXIOMN-UHFFFAOYSA-N 3-trimethoxysilyl-n-(3-trimethoxysilylpropyl)propan-1-amine Chemical compound CO[Si](OC)(OC)CCCNCCC[Si](OC)(OC)OC TZZGHGKTHXIOMN-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- FNFBDZKVLGASBR-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]-n-ethyl-2,2-dimethylbutan-1-amine Chemical compound CCNCC(C)(C)CC[Si](C)(OC)OC FNFBDZKVLGASBR-UHFFFAOYSA-N 0.000 description 1
- HVCNXQOWACZAFN-UHFFFAOYSA-N 4-ethylmorpholine Chemical compound CCN1CCOCC1 HVCNXQOWACZAFN-UHFFFAOYSA-N 0.000 description 1
- TVTRDGVFIXILMY-UHFFFAOYSA-N 4-triethoxysilylaniline Chemical compound CCO[Si](OCC)(OCC)C1=CC=C(N)C=C1 TVTRDGVFIXILMY-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 241000771208 Buchanania arborescens Species 0.000 description 1
- MCKWYBMOGZCGFR-UHFFFAOYSA-N C(C1CO1)OCCCC(OOOC)C Chemical compound C(C1CO1)OCCCC(OOOC)C MCKWYBMOGZCGFR-UHFFFAOYSA-N 0.000 description 1
- RZEAZKNJFNGRTE-UHFFFAOYSA-N CC1CC(CC(C1[N+]#[C-])[N+]#[C-])(C)C Chemical compound CC1CC(CC(C1[N+]#[C-])[N+]#[C-])(C)C RZEAZKNJFNGRTE-UHFFFAOYSA-N 0.000 description 1
- XRTZUGVCMRMANY-UHFFFAOYSA-N CCCCCC.C1=CC=CC=C1C1=CC=CC=C1 Chemical compound CCCCCC.C1=CC=CC=C1C1=CC=CC=C1 XRTZUGVCMRMANY-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical group O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Natural products OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 229920010499 Hytrel® 3078 Polymers 0.000 description 1
- 229920011453 Hytrel® 4056 Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- OVRNDRQMDRJTHS-KEWYIRBNSA-N N-acetyl-D-galactosamine Chemical compound CC(=O)N[C@H]1C(O)O[C@H](CO)[C@H](O)[C@@H]1O OVRNDRQMDRJTHS-KEWYIRBNSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 229920003302 Optema™ Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000005376 alkyl siloxane group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- PZZYQPZGQPZBDN-UHFFFAOYSA-N aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 229920000359 diblock copolymer Polymers 0.000 description 1
- RUOGIPBQCAKQFQ-UHFFFAOYSA-N dibutoxy-ethenyl-methylsilane Chemical compound CCCCO[Si](C)(C=C)OCCCC RUOGIPBQCAKQFQ-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- ZXPDYFSTVHQQOI-UHFFFAOYSA-N diethoxysilane Chemical compound CCO[SiH2]OCC ZXPDYFSTVHQQOI-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical compound C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
- QSXHEWLCIOIRFZ-UHFFFAOYSA-N ethenyl acetate;2-methylidenehexanoic acid Chemical compound CC(=O)OC=C.CCCCC(=C)C(O)=O QSXHEWLCIOIRFZ-UHFFFAOYSA-N 0.000 description 1
- BLCTWBJQROOONQ-UHFFFAOYSA-N ethenyl prop-2-enoate Chemical compound C=COC(=O)C=C BLCTWBJQROOONQ-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 description 1
- 125000005745 ethoxymethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])* 0.000 description 1
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 1
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 229960005082 etohexadiol Drugs 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropyl acetate Chemical compound CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CSJDCSCTVDEHRN-UHFFFAOYSA-N methane;molecular oxygen Chemical compound C.O=O CSJDCSCTVDEHRN-UHFFFAOYSA-N 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- YJOGKUUQSLYPQJ-UHFFFAOYSA-N n-ethyl-2,2-dimethyl-4-trimethoxysilylbutan-1-amine Chemical compound CCNCC(C)(C)CC[Si](OC)(OC)OC YJOGKUUQSLYPQJ-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- CBFCDTFDPHXCNY-UHFFFAOYSA-N octyldodecane Natural products CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000005026 oriented polypropylene Substances 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 229940038597 peroxide anti-acne preparations for topical use Drugs 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920002432 poly(vinyl methyl ether) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005996 polystyrene-poly(ethylene-butylene)-polystyrene Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229920006216 polyvinyl aromatic Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920000638 styrene acrylonitrile Polymers 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical compound O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 239000003930 superacid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000004665 trialkylsilyl group Chemical group 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- NESLVXDUKMNMOG-UHFFFAOYSA-N triethoxy-(propyltetrasulfanyl)silane Chemical compound CCCSSSS[Si](OCC)(OCC)OCC NESLVXDUKMNMOG-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 238000006886 vinylation reaction Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/27003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the layer preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27318—Manufacturing methods by local deposition of the material of the layer connector in liquid form by dispensing droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
