JPWO2021006037A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2021006037A5
JPWO2021006037A5 JP2021530582A JP2021530582A JPWO2021006037A5 JP WO2021006037 A5 JPWO2021006037 A5 JP WO2021006037A5 JP 2021530582 A JP2021530582 A JP 2021530582A JP 2021530582 A JP2021530582 A JP 2021530582A JP WO2021006037 A5 JPWO2021006037 A5 JP WO2021006037A5
Authority
JP
Japan
Prior art keywords
electrode pad
signal line
transmission line
electrode
line according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021530582A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021006037A1 (https=
JP7276455B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2020/024785 external-priority patent/WO2021006037A1/ja
Publication of JPWO2021006037A1 publication Critical patent/JPWO2021006037A1/ja
Publication of JPWO2021006037A5 publication Critical patent/JPWO2021006037A5/ja
Application granted granted Critical
Publication of JP7276455B2 publication Critical patent/JP7276455B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021530582A 2019-07-05 2020-06-24 伝送線路、および電子機器 Active JP7276455B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019126069 2019-07-05
JP2019126069 2019-07-05
PCT/JP2020/024785 WO2021006037A1 (ja) 2019-07-05 2020-06-24 伝送線路、および電子機器

Publications (3)

Publication Number Publication Date
JPWO2021006037A1 JPWO2021006037A1 (https=) 2021-01-14
JPWO2021006037A5 true JPWO2021006037A5 (https=) 2022-01-19
JP7276455B2 JP7276455B2 (ja) 2023-05-18

Family

ID=74114750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021530582A Active JP7276455B2 (ja) 2019-07-05 2020-06-24 伝送線路、および電子機器

Country Status (4)

Country Link
US (1) US11984637B2 (https=)
JP (1) JP7276455B2 (https=)
CN (1) CN217363377U (https=)
WO (1) WO2021006037A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250049703A (ko) * 2023-10-05 2025-04-14 삼성에스디아이 주식회사 스파크 갭을 포함하는 다중구조 커넥터

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10255925A (ja) * 1997-03-11 1998-09-25 Canon Inc 接続装置
JP4606783B2 (ja) * 2003-07-25 2011-01-05 新光電気工業株式会社 半導体装置
US20050201065A1 (en) 2004-02-13 2005-09-15 Regnier Kent E. Preferential ground and via exit structures for printed circuit boards
WO2005086554A1 (en) * 2004-03-09 2005-09-15 Nec Corporation Via transmission lines for multilayer printed circuit boards
CN106465541B (zh) 2014-12-01 2019-06-18 株式会社村田制作所 电子设备、电气元件以及电气元件用托盘
JP6521673B2 (ja) * 2015-02-27 2019-05-29 住友電工プリントサーキット株式会社 プリント配線板
JP6197979B1 (ja) 2015-12-07 2017-09-20 株式会社村田製作所 樹脂基板および電子機器
JP2018082070A (ja) * 2016-11-17 2018-05-24 京セラ株式会社 配線基板およびこれを用いた電子装置
TW201816967A (zh) 2016-10-28 2018-05-01 京瓷股份有限公司 佈線基板以及使用了該佈線基板的電子裝置
JP6383830B2 (ja) * 2017-04-03 2018-08-29 株式会社フジクラ プリント配線板

Similar Documents

Publication Publication Date Title
JP7129444B2 (ja) 電子機器
JP5904856B2 (ja) プリント配線板、半導体パッケージ及びプリント回路板
TWI544844B (zh) A hardware and software circuit board with impedance control structure
JP5999239B2 (ja) 信号伝送部品および電子機器
JP5842850B2 (ja) フラットケーブルおよび電子機器
US9699887B2 (en) Circuit board and electronic device
JP2014082455A5 (ja) フレキシブル基板、基板接続構造及び光モジュール
CN205752476U (zh) 传输线路构件
KR102442838B1 (ko) 3층 유전체 및 4층 그라운드 레이어 구조를 갖는 연성회로기판
JP2013225610A5 (https=)
US8420946B2 (en) Printed circuit board
JP2012238848A5 (https=)
IL275262B2 (en) Additive manufacturing technology (amt) low profile signal divider
US20150318595A1 (en) Transmission line and electronic device
JPWO2021246467A5 (https=)
CN103052256A (zh) 柔性印刷电路板
JP6197979B1 (ja) 樹脂基板および電子機器
JPWO2021006037A5 (https=)
US9565750B2 (en) Wiring board for mounting a semiconductor element
CN207559958U (zh) 带滤波器电路的布线基板及电子设备
JP6197954B2 (ja) 部品内蔵基板および部品内蔵基板の製造方法
WO2020121984A1 (ja) 電子機器、および、フラットケーブル
JP4605930B2 (ja) 高周波半導体素子収納用パッケージ
JPWO2021230289A5 (ja) 半導体装置
JP6135825B2 (ja) 伝送線路部材