- H01L2224/2741—Manufacturing methods by blanket deposition of the material of the layer connector in liquid form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
- H01L2224/2741—Manufacturing methods by blanket deposition of the material of the layer connector in liquid form
- H01L2224/27418—Spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
- H01L2224/2741—Manufacturing methods by blanket deposition of the material of the layer connector in liquid form
- H01L2224/27422—Manufacturing methods by blanket deposition of the material of the layer connector in liquid form by dipping, e.g. in a solder bath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83877—Moisture curing, i.e. curing by exposing to humidity, e.g. for silicones and polyurethanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本公开涉及一种使用反应性热熔粘合剂组合物制备电子组件的方法,所述反应性热熔粘合剂组合物包含大气固化预聚物并任选地包含软化点为至少约120℃的热塑性组分,以及使用所述方法制备的所述电子组件。
Description
本申请要求于2011年7月22日提交并且并入本文中的美国临时申请No.61/510,784的权益。
发明内容
在一些方面,本发明涉及一种制备包括第一基材、第二基材以及位于两个基材之间的电子元件的电子组件的方法。该方法包括提供在存在水分的情况下固化并包含大气固化预聚物的反应性热熔粘合剂组合物。将粘合剂涂布到第一基材的至少一部分上。然后使第二基材的至少一部分与第一基材上的粘合剂接触。第一或第二基材中的任一者在涂布粘合剂之前包括电子元件。
在一个实施例中,粘合剂还包含Mettler软化点为至少120℃的热塑性组分。
在一些方面,本发明涉及这样的电子组件,其包括第一基材、第二基材、位于第一和第二基材之间的电子元件以及包含大气固化预聚物与水分的反应产物的反应性热熔粘合剂。将第一基材的至少一部分通过粘合剂粘合到第二基材的至少一部分。
在一个实施例中,粘合剂还包含Mettler软化点为至少120℃的热塑性组分。
附图说明
图1示出在两个基材之间的电子元件的剖视图。
图2示出在两个基材之间的电子元件的剖视图,其中粘合剂围绕组件的边缘。
图3示出在两个基材之间的电子元件的剖视图,其中粘合剂遍及整个组件。
具体实施方式
粘合剂组合物
本发明所公开的粘合剂组合物是包含大气固化预聚物以及任选的Mettler软化点为至少120℃的热塑性组分的反应性热熔粘合剂。热塑性组分可选自热塑性弹性体、热塑性聚合物以及它们的组合。粘合剂在暴露于大气水分时固化。
在固化之前,粘合剂在约100℃至约150℃的温度下显示约5,000厘泊(cps)至约500,000cps、或甚至约10,000cps至约400,000cps的熔融粘度。
粘合剂在60℃下优选地显示至少约2磅/平方英寸(psi)、或甚至至少4psi的初始搭接剪切强度。优选地,当根据本文所述的搭接剪切强度测试方法在23℃和50%的相对湿度下历时12周后进行测试时,粘合剂显示至少约20psi、或约30psi、或约70psi或甚至约100psi的最终搭接剪切强度。
粘合剂能够提供蒸汽屏障。优选地,粘合剂在采用60密耳薄膜的形式时显示不大于20克/平方米/天、或甚至不大于10克/平方米/天的湿蒸汽透过率(MVTR)。
当根据本文所述的剥离粘接强度测试方法进行测试时,粘合剂还优选地显示针对聚对苯二甲酸乙二醇酯(PET)膜具有小于50%的粘合失效、小于10%的粘合失效、或甚至小于5%的粘合失效。
当与电子器件组件一起使用时,粘合剂优选地显示具有某些特性。例如,粘合剂优选地能够在低成本基材上于低温下进行处理。其优选地能够在自动化的卷对卷制造工艺中使用。其优选地显示不需要B阶段的或部分固化的快速附接。该组合物优选地具有长的开放时间或长的定型时间。该组合物优选地针对类似塑料的低能材料显示具有良好的初始强度和最终粘合强度。其优选地为柔性的。其优选地显示具有良好的水分和氧气阻隔性能。其优选地为光学透明的,并且在暴露于紫外线辐射或较高的温度时不会黄化。其优选地显示具有低渗气性和低空隙。并且其优选地通过消耗密封组件内的残余水分而起到干燥剂或除湿剂的作用。
大气固化(湿固化)预聚物
粘合剂包含大气固化预聚物。大气固化预聚物为在暴露于水分(如,大气水分)时固化的预聚物。可用的大气固化预聚物包括如异氰酸酯封端的聚氨酯预聚物(如聚醚聚氨酯和聚酯聚氨酯);硅烷化封端的聚氨酯预聚物,聚二甲硅氧烷,烷氧基-、乙酰氧基-和氧氨基-硅烷封端的聚醚;硅烷官能的聚α烯烃聚合物;与烷氧基-、乙酰氧基-和氧氨基-有机官能化硅烷交联的烷基硅氧烷聚合物;以及它们的组合。
粘合剂组合物优选地包含基于所述组合物的重量计其量为约5重量%、或约10重量%、或约15重量%,或约20重量%至约100重量%、或至约95重量%、或至约85重量%、或至约70重量%、或至约50重量%的大气固化预聚物。
异氰酸酯封端的聚氨酯预聚物。在其中大气固化预聚物为异氰酸酯封端的聚氨酯预聚物的实施例中,多种异氰酸酯封端的预聚物可包含在粘合剂组合物中。
可用的异氰酸酯封端的聚氨酯预聚物包括具有至少2个异氰酸酯官能团的多异氰酸酯与多元醇(如,聚酯多元醇、聚醚多元醇或它们的组合)的反应产物。
优选的异氰酸酯封端的聚氨酯预聚物包括为脂族多异氰酸酯和多元醇的反应产物的那些。
可用的多异氰酸酯包括如芳族异氰酸酯、脂族异氰酸酯、脂环族异氰酸酯,以及它们的组合。可用的芳族异氰酸酯包括如二苯亚甲基二异氰酸酯、2,2’-二苯亚甲基二异氰酸酯、4,4’-二苯基二甲基亚甲基二异氰酸酯、二苯亚甲基2,4’-二异氰酸酯、四甲基二甲苯二异氰酸酯、甲苯二异氰酸酯、萘二异氰酸酯(如,萘1,5-二异氰酸酯)、二-和四烷基二苯甲烷二异氰酸酯、4,4-二苄基二异氰酸酯、1,3-亚苯基二异氰酸酯、1,4-亚苯基二异氰酸酯,以及它们的组合。
可用的脂族多异氰酸酯包括如1,3-环戊烷二异氰酸酯、1,4-环己烷二异氰酸酯、1,3-环己烷二异氰酸酯、氢化MDI(即,二环己基甲烷二异氰酸酯、H12-MDI)、甲基2,4-环己烷二异氰酸酯、甲基2,6-环己烷二异氰酸酯、1,4-双(异氰酸根合甲基)环己烷、1,3-双(异氰酸根合甲基)环己烷。
其他合适的脂族二异氰酸酯包括如六亚甲基二异氰酸酯、氢化MDI、十二烷异氰酸酯、二聚体二异氰酸酯、四甲氧基丁烷1,4-二异氰酸酯、丁烷1,4-二异氰酸酯、己烷1,6-二异氰酸酯(HDI)、1,6-二异氰酸根-2,2,4-三甲基己烷、1,6-二异氰酸根-2,4,4-三甲基己烷、1,12-十二烷二异氰酸酯(C12DI)、聚合物异氰酸酯、三聚体异氰酸酯,以及它们的组合。
合适的脂环族多异氰酸酯包括如上述芳族二异氰酸酯的氢化产物,包括如4,4’-二环己基甲烷二异氰酸酯(H12MDI)、1-异氰酸根合甲基-3-异氰酸根-1,5,5-三甲基环己烷(异佛尔酮二异氰酸酯,IPDI)、环己烷1,4-二异氰酸酯、氢化苯二甲基二异氰酸酯(H6XDI)、1-甲基-2,4-二异氰酸根合环己烷、间-和对-四甲基二甲苯二异氰酸酯(m-TMXDI、p-TMXDI)、二聚体脂肪酸二异氰酸酯,以及它们的组合。
优选地,异氰酸酯和多元醇以约4.0:1.0至约4.0:1.5的NCO:OH比进行混合,以在多异氰酸酯预聚物中获得约0.1重量%至约10重量%的%NCO。一种可用于确定残余的NCO浓度的方法为ASTM D-2572-80“Standard Method forIsocyanate Group and Urethane Materials or Prepolymers”(用于异氰酸酯基团和氨基甲酸酯材料或预聚物的标准方法)。
可用的异氰酸酯也在如U.S.4,775,719、U.S.4,808,255和U.S.4,820,368中有所公开;所有这些专利均并入本文中。可用的市售多异氰酸酯的一个例子为得自美国密歇根州米德兰陶氏化学公司(Dow Chemical Co.(Midland,Michigan))的ISONATE125M纯二苯甲烷二异氰酸酯(MDI)。特别优选的二异氰酸酯是脂族异氰酸酯或脂族异氰酸酯的共混物,因为它们提供出色的紫外线稳定性(不黄化)和水解稳定性。
可用的市售脂族异氰酸酯包括如均得自美国宾夕法尼亚州匹兹堡拜耳公司(Bayer(Pittsburg,PA))的DESMODUR W、DESMODUR I和DESMODUR N3600,以及得自美国新泽西州帕西帕尼赢创德固赛公司(Evonik Degussa(Parsippany,NJ))的VESTANAT IPDI和VESTANAT H12MDI。
用于形成预聚物的合适多元醇包括每分子具有至少两个羟基基团,且数均分子量为约400至约20,000、或甚至约1000至约6000的多羟基化合物。可用的多元醇包括在室温下为玻璃状(即,无定形)、固体、结晶或液体的多元醇。可用的多元醇包括如聚酯多元醇、聚醚多元醇、聚亚烷基多元醇,以及它们的混合物。合适的聚酯多元醇包括在并入本文中的U.S.4,808,255中所述的那些聚酯多元醇。可用的聚酯多元醇包括在并入本文中的U.S.5,441,808中所述的那些聚醚多元醇。可用的聚亚烷基多元醇包括在并入本文中的U.S.4,820,368中所述的那些聚亚烷基多元醇。可用的多元醇还在Doyle,E.N.,The Development andUse of Polyurethane Products,McGraw-Hill Book Co.,1971,pages44-62(Doyle,E.N.,“聚氨酯产品的开发和用途”,麦格劳-希尔图书公司,1971年,第44-62页)中进行了描述。
多元醇优选地由二元酸和二醇形成。合适的二元酸具有多于约10个碳原子。一些可用的聚酯多元醇包括二聚酸(如得自美国俄亥俄州辛辛那提科宁化工公司(Cognis Chemical(Cincinnati,Ohio))的EMPOL1061和EMPOL1018二聚酸)和新戊二醇、乙二醇、丙二醇、环己醇(cyclohexanel)、4-丁二醇和1,6-己二醇中的至少一种的反应产物。
一类可用的聚醚多元醇包括其中亚烷基为C2-8的聚氧化烯多元醇。其他可用的聚氧化烯多元醇包括如聚四亚甲基醚二醇(如,数均分子量为约600至约6000、或甚至约800至约5000的聚四亚甲基二醇)、其中亚烷基为C2-8的聚(氧化亚烷基)二醇(包括聚(1,2-和1,3-氧化亚丙基)二醇、聚(氧化四亚甲基)二醇、聚(氧化五亚甲基)二醇、聚(氧化六亚甲基)二醇、聚(氧化七亚甲基)二醇、聚(氧化八亚甲基)二醇、聚(氧化九亚甲基)二醇和聚(1,2-氧化亚丁基)二醇)、双官能聚丙二醇、三官能聚丙二醇、环氧乙烷和1,2-环氧丙烷(以使得二醇中的碳氧摩尔比大于2.5的比例使用)的无规和嵌段共聚物,以及通过将甲醛与二醇(如,五亚甲基二醇)反应而制备的聚缩甲醛,或者二醇的混合物(如,四亚甲基二醇和五亚甲基二醇的混合物)。另外,聚氧化烯多元醇的二羧甲基酸可以被用来原位形成长链多元醇。用于形成多异氰酸酯预聚物的多元醇可以与制备聚醚聚酯嵌段共聚物的过程中所用的多元醇相同。
可用的聚酯多元醇包括为各种多元醇(如,二醇和三醇)与芳族酸、脂族二羧酸、脂族三羧酸、内酯(如,ε-己内酯)的聚合物(如,聚己内酯)以及它们的组合的反应产物的那些。适用于形成聚酯多元醇的多元醇包括如乙二醇、丁二醇(如1,4-丁二醇)、新戊二醇、己二醇、丙二醇、双丙甘醇、二乙二醇、三乙二醇、环己烷二甲醇、1,6-己二醇、1,8-辛二醇、1,10-癸二醇、1,12-十二烷二醇、二聚脂肪醇、丙三醇、三羟甲基丙烷,以及它们的组合。用于形成聚酯多元醇的合适的芳族酸包括如对苯二甲酸、间苯二甲酸、六氢邻苯二甲酸、邻苯二甲酸酐,以及它们的组合。用于形成聚酯多元醇的合适脂族酸包括如癸二酸、己二酸、戊二酸、壬二酸、琥珀酸、辛二酸、十一烷二酸、十二烷二酸、3,3-二甲基戊二酸、二聚脂肪酸,以及它们的组合。
其他可用的聚酯多元醇包括如衍生自油化学品的多元醇,此类多元醇通过使包含至少部分烯烃化的不饱和脂肪酸的油脂混合物与至少一种包含1个碳原子至12个碳原子的醇的环氧化三甘油酯完全开环,随后对三甘油酯衍生物进行部分酯交换以形成在烷基中具有1个碳原子至12个碳原子的烷基酯多元醇而制得。另外的合适多元醇包括聚碳酸酯多元醇、二聚二醇、蓖麻油及其衍生物,以及羟基官能化聚丁二烯。
另外的合适多元醇为线性并轻微支化的丙烯酸酯共聚物多元醇,其可以根据多种方法进行制备,包括如通过丙烯酸酯和甲基丙烯酸酯中的至少一者与羟基官能化的丙烯酸化合物和甲基丙烯酸化合物(如,(甲基)丙烯酸羟乙酯和(甲基)丙烯酸羟丙酯)中的至少一者的自由基共聚反应。
当使用多元醇的混合物来制备异氰酸酯封端的预聚物时,所述多元醇优选地与用作热塑性聚合物的聚醚聚酯嵌段共聚物具有至少部分的相容性。
异氰酸酯封端的预聚物可被汽提使游离的异氰酸酯单体少于0.5%。一种可用于汽提未反应的异氰酸酯单体的设备为刮膜蒸发器。使用汽提过的异氰酸酯封端的预聚物可使操作粘合剂时的安全性得到改善。
硅烷化封端的聚氨酯预聚物。大气固化或湿固化预聚物还可以是湿固化性硅烷化封端的聚氨酯预聚物。可使用包含与聚氨酯预聚物的异氰酸酯基团具有反应性的至少一个官能团(如,氢)并具有至少一个甲硅烷基基团的任何氢活性有机官能化硅烷来制备所述预聚物。可用的甲硅烷基基团的例子包括烷氧基甲硅烷基、芳氧基甲硅烷基、烷氧基亚氨基甲硅烷基、肟甲硅烷基和氨基甲硅烷基。优选的氢活性有机官能化硅烷包括如氨基硅烷(如,仲氨基烷氧基硅烷)和巯基烷氧基硅烷。合适的氨基硅烷的例子包括苯基氨基丙基三甲氧基硅烷、甲基氨基丙基三甲氧基硅烷、正丁基氨基丙基三甲氧基硅烷、叔丁基氨基丙基三甲氧基硅烷、环己基氨基丙基三甲氧基硅烷、马来酸二丁酯氨基丙基三甲氧基硅烷、马来酸二丁酯取代的4-氨基3,3-二甲基丁基三甲氧基硅烷、氨基丙基三乙氧基硅烷以及它们的混合物,其具体例子包括N-甲基-3-氨基-2-甲基丙基三甲氧基硅烷、N-乙基-3-氨基-2-甲基丙基三甲氧基硅烷、N-乙基-3-氨基-2-甲基丙基二乙氧基硅烷、N-乙基-3-氨基-2-甲基丙基三乙氧基硅烷、N-乙基-3-氨基-2-甲基丙基甲基二甲氧基硅烷、N-丁基-3-氨基-2-甲基丙基三甲氧基硅烷、3-(N-甲基-3-氨基-1-甲基-1-乙氧基)丙基三甲氧基硅烷、N-乙基-4-氨基-3,3-二甲基丁基二甲氧基甲基硅烷、N-乙基-4-氨基-3,3-二甲基丁基三甲氧基硅烷、双-(3-三甲氧基甲硅烷基-2-甲基丙基)胺、N-(3'-三甲氧基甲硅烷基丙基)-3-氨基-2-甲基丙基三甲氧基硅烷、N,N-双[(3-三乙氧基甲硅烷基)丙基]胺、N,N-双[(3-三丙氧基-甲硅烷基)丙基]胺、N-(3-三甲氧基甲硅烷基)丙基-3-[N-(3-三甲氧基甲硅烷基)-丙基氨基]丙酰胺、N-(3-三乙氧基甲硅烷基)丙基-3-[N-3-三乙氧基甲硅烷基)-丙基-氨基]丙酰胺、N-(3-三甲氧基甲硅烷基)丙基-3-[N-3-三乙氧基甲硅烷基)-丙基氨基]丙酰胺、3-三甲氧基甲硅烷基丙基3-[N-(3-三甲氧基甲硅烷基)-丙基氨基]-2-甲基丙酸酯、3-三乙氧基甲硅烷基丙基3-[N-(3-三乙氧基甲硅烷基)-丙基氨基]-2-甲基丙酸酯、3-三甲氧基甲硅烷基丙基3-[N-(3-三乙氧基甲硅烷基)-丙基氨基]-2-甲基丙酸酯、γ-巯丙基-三甲氧基硅烷以及N,N'-双((3-三甲氧基甲硅烷基)丙基)胺。
可用的市售氨基硅烷包括如可以SILQUEST系列的商品名(包括如SILQUEST A-1170、SILQUEST A-1110、SILQUEST Y-9669和SILQUEST A-15)从迈图公司(Momentive)获得的氨基硅烷、可以DYNASYLAN系列的商品名(包括如DYNASYLAN1189N-(正丁基)氨基丙基三甲氧基硅烷和DYNASYLANMTMO3-巯丙基三甲氧基硅烷)从美国伊利诺伊州内珀维尔市德固赛公司(Degussa Corporation(Naperville,Ill.))获得的氨基硅烷、以及以商品名A-189γ-巯丙基三甲氧基硅烷从迈图公司(Momentive)获得的氨基硅烷。
制备硅烷化封端的聚氨酯预聚物的可用方法在如并入本文中的美国专利No.3,632,557、No.4,345,053、No.4,645,816和No.4,960,844中有所描述。
制备具有侧基或端基硅烷官能团的硅烷化封端聚氨酯预聚物的可用方法的一个例子包括将异氰酸根合有机官能化硅烷与多羟基官能化聚氨酯预聚物或丙烯酸酯官能化、羟基官能化的聚氨酯预聚物反应。多羟基官能化聚氨酯预聚物可以如上文针对多异氰酸酯官能化聚氨酯预聚物所述进行制备,不同的是反应混合物具有相对于二异氰酸酯组分化学计量过量的多元醇,以便形成羟基官能化聚氨酯预聚物。反应混合物中的羟基基团与异氰酸酯基团的比率优选地为约1.1:1至约4:1,更优选地为约1.2:1至约2.5:1。
随后将羟基官能化聚氨酯预聚物与一种或多种异氰酸酯化的硅烷反应,如式为OCN-R-Si(X)m(--OR1)3-m的异氰酸酯化的硅烷,其中m为0、1或2,每个R1为包含1至4个碳原子的烷基,优选地为甲基或乙基,每个X为包含1至4个碳原子的烷基,优选地为甲基或乙基,并且R为双官能有机基团,优选地为包含2至6个碳原子的直链或支链双官能烷基,使得预聚物的羟基基团被异氰酸酯硅烷封端。适用于对具有活性氢末端或侧链原子的氨基甲酸酯预聚物进行封端的硅烷封端剂由通式OCN-R-Si(X)m(--OR1)3-m表示,其中R、R1、X和m如上文所定义。此类异氰酸根合烷氧基硅烷化合物的多种可用的结构在如美国专利No.4,146,585(第4和第5列)中有所公开,并且并入本文中。优选的异氰酸根合烷氧基硅烷包括如γ-异氰酸根合丙基-三乙氧基硅烷和γ-异氰酸根合丙基-三甲氧基硅烷,此类物质的市售例子可以商品名SILQUEST A-35和SILQUEST A-25得自迈图公司(Momentive)。
硅烷官能聚α烯烃聚合物。大气固化或湿固化预聚物还可以是湿固化性硅烷官能聚α烯烃聚合物。特别可用的硅烷官能聚α烯烃聚合物要么是完全无定形的,要么具有低的结晶度。如通过X射线衍射法所确定,结晶度优选地不大于25%。可用的硅烷官能无定形聚α烯烃聚合物通过将无定形聚α烯烃与硅烷源接枝而衍生得到。合适的无定形聚α烯烃包括如均聚物、共聚物和三聚物,包括如无规聚丙烯、无规聚-1-丁烯以及它们的组合。无定形聚α烯烃可以是无规或嵌段共聚物。其他合适的无定形聚α烯烃聚合物包括如以下单体的均匀的基本线性的乙烯-α-烯烃互聚物,所述单体包括如丙烯、1-丁烯、1-戊烯、3-甲基-1-丁烯、1-己烷、3-甲基-1-戊烯、4-甲基-1-戊烯、3-乙基-1-戊烯、1-辛烯、1-癸烯和1-十一碳烯;与包含丙烯作为主要组分的任一种烯烃(如,乙烯、1-丁烯、1-戊烯、1-己烯、4-甲基-1-戊烯、1-辛烯和1-癸烯)的无定形共聚物、与包含1-丁烯作为主要组分的其他烯烃(如,乙烯、丙烯、1-戊烯、1-己烯、4-甲基-1-戊烯、1-辛烯、1-癸烯等)的无定形共聚物;以及它们的组合。优选的烯烃基无定形聚合物包括无规聚丙烯、丙烯/乙烯无定形共聚物,以及丙烯/1-丁烯无定形共聚物。
一类可用的无定形聚α烯烃的一个例子包括如在美国专利No.5,994,474中所述的衍生自0重量%至95重量%的具有4至10个碳原子的α烯烃(在其他实施例中,从3重量%至95重量%)、5重量%至100重量%的丙烷(在其他实施例中,从5重量%至97重量%)以及0重量%至20重量%的乙烷的共聚物和三聚物,其被并入本文中。
即将接枝到无定形聚α烯烃上的硅烷可以具有两个或三个直接附接到硅的烷氧基基团和至少一个包含烯属双键的部分。合适的例子包括乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三(2-甲氧基乙氧基)硅烷、3-甲基丙烯酰氧基丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基三乙氧基硅烷、乙烯基二甲基甲氧基硅烷和乙烯基甲基二丁氧基硅烷。
用于接枝到无定形聚α烯烃上的硅烷的量基于无定形聚α烯烃计为约0.1重量%至约10重量%、约2重量%至约6重量%,或甚至约3重量%至约5重量%。
可以使用任何已知的用于将硅烷接枝到无定形聚α烯烃上的方法,包括如溶液法和熔融法(如使用适当量的自由基供体)。可用于制备甲硅烷基化无定形聚α烯烃的方法在如U.S.5,994,474和DE4000695中有所描述并且并入本文中。自由基供体的合适例子包括二酰基过氧化物诸如二月桂基过氧化物和二癸酰基过氧化物、烷基过酸酯诸如叔丁基过氧-2-乙基己酸酯、过缩酮诸如1,1-二(叔丁基过氧基)-3,3,5-三甲基环己烷或1,1,-二(叔丁基过氧基)环己烷、二烷基过氧化物诸如叔丁基枯基过氧化物、二(叔丁基)过氧化物和二枯基过氧化物、C-基供体包括如3,4-二甲基-3,4-二苯基己烷和2,3-二甲基-2,3-二苯基丁烷,以及偶氮化合物(如2,2’-偶氮二(2-乙酰氧基丙烷))。
无定形聚α烯烃优选地具有约7,000至约14,000的数均分子量(Mn)、约35,000至约90,000的重均分子量(Mw)、约13,000至约33,000的Z均分子量(Mz),以及约4.9至约6.2的多分散性(MWD)。
优选的硅烷官能无定形聚α烯烃聚合物包括以商品名VESTOPLAST从德国赢创公司(Evonik,Germany)商购获得的那些,包括如VESTOPLAST206V硅烷官能无定形聚α烯烃。
在一些实施例中,硅烷官能聚α烯烃聚合物具有低于120℃的Mettler软化点。在一个实施例中,硅烷官能聚α烯烃聚合物具有至少120℃的Mettler软化点。硅烷官能聚α烯烃聚合物以基于组合物的重量计约5重量%至约100重量%或至约80重量%、约15重量%至约50重量%、或甚至约25重量%至约40重量%的量存在于所述组合物中。
Mettler软化点为至少120℃的热塑性组分
粘合剂组合物还可以包含Mettler软化点为至少约120℃的热塑性组分。所述热塑性组分可以是热塑性聚合物或热塑性弹性体,或它们的组合。在一个实施例中,热塑性组分为反应性的,如与异氰酸酯基团反应以形成大气固化预聚物。在一个实施例中,热塑性组分为非反应性的。
热塑性弹性体。Mettler软化点为至少120℃的示例性热塑性弹性体包括聚醚酰胺嵌段共聚物,聚酯,丁二烯-苯乙烯弹性体包括如A-B、A-B-A、A-(B-A)n-B、(A-B)n-Y以及其径向嵌段共聚物和接枝物(其中A嵌段为聚乙烯基芳族嵌段(如苯乙烯),B嵌段为橡胶状中间嵌段(如异戊二烯、丁二烯、乙烯-丁烯和乙烯-丙烯)(如苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-异戊二烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物)、聚氨酯弹性体、聚烯烃弹性体、弹性体乙烯-乙酸乙烯酯、乙烯-辛烯嵌段共聚物,以及它们的混合物。
软化点为至少120℃的可用的市售热塑性弹性体包括如可以商品名HYTREL3078、HYTREL4053和HYTREL4056得自美国特拉华州杜邦公司(E.I.DuPont de Nemours(Delaware))的热塑性弹性体,可以KRATON G系列的商品名(包括如KRATON G-1652和G-1657)得自美国德克萨斯州休斯顿的科腾聚合物公司(Kraton Polymers(Houston,Texas))的苯乙烯-乙烯/丁烯-苯乙烯嵌段共聚物;可以KRATON D系列的商品名(包括如KRATON D-1111和D-1112)得自科腾聚合物公司(Kraton Polymers)的苯乙烯-丁二烯-苯乙烯以及苯乙烯-异戊二烯-苯乙烯嵌段共聚物;可以商品名KRATON SKFG101得自科腾聚合物公司(Kraton Polymers)的硅烷封端的嵌段共聚物;可以VECTOR系列的商品名(包括如VECTOR4112、4114和4411)得自美国德克萨斯州休斯顿的迪思科聚合物公司(Dexco Polymers(Houston,Texas))的苯乙烯-丁二烯-苯乙烯以及苯乙烯-异戊二烯-苯乙烯嵌段共聚物;以及可以INSITE系列的商品名(包括如INSITED9807.15)得自陶氏化学公司(Dow Chemical Company)的乙烯-辛烯嵌段共聚物。
当存在于粘合剂中时,Mettler软化点为至少120℃的热塑性弹性体的量基于所述粘合剂组合物的重量计最多至约75重量%、或从约5重量%或从约10重量%或从约20重量%至约75重量%或至约60重量%或至约40重量%。
热塑性聚合物。Mettler软化点为至少120℃的热塑性聚合物可选自多种类型的热塑性聚合物,包括如聚烯烃(如聚乙烯、聚丙烯和聚丁烯)、聚(α)烯烃包括如脂族单-1-烯烃(α烯烃)的均聚物、共聚物和三聚物(如,包含2至10个碳原子的聚(α)烯烃)、具有至少一个C3至C20α烯烃的乙烯的均匀的线性或基本线性的互聚物、聚异丁烯、聚(亚烷基氧化物)、聚(苯二胺对苯二甲酰胺)、聚酯(如聚对苯二甲酸乙二醇酯)、聚丙烯酸酯、聚甲基丙烯酸酯、聚丙烯酰胺、聚丙烯腈、丙烯腈与单体(包括如丁二烯、苯乙烯、聚甲基戊烯和聚苯硫醚)的共聚物(如,苯乙烯-丙烯腈、丙烯腈-丁二烯-苯乙烯、丙烯腈-苯乙烯-丁二烯橡胶)、聚酰亚胺、聚酰胺、乙烯醇和乙烯化不饱和单体的共聚物、聚乙酸乙烯酯(如乙烯-乙酸乙烯酯)、聚乙烯醇、氯乙烯均聚物和共聚物(如,聚氯乙烯)、乙烯的三聚物、一氧化碳、丙烯酸酯或乙烯基单体、聚硅氧烷、聚氨酯、聚苯乙烯,以及它们的组合,以及它们的均聚物、共聚物和三聚物,以及它们的混合物。其他可用类型的热塑性聚合物包括柏油、沥青、生橡胶、氟化橡胶以及纤维素树脂。
其他可用的热塑性聚合物包括Mettler软化点为至少120℃的热塑性树脂,如Mettler软化点为至少120℃的增粘树脂。
可用的Mettler软化点为至少120℃的市售热塑性聚合物包括如可以商品名VESTOPLAST308、VESTOPLAST608和VESTOPLAST703得自赢创公司(Evonik)的无定形聚α烯烃,可以REXTAC系列的商品名(包括如REXTAC RT2535和RT2585)得自美国德克萨斯州奥德萨市REXTAC有限责任公司(REXTAC LLC(Odessa,Texas))以及可以EASTOFLEX系列的商品名(包括如EASTOFLEX E1060)得自美国田纳西州金斯波特市伊士曼化学公司(EastmanChemical Co.(Kingsport,Tennessee))的无规聚丙烯聚合物;可以商品名EPOLENE C-17得自维斯特莱克化学公司(Westlake Chemical Corporation)的聚乙烯聚合物;可以OPTEMA系列的商品名得自美国德克萨斯州休斯顿埃克森美孚化工公司(ExxonMobil Chemical Co.(Houston,Texas))的乙烯-丙烯酸甲酯共聚物;可以商品名HYTREL得自杜邦公司(DuPont)的丁烯/聚(亚烷基醚)邻苯二甲酸酯聚合物;得自伊士曼公司(Eastman)的α-甲基苯乙烯树脂KRISTALEX5140和1120,得自埃克森美孚公司(Exxon)的石油烃树脂ESCOREZ5415、5615和5632,得自伊士曼公司(Eastman)的芳族氢化烃树脂REGALREZ1126。
当存在于粘合剂中时,Mettler软化点为至少120℃的热塑性聚合物的量基于所述粘合剂组合物的重量计优选地最多至约75重量%、或从约5重量%或从约10重量%或从约20重量%至约75重量%或至约60重量%或至约40重量%。
Mettler软化点低于120℃的热塑性聚合物
粘合剂组合物任选地包含Mettler软化点低于120℃的热塑性聚合物。这种合适的热塑性聚合物的类型包括如热塑性聚氨酯、热塑性聚酯嵌段共聚物、热塑性聚醚酰胺、烯键式不饱和单体的低分子量聚合物(如,至少一个下述单体的(共)聚合物:丙烯酸和甲基丙烯酸的C1-C18烷基酯(如丙烯酸乙烯酯、甲基丙烯酸乙烯酯、丁基丙烯酸乙烯酯、羟乙基丙烯酸乙烯酯以及它们的组合)、丙烯酸、甲基丙烯酸、叔碳酸乙烯酯和乙烯基醚、乙烯基聚合物(如乙烯-乙酸乙烯酯共聚物和丙酸乙烯酯)、延胡索酸烷基酯、马来酸烷基酯、苯乙烯、烷基苯乙烯、丙烯腈、丁二烯、异戊二烯、丁二烯和异戊二烯共聚物的氢化产物,诸如苯乙烯-乙烯-丙烯和苯乙烯-乙烯-丁烯二嵌段和三嵌段共聚物。热塑性聚合物优选地具有小于约60,000,或甚至约10,000至约40,000的数均分子量。可选的热塑性聚合物的一个有用的例子包括含有约18重量%至约80重量%乙酸乙烯酯的乙酸乙烯酯-乙烯共聚物。
Mettler软化点低于120℃的热塑性聚合物包括如乙烯-乙酸乙烯酯、乙烯-丙烯酸、甲基丙烯酸乙烯酯和乙烯-丙烯酸正丁酯共聚物、聚乙烯醇、羟乙基纤维素、羟丙基纤维素、聚乙烯基甲基醚、聚环氧乙烷、聚乙烯基吡咯烷酮、聚乙基噁唑啉、淀粉、纤维素酯以及它们的组合。
Mettler软化点低于120℃的其他热塑性聚合物包括Mettler软化点从约70℃至低于120℃、优选地从约80℃至约100℃的增粘树脂。
合适的增粘树脂的例子包括脂族树脂、脂环族树脂、芳族树脂、脂族-芳族树脂、芳族改性的脂环烃树脂、脂环烃树脂,以及它们的改性形式和氢化衍生物;萜烯(多萜)、改性的萜烯(如酚醛改性的萜烯树脂)、它们的氢化衍生物以及它们的混合物;天然的和改性的松香,诸如脂松香、木松香、妥尔油松香、蒸馏松香、氢化松香、二聚松香和聚合松香;松香酯,包括如天然和改性松香的甘油酯和季戊四醇酯(如浅色木松香的甘油酯、氢化松香的甘油酯、聚合松香的甘油酯、氢化松香的季戊四醇酯以及松香的酚醛改性的季戊四醇酯);α-甲基苯乙烯树脂及其氢化衍生物;低分子量聚乳酸;以及它们的组合。其他可用的增粘树脂在如美国专利No.6,355,317中有所公开并且并入本文中。
合适的市售增粘树脂包括如部分氢化的脂环族石油烃树脂,其可以EASTOTAC系列的商品名(包括如EASTOTAC H-100、H-115、H-130和H-142)得自美国田纳西州金斯波特市伊士曼化学公司(Eastman Chemical Co.(Kingsport,Tenn.)),所述树脂EASTOTAC H-100、H-115、H-130和H-142可以等级E、R、L和W获得,它们具有不同的氢化水平:从最低的氢化水平(E)至最高的氢化水平(W);可以ESCOREZ系列的商品名(包括如ESCOREZ5300和ESCOREZ5400)得自美国德克萨斯州休斯顿的埃克森化工公司(Exxon Chemical Co.(Houston,Tex.)),以及可以商品名HERCOLITE2100得自美国特拉华州威尔明顿市的赫克力士公司(Hercules(Wilmington,Del.));部分氢化的芳族改性石油烃树脂,其可以商品名ESCOREZ5600得自埃克森化工公司(Exxon Chemical Co.);脂族-芳族石油烃树脂,其可以商品名WINGTACK EXTRA获得;由d-柠檬烯制成的苯乙烯化萜烯树脂,其可以商品名ZONATAC105LITE得自美国佛罗里达州巴拿马城的亚利桑那化学公司(Arizona Chemical Co.(Panama City,Fla.));芳族氢化烃树脂,其可以商品名REGALREZ1094得自赫克力士公司(Hercules);以及α甲基苯乙烯树脂,其可以商品名KRISTALEX3070、3085和3100(它们分别具有70℃、85℃和100℃的软化点)得自赫克力士公司(Hercules)。
Mettler软化点低于120℃的热塑性聚合物可以基于粘合剂组合物的重量计0重量%至约20重量%、或甚至约0重量%至约10重量%的量存在于粘合剂组合物中。
其他添加剂
粘合剂可以任选地包含其他添加剂,包括例如抗氧化剂、增塑剂、增粘剂、助粘剂、非反应性树脂、紫外线稳定剂、催化剂、流变改性剂、杀微生物剂、缓蚀剂、脱水剂、有机溶剂、着色剂(如颜料和染料)、填充剂、表面活性剂、阻燃剂、蜡,以及它们的混合物。
粘合剂可以任选地包含硅烷助粘剂。示例性的硅烷助粘剂在大气压力下具有高于100℃的闪点,并且在0.5mmHg至15mmHg下具有高于100℃的沸点。硅烷助粘剂是平均分子量为约300至约1000、或约300至约800、或约500至约700的化合物或单体。可用的硅烷助粘剂包含甲硅烷基基团,诸如烷氧基甲硅烷基、丙烯酰氧基甲硅烷基、烷氧基亚氨基甲硅烷基、肟甲硅烷基、氨基甲硅烷基,以及它们的组合。可用的烷氧基甲硅烷基基团的例子包括甲氧基甲硅烷基、乙氧基甲硅烷基、丙氧基甲硅烷基、丁氧基甲硅烷基以及酰氧基甲硅烷基反应性基团包括如各种酸(包括如乙酸、2-乙基己酸、棕榈酸、硬脂酸和油酸)的甲硅烷基酯。
合适的硅烷助粘剂包括如甲基丙烯酰氧基丙基三乙氧基-硅烷、M-氨基苯基三乙氧基-硅烷、P-氨基苯基三乙氧基-硅烷、N-(2-氨基乙基)-3-氨基丙基三乙氧基-硅烷、正丁基氨基丙基三甲氧基-硅烷、双(三乙氧基甲硅烷基丙基)胺、双(三甲氧基甲硅烷基丙基)胺、3-(三甲氧基甲硅烷基)丙基琥珀酸酐、(3-缩水甘油氧基丙基)甲基二乙氧基-硅烷、(3-缩水甘油氧基丙基)甲基二甲氧基-硅烷、三(3-三甲氧基甲硅烷基丙基)异氰脲酸酯、双(三乙氧基甲硅烷基)乙烷、双(三甲氧基甲硅烷基)苯,以及它们的组合。
合适的硅烷助粘剂可以商品名SILQUEST A-1170和SILQUEST SILQUESTA-LINK597从美国纽约州奥尔巴尼市迈图高新材料集团有限公司(MomentivePerformance Materials,Inc.(Albany,New York))商购获得。
当存在硅烷助粘剂时,其优选地以基于组合物的重量计约0.01重量%至约5重量%、约0.01重量%至约2重量%、或甚至约0.01重量%至约1重量%的量存在。
粘合剂可以任选地包含增塑剂。合适的增塑剂包括如邻苯二甲酸酯、苯甲酸酯、磺酰胺和它们的混合物,以及环氧大豆油。邻苯二甲酸二辛酯和邻苯二甲酸二异癸酯的可用来源包括以商品名JAYFLEX DOP和JAYFLEX DIDP得自埃克森化工公司(Exxon Chemical)的那些。可用的二苯甲酸酯可以商品名BENZOFLEX9-88、BENZOFLEX50和BENZOFLEX400得自伊士曼化学公司(Eastman Chemical Co.)。大豆油可以商购获得,如以商品名FLEXOL EPO得自陶氏化学公司(Dow Chemical)。
增塑剂可以约0.25重量%至约10重量%、不大于约5重量%、不大于约3重量%、或甚至约0.5重量%至2重量%的量存在。
粘合剂可以任选地包含催化剂。合适的催化剂有利于多元醇与多异氰酸酯之间的反应、水解、和/或后续的硅烷基团、异氰酸酯基团或它们的组合的交联反应。可用的催化剂包括例如:叔胺,包括如N,N-二甲基氨乙醇、N,N-二甲基-环己胺-双(2-二甲基氨基乙基)醚、N-乙基吗啉、N,N,N',N',N''-五甲基-二亚乙基三胺、1-2(羟丙基)咪唑;以及金属催化剂,包括如锡(如二烷基锡二羧酸盐,如二丁基锡二月桂酸盐和二丁基锡二醋酸盐;羧酸的亚锡盐,如辛酸亚锡和乙酸亚锡;四丁基二油酸酯二锡氧烷(tetrabutyl dioleatodistannoxane))、钛化合物、羧酸铋盐、有机硅钛酸盐、烷基钛酸盐,以及它们的组合。
粘合剂可以任选地包含填充剂。合适的填料包括(例如)热解法二氧化硅、沉淀二氧化硅、滑石、碳酸钙、炭黑、硅酸铝、粘土、沸石、陶瓷、云母、二氧化钛,以及它们的组合。当粘合剂中存在填充剂时,填充剂优选地以至少0.5重量%、约1重量%至约50重量%、或甚至约1重量%至约10重量%的量存在。
制备和使用方法
本发明所公开的粘合剂可以在电子器件的整个制造过程中使用。在一些实施例中,使用粘合剂将电子组件的多个层粘合在一起。示例性的多层组件在图1中示出。图1示出一般性的组件10。组件10包括第一基材12和第二基材14。组件10包括至少一个位于基材12和基材14之间的电子元件20。应当理解,组件10可以包括不止一个电子元件20,如图1所示。
组件10可以任选地包括位于电子元件20与基材12和14之间的导电层16和18。导电层可以是导电涂层、导电油墨或导电粘合剂。导电层可以沿着基材连续(如图1所示),或不连续。示例性的导电层为铟-锡-氧化物(ITO)。电子元件20可以采用与导电层16和18直接或间接电连通的方式设置在第一基材12与第二基材14之间。直接连通可以是紧密接触,而间接连通可以是通过导电材料或导电介质。可能期望的是电子元件的一侧与阳极侧对应,而另一侧与阴极侧对应。
可使用粘合剂将组件10的各层粘结和/或密封在一起,采用的方式为将粘合剂24涂布至组件的边缘(如图2所示)或用粘合剂24灌涂组件(如图3所示)。
本发明所公开的粘合剂组合物可用于制造电子组件。当将粘合剂组合物与电子器件一起使用时,粘合剂组合物还可以充当导电粘合剂、半导电粘合剂、绝缘粘合剂或密封剂。组件可以包括多种电子元件。示例性的电子元件包括发光二极管(LED)、有机LED、高亮度LED、射频识别(RFID)标签、电致变色显示器、电泳显示器、电池、传感器、太阳能电池和光伏电池。
使用粘合剂将基材粘附在一起或将电子元件密封在两个基材之间可以提供类似保护电子元件免受诸如水分、紫外线辐射、氧气等因素影响的有益效果。其还可以提供保护以免受来自组件中的材料的逸出气体影响。其还可允许电子在两个基材之间运动。
在一些实施例中,本发明所公开的粘合剂可用于将各种电子元件层合在两个柔性基材之间。示例性的层合工艺包括卷对卷制造工艺。可采用多种方式将粘合剂涂布到基材上。例如,粘合剂能够以液态形式涂布。可以使用任何合适的涂布方法涂布粘合剂,所述方法包括如气刀、拖刀、喷涂、刷涂、浸渍、刮墨刀、辊涂、凹版涂布、照相凹版涂布、轮转凹版涂布、线性挤出机、手喷枪、挤出机凸缘,以及它们的组合。还可以将粘合剂以预定的图案印刷。还可以将粘合剂涂布到隔离衬片上,在此情况下将粘合剂/衬片复合物粘附至基材。
粘合剂优选地在约50℃至约150℃、约65℃至约130℃、或约75℃至约115℃的温度下以熔体形式涂布。粘合剂的涂层重量可以根据层合物所需特性而存在很大差异。可用的粘合剂涂层重量包括从1密耳至50密耳。在涂布粘合剂之前,第一基材和第二基材中的任一者在其上具有至少一个电子元件。一旦涂布了粘合剂,第一基材便与第二基材接触。第二基材可以是与第一基材相同或不同的材料。可将粘合处理重复多次,以使得可以制备出由不止两个粘合层构成的制品。允许粘合剂通过暴露于水分而固化。
在一些实施例中,可使用本发明所公开的粘合剂来密封电子元件,以便提供进一步保护。在此类应用中,可将粘合剂仅涂布至基材的边缘,或可将粘合剂涂布至基材的整个表面,从而将电子元件包封起来。可以使用上述的任何方法来涂布粘合剂。
在一些实施例中,作为制造工艺的一部分,可使用本发明所公开的粘合剂将元件粘合到一起。该应用类似于层合工艺,因为两个基材被粘合到了一起。然而,该工艺可以采用刚性和柔性基材。
基材
本发明所公开的粘合剂组合物可以与多种刚性或柔性基材一起使用。示例性的基材包括柔性薄膜诸如金属箔(铝箔)、聚合物薄膜和金属化聚合物薄膜,其中金属化聚合物薄膜由聚合物包括如聚烯烃(如聚丙烯、聚乙烯、低密度聚乙烯、线性低密度聚乙烯、高密度聚乙烯、聚丙烯和定向聚丙烯;聚烯烃和其他共聚单体的共聚物)、金属化聚烯烃(如金属化聚丙烯)、金属化聚醚对苯二甲酸酯、乙烯-乙酸乙烯酯、乙烯-甲基丙烯酸离聚物、乙烯-乙烯基醇、聚酯(如聚对苯二甲酸乙二醇酯)、聚碳酸酯、聚酰胺(如尼龙-6和尼龙-6,6)、聚氯乙烯、聚偏二氯乙烯、聚乳酸、纤维素、聚苯乙烯、玻璃纸和纸张制成。薄膜的厚度是可以变化的,但是柔性薄膜的厚度通常小于约0.25毫米,如从约10微米至约150微米,更通常的是从约8微米至约100微米。基材的表面可使用任何合适的方法包括例如电晕处理、化学处理和火焰处理进行表面处理,从而提高粘附力。
其他合适的基材包括如织造网、非织造网、纸张、纸板和多孔柔性片材(如,聚乙烯泡沫、聚氨酯泡沫、海绵和泡沫橡胶)。织造和非织造网可包含纤维,所述纤维包括如棉花、聚酯、聚烯烃、聚酰胺和聚酰亚胺纤维。
其他基材可以包括玻璃、透明塑料诸如聚烯烃、聚醚砜、聚碳酸酯、聚酯、聚芳酯,以及聚合物薄膜。
上述的说明书、实例和数据描述了本公开。在不脱离本公开的精神和范围的前提下可执行额外的实施例。除非另外指明,否则实例中所述的所有份数、比率、百分比和量均按重量计。
实例
测试方法
搭接剪切强度
搭接剪切强度根据ASTM D3163确定,其中试件被构造为在10密耳厚的聚对苯二甲酸乙二醇酯(PET)第一基材上具有5密耳的粘合剂涂层,所述第一基材层合至10密耳厚的聚对苯二甲酸乙二醇酯(PET)第二基材且具有1英寸×1英寸的基材重叠。
测定最大负载,并将结果报告为搭接剪切强度,单位是磅/平方英寸(psi)。报告三个样品的平均值。
湿蒸汽透过率(MVTR)
湿蒸汽透过率(MVTR)根据名称为“Standard Test Method for Water VaporTransmission Rate Through Plastic Film and Sheeting using a Modulated InfraredSensor”(利用调幅红外线传感器对水蒸气透过塑料薄膜和薄板的透过率的标准测试方法)的ASTM F1249-90确定。所述测试在大约37℃(100℉)和90%相对湿度下,针对具有指定厚度的薄膜的形式的样品进行。
剥离粘接强度测试方法
T-剥离强度根据并入本文中的名称为“Standard Test Method for PeelResistance of Adhesives”(粘合剂的耐剥离性的标准测试方法)的ASTMD1876-01确定。试件被构造为在10密耳厚的聚对苯二甲酸乙二醇酯(PET)第一基材上具有5密耳的粘合剂涂层,所述第一基材层合至10密耳厚的聚对苯二甲酸乙二醇酯(PET)第二基材且具有1英寸×1英寸的基材重叠。
剥离速度为12英寸/分钟。结果以磅/直线英寸报告。报告三个样品的平均值。
Mettler软化点
Mettler软化点根据名称为“Standard Test Methods for Softening Point ofHydrocarbon Resins and Rosin Based Resins by Automated Ring-and-BallApparatus”(用自动环球仪测定烃类树脂和基于松香的树脂的软化点的标准测试方法)的ASTM D6493-11确定。
实例1-4
根据本文所述的搭接剪切强度和剥离粘接强度测试方法,并通过将根据表1的反应性热熔粘合剂(其可从美国明尼苏达州圣保罗的富乐公司(H.B.FullerCompany(St.Paul,MN))商购获得)加热至适当的涂布温度、将熔融的粘合剂涂布至第一PET薄膜基材、然后立即将第一PET薄膜与第二PET薄膜基材层合以形成层合物并且用1千克的砝码滚压以确保充分接触而制备实例1-4的每种层合物。然后根据本文所述的搭接剪切强度测试方法和剥离强度测试方法测试所述层合物。结果也在表1中列出。
表1
TL5207--包含脂族异氰酸酯封端的聚氨酯预聚物且不具有热塑性组分的反应性热熔粘合剂;
HL9647--包含硅烷官能聚α烯烃聚合物、Mettler软化点(SP)为138℃的热塑性聚合物以及Mettler SP为115℃的热塑性树脂的反应性热熔粘合剂;
EH9630--包含硅烷化封端的聚α烯烃、Mettler SP高于120℃的热塑性弹性体、Mettler SP为107℃的热塑性聚合物以及Mettler SP为94℃的热塑性树脂的反应性热熔粘合剂;
EH9640LT--包含芳族异氰酸酯封端的聚氨酯预聚物、Mettler SP>120℃的热塑性弹性体、Mettler SP<为120℃的热塑性聚合物以及Mettler SP为100℃的热塑性树脂的反应性热熔粘合剂。
*SF:基材失效。
上述的说明书、实例和数据描述了本公开。在不脱离本公开的精神和范围的前提下可执行额外的实施例。
Claims (17)
1.一种制备电子组件的方法,包括:
将包含大气固化预聚物的反应性热熔粘合剂组合物涂布至第一基材的至少一部分,以及
使所述第一基材上的所述粘合剂与第二基材的至少一部分接触,所述第一和第二基材中的至少一个在涂布所述粘合剂组合物之前包括至少一个电子元件。
2.根据权利要求1所述的方法,其中所述粘合剂还包含Mettler软化点为至少120℃的热塑性组分。
3.根据权利要求1所述的方法,其中所述粘合剂是湿固化性的。
4.根据权利要求1所述的方法,其中所述大气固化预聚物选自异氰酸酯封端的聚氨酯预聚物、硅烷化封端的聚氨酯预聚物、硅烷官能的聚α烯烃聚合物,以及它们的组合。
5.根据权利要求1所述的方法,其中所述大气固化预聚物为脂族异氰酸酯封端的聚氨酯预聚物。
6.根据权利要求1所述的方法,其中所述粘合剂在室温下为固体,并且具有150℃或更低的Mettler软化点。
7.根据权利要求1所述的方法,其中所述粘合剂为单组分粘合剂。
8.根据权利要求1所述的方法,其中所述第一和第二基材的材料相同或不同,并且独立地选自聚乙烯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯,以及它们的混合物。
9.根据权利要求1所述的方法,其中所述电子元件选自发光二极管(LED)、有机LED、高亮度LED、射频识别(RFID)标签、电致变色显示器、电泳显示器、电池、传感器、太阳能电池和光伏电池。
10.根据权利要求1所述的方法,其中所述粘合剂还包含Mettler软化点低于120℃的热塑性组分。
11.一种电子组件,包括:
第一基材,
第二基材,
至少一个位于所述第一和第二基材之间的电子元件,以及
包含大气固化预聚物和水分的反应产物的反应性热熔粘合剂;
其中所述第一基材的至少一部分通过所述粘合剂粘合到所述第二基材的至少一部分。
12.根据权利要求11所述的组件,其中所述大气固化预聚物选自异氰酸酯封端的聚氨酯预聚物、硅烷化封端的聚氨酯预聚物、硅烷官能的聚α烯烃聚合物,以及它们的组合。
13.根据权利要求11所述的组件,其中所述第一和第二基材的材料相同或不同,并且独立地选自聚乙烯、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯,以及它们的混合物。
14.根据权利要求11所述的组件,其中所述电子元件选自发光二极管(LED)、有机LED、高亮度LED、射频识别(RFID)标签、电致变色显示器、电泳显示器、电池、传感器、太阳能电池和光伏电池。
15.根据权利要求11所述的组件,其中所述粘合剂还包含Mettler软化点为至少120℃的热塑性组分。
16.根据权利要求11所述的组件,其中所述粘合剂还包含Mettler软化点低于120℃的热塑性组分。
17.根据权利要求11所述的组件,其中所述粘合剂还包含选自下列的添加剂:抗氧化剂、增塑剂、增粘剂、助粘剂、非反应性树脂、紫外线稳定剂、催化剂、流变改性剂、杀微生物剂、缓蚀剂、脱水剂、有机溶剂、着色剂、填充剂、表面活性剂、阻燃剂、蜡,以及它们的混合物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161510784P | 2011-07-22 | 2011-07-22 | |
US61/510,784 | 2011-07-22 | ||
PCT/US2012/047383 WO2013016130A2 (en) | 2011-07-22 | 2012-07-19 | A reactive hot-melt adhesive for use on electronics |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103717688A true CN103717688A (zh) | 2014-04-09 |
Family
ID=46634521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280036280.0A Pending CN103717688A (zh) | 2011-07-22 | 2012-07-19 | 在电子器件上使用的反应性热熔粘合剂 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9659832B2 (zh) |
KR (1) | KR20140044866A (zh) |
CN (1) | CN103717688A (zh) |
WO (1) | WO2013016130A2 (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104804699A (zh) * | 2015-05-20 | 2015-07-29 | 东莞市新懿电子材料技术有限公司 | 一种热熔胶 |
CN105199653A (zh) * | 2015-10-26 | 2015-12-30 | 江苏钟山化工有限公司 | 一种高强度低粘度硅烷改性聚氨酯树脂 |
CN105593329A (zh) * | 2014-08-15 | 2016-05-18 | H.B.富乐公司 | 可返工的湿固化型热熔粘合剂组合物、其使用方法和包含其的制品 |
CN108587553A (zh) * | 2018-05-09 | 2018-09-28 | 佛山市三水日邦化工有限公司 | 一种改性聚氨酯树脂热熔胶 |
CN108865044A (zh) * | 2018-06-19 | 2018-11-23 | 佛山腾鲤新能源科技有限公司 | 一种太阳能光伏电池组件密封胶的制备方法 |
CN109370504A (zh) * | 2018-10-09 | 2019-02-22 | 高鼎精细化工(昆山)有限公司 | 一种光伏组件背板复合用单组份无溶剂聚氨酯胶黏剂及制备方法 |
TWI691571B (zh) * | 2014-07-02 | 2020-04-21 | 德商漢高股份有限及兩合公司 | 可移除之聚氨酯熱熔黏著劑及其用途 |
CN111408515A (zh) * | 2019-01-07 | 2020-07-14 | 欧菲影像技术(广州)有限公司 | 点胶装置、点胶方法和电子器件 |
WO2021119985A1 (en) * | 2019-12-17 | 2021-06-24 | Henkel Ag & Co. Kgaa | Polyurethane hot melt adhesive composition, and preparation method thereof |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10144553B2 (en) * | 2012-07-04 | 2018-12-04 | Basf Se | Bonded packaging system for foods |
US9982173B2 (en) * | 2014-03-11 | 2018-05-29 | Sika Technology Ag | Polyurethane hot-melt adhesive having a low content of diisocyanate monomers and good cross-linking speed |
JP6499490B2 (ja) * | 2015-04-02 | 2019-04-10 | アイカ工業株式会社 | ホットメルトシール組成物 |
CN104845573B (zh) * | 2015-04-30 | 2018-03-20 | 安吉县广泰化工纸业有限公司 | 耐高温双组份酯溶性聚氨酯粘胶剂及其制备方法 |
US10358587B2 (en) * | 2016-02-09 | 2019-07-23 | Gm Global Technology Operations Llc. | Seal material with latent adhesive properties and a method of sealing fuel cell components with same |
JP2019509638A (ja) * | 2016-03-31 | 2019-04-04 | ダウ グローバル テクノロジーズ エルエルシー | 不動態化薄膜トランジスタコンポーネント |
US10787596B2 (en) | 2017-03-09 | 2020-09-29 | H. B. Fuller Company | Reactive hot melt adhesive having high initial strength, good heat stability and low monomeric diisocyanate |
MX2019014383A (es) * | 2017-06-02 | 2020-01-23 | Ppg Ind Ohio Inc | Polimeros, composiciones de revestimiento que contienen dichos polimeros, y revestimientos anti-huellas digitales formados de los mismos. |
CN107383325B (zh) * | 2017-06-28 | 2020-02-07 | 苏州奥斯汀新材料科技有限公司 | 一种高透明热塑性聚氨酯弹性体的制备方法 |
US10319687B1 (en) * | 2018-03-12 | 2019-06-11 | Honeywell International Inc. | Soluble sensor node and method of manufacture |
CA3135979C (en) * | 2019-04-03 | 2023-12-19 | Saint-Gobain Abrasives, Inc. | Abrasive article, abrasive system and method for using and forming same |
EP4021706A1 (en) | 2019-08-26 | 2022-07-06 | H.B. Fuller Company | Fast set moisture curable hot melt adhesive composition and articles including the same |
DE212020000366U1 (de) * | 2019-11-25 | 2021-02-23 | Murata Manufacturing Co., Ltd. | RFIC-Modul und RFID-Transponder |
EP4288502A1 (en) * | 2021-02-03 | 2023-12-13 | Henkel AG & Co. KGaA | Thermally stable filled polyurethane reactive hot melt |
WO2023217728A1 (en) * | 2022-05-09 | 2023-11-16 | Arlanxeo Deutschland Gmbh | Amorphous eva-polymers and their use |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2347818A1 (en) * | 1998-10-22 | 2000-05-04 | Henkel Kommanditgesellschaft Auf Aktien | Hot-melt adhesive component layers for smart cards |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1745526B2 (de) | 1967-03-16 | 1980-04-10 | Union Carbide Corp., New York, N.Y. (V.St.A.) | Verfahren zur Herstellung vulkanisierbarer, unter wasserfreien Bedingungen beständiger Polymerisate |
US4146585A (en) | 1977-03-02 | 1979-03-27 | Union Carbide Corporation | Process for preparing silane grafted polymers |
US4345053A (en) | 1981-07-17 | 1982-08-17 | Essex Chemical Corp. | Silicon-terminated polyurethane polymer |
US4645816A (en) | 1985-06-28 | 1987-02-24 | Union Carbide Corporation | Novel vulcanizable silane-terminated polyurethane polymers |
US4775719A (en) | 1986-01-29 | 1988-10-04 | H. B. Fuller Company | Thermally stable hot melt moisture-cure polyurethane adhesive composition |
US4808255A (en) | 1987-05-07 | 1989-02-28 | H. B. Fuller Company | Thermally stable reactive hot melt urethane adhesive composition having a thermoplastic polymer, a compatible, curing urethane polyester polyol prepolymer and a tackifying agent |
US4820368A (en) | 1987-05-07 | 1989-04-11 | H. B. Fuller Company | Thermally stable reactive hot melt urethane adhesive composition having a thermoplastic polymer, a compatible, curing urethane polyalkylene polyol prepolymer and a tackifying agent |
US4960844A (en) | 1988-08-03 | 1990-10-02 | Products Research & Chemical Corporation | Silane terminated liquid polymers |
JPH03111475A (ja) * | 1989-09-27 | 1991-05-13 | Sekisui Chem Co Ltd | 反応性ホットメルト型接着剤組成物 |
DE4000695C2 (de) | 1990-01-12 | 1997-07-03 | Huels Chemische Werke Ag | Weitgehend amorphe Polyalphaolefine mit enger Molekulargewichtsverteilung, Verfahren zu deren Herstellung und Verwendung für Teppichschwerbeschichtungsmassen oder Schmelzklebstoffe |
DE69106134T2 (de) | 1990-03-30 | 1995-05-11 | H.B. Fuller Licensing & Financing, Inc., Wilmington, Del. | Wasserhärtbarer polyurethanheissschmelzklebstoff. |
JPH05270173A (ja) | 1992-03-24 | 1993-10-19 | Mitsubishi Plastics Ind Ltd | カード基材 |
JPH0823116A (ja) * | 1994-07-07 | 1996-01-23 | Sunstar Eng Inc | 太陽電池モジュールとその製造方法 |
DE4446027A1 (de) * | 1994-12-23 | 1996-07-04 | Henkel Kgaa | Formteile aus PU-Schmelzklebstoffen |
JPH0955530A (ja) * | 1995-08-14 | 1997-02-25 | Sunstar Eng Inc | 太陽電池モジュールおよびその製造法 |
EP0827994B1 (de) | 1996-09-04 | 2002-12-18 | Degussa AG | Verwendung von silangepfropften amorphen Poly-alpha-Olefinen als feuchtigkeitsvernetzender Klebrohstoff oder Klebstoff |
US6355317B1 (en) | 1997-06-19 | 2002-03-12 | H. B. Fuller Licensing & Financing, Inc. | Thermoplastic moisture cure polyurethanes |
JP2000148959A (ja) * | 1998-11-13 | 2000-05-30 | Henkel Japan Ltd | Icカードの製造法 |
US20060084755A1 (en) * | 2004-10-19 | 2006-04-20 | Good David J | Reactive hot melt adhesive with block acrylic copolymer |
DE102007015083A1 (de) * | 2007-03-29 | 2008-10-02 | Clariant International Limited | Flammgeschützte Klebe- und Dichtmassen |
JP5566051B2 (ja) * | 2009-05-28 | 2014-08-06 | ヘンケルジャパン株式会社 | Icカード用湿気硬化型ホットメルト接着剤 |
DE202010003295U1 (de) * | 2010-03-05 | 2010-06-24 | H.B. Fuller Co., Saint Paul | Solarpaneel |
KR20140044868A (ko) * | 2011-07-22 | 2014-04-15 | 에이치. 비. 풀러, 컴퍼니 | 전자장치 상에 사용하기 위한 1성분 이중 경화 접착제 |
-
2012
- 2012-07-19 US US14/233,962 patent/US9659832B2/en active Active
- 2012-07-19 KR KR1020147001611A patent/KR20140044866A/ko not_active Application Discontinuation
- 2012-07-19 WO PCT/US2012/047383 patent/WO2013016130A2/en active Application Filing
- 2012-07-19 CN CN201280036280.0A patent/CN103717688A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2347818A1 (en) * | 1998-10-22 | 2000-05-04 | Henkel Kommanditgesellschaft Auf Aktien | Hot-melt adhesive component layers for smart cards |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI691571B (zh) * | 2014-07-02 | 2020-04-21 | 德商漢高股份有限及兩合公司 | 可移除之聚氨酯熱熔黏著劑及其用途 |
CN105593329A (zh) * | 2014-08-15 | 2016-05-18 | H.B.富乐公司 | 可返工的湿固化型热熔粘合剂组合物、其使用方法和包含其的制品 |
CN105593329B (zh) * | 2014-08-15 | 2020-01-24 | H.B.富乐公司 | 可返工的湿固化型热熔粘合剂组合物、其使用方法和包含其的制品 |
CN104804699A (zh) * | 2015-05-20 | 2015-07-29 | 东莞市新懿电子材料技术有限公司 | 一种热熔胶 |
CN105199653A (zh) * | 2015-10-26 | 2015-12-30 | 江苏钟山化工有限公司 | 一种高强度低粘度硅烷改性聚氨酯树脂 |
CN105199653B (zh) * | 2015-10-26 | 2018-07-06 | 江苏钟山化工有限公司 | 一种高强度低粘度硅烷改性聚氨酯树脂 |
CN108587553A (zh) * | 2018-05-09 | 2018-09-28 | 佛山市三水日邦化工有限公司 | 一种改性聚氨酯树脂热熔胶 |
CN108865044A (zh) * | 2018-06-19 | 2018-11-23 | 佛山腾鲤新能源科技有限公司 | 一种太阳能光伏电池组件密封胶的制备方法 |
CN109370504A (zh) * | 2018-10-09 | 2019-02-22 | 高鼎精细化工(昆山)有限公司 | 一种光伏组件背板复合用单组份无溶剂聚氨酯胶黏剂及制备方法 |
CN111408515A (zh) * | 2019-01-07 | 2020-07-14 | 欧菲影像技术(广州)有限公司 | 点胶装置、点胶方法和电子器件 |
WO2021119985A1 (en) * | 2019-12-17 | 2021-06-24 | Henkel Ag & Co. Kgaa | Polyurethane hot melt adhesive composition, and preparation method thereof |
CN114846107A (zh) * | 2019-12-17 | 2022-08-02 | 汉高股份有限及两合公司 | 聚氨酯热熔粘合剂组合物和它的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2013016130A2 (en) | 2013-01-31 |
US9659832B2 (en) | 2017-05-23 |
WO2013016130A3 (en) | 2013-12-19 |
KR20140044866A (ko) | 2014-04-15 |
US20140242323A1 (en) | 2014-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103717688A (zh) | 在电子器件上使用的反应性热熔粘合剂 | |
CN103703087B (zh) | 用在电子器件上的单组分双固化粘合剂 | |
US10898389B2 (en) | Breathable self-adhesive articles | |
CN102459487B (zh) | 含有反应性改性剂的可湿气固化的甲硅烷基化的聚合物组合物 | |
CN105925230A (zh) | 耐油化学的湿固化型热熔粘合剂组合物以及包含该组合物的制品 | |
CN106232668B (zh) | 具有低单体二异氰酸酯含量和良好交联速度的聚氨酯热熔粘合剂 | |
CN109609043A (zh) | 表面保护膜 | |
CN110087696B (zh) | 用于粘合具有低表面能的基材的自粘组合物 | |
US10066046B2 (en) | One-component laminating adhesive having silane cross-linking | |
US7033668B2 (en) | Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface | |
CN113195666B (zh) | 湿气固化型热熔接着剂 | |
US11920065B2 (en) | Self-adhesive composition for bonding substrates with low surface energy | |
CN104755573A (zh) | 与未涂布的铝质工具具有低粘附的反应性聚烯烃热熔粘合剂及其作为层合热熔胶的用途 | |
US8178614B2 (en) | Laminate containing solvent resistant polyurethane adhesive compositions | |
US20230272253A1 (en) | Adhesive composition for making waterproof breathable articles | |
TW202200745A (zh) | 濕氣硬化型熱熔接著劑 | |
US20240117230A1 (en) | Methods for using adhesives which are thermally-reversible and temperature-sensitive | |
JP2023173839A (ja) | 粘着フィルムおよび粘着フィルムの製造方法 | |
TW202200746A (zh) | 濕氣硬化型熱熔接著劑 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1196392 Country of ref document: HK |
|
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140409 |
|
REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1196392 Country of ref document: HK |