JPWO2021246467A5 - - Google Patents
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- Publication number
- JPWO2021246467A5 JPWO2021246467A5 JP2022528882A JP2022528882A JPWO2021246467A5 JP WO2021246467 A5 JPWO2021246467 A5 JP WO2021246467A5 JP 2022528882 A JP2022528882 A JP 2022528882A JP 2022528882 A JP2022528882 A JP 2022528882A JP WO2021246467 A5 JPWO2021246467 A5 JP WO2021246467A5
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- resin layer
- conductor
- conductor pattern
- multilayer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 65
- 239000010410 layer Substances 0.000 claims description 42
- 229920005992 thermoplastic resin Polymers 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 32
- 239000011229 interlayer Substances 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 4
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020096562 | 2020-06-03 | ||
| JP2020096562 | 2020-06-03 | ||
| PCT/JP2021/021109 WO2021246467A1 (ja) | 2020-06-03 | 2021-06-03 | 多層基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021246467A1 JPWO2021246467A1 (https=) | 2021-12-09 |
| JPWO2021246467A5 true JPWO2021246467A5 (https=) | 2023-01-24 |
| JP7338793B2 JP7338793B2 (ja) | 2023-09-05 |
Family
ID=78831224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022528882A Active JP7338793B2 (ja) | 2020-06-03 | 2021-06-03 | 多層基板及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12336093B2 (https=) |
| JP (1) | JP7338793B2 (https=) |
| CN (1) | CN219204859U (https=) |
| WO (1) | WO2021246467A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI884561B (zh) * | 2023-02-13 | 2025-05-21 | 胡迪群 | 半導體基板及其製造方法 |
| US12148688B2 (en) | 2023-02-13 | 2024-11-19 | Dyi-chung Hu | Semiconductor substrate and manufacturing method thereof |
| CN121040212A (zh) * | 2023-04-20 | 2025-11-28 | 株式会社村田制作所 | 电路基板以及电路基板的制造方法 |
| WO2026048351A1 (ja) * | 2024-09-02 | 2026-03-05 | 日東電工株式会社 | フレキシブル多層回路基板 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4186756B2 (ja) * | 2003-08-29 | 2008-11-26 | 松下電器産業株式会社 | 回路基板及びその製造方法 |
| US6908960B2 (en) * | 1999-12-28 | 2005-06-21 | Tdk Corporation | Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin |
| JP2002026520A (ja) | 2000-07-06 | 2002-01-25 | Matsushita Electric Ind Co Ltd | 多層配線基板及びその製造方法 |
| TW550997B (en) * | 2001-10-18 | 2003-09-01 | Matsushita Electric Industrial Co Ltd | Module with built-in components and the manufacturing method thereof |
| JP4181778B2 (ja) * | 2002-02-05 | 2008-11-19 | ソニー株式会社 | 配線基板の製造方法 |
| JP2005251949A (ja) * | 2004-03-03 | 2005-09-15 | Sony Corp | 配線基板及びその製造方法 |
| JP5293060B2 (ja) * | 2008-10-02 | 2013-09-18 | 株式会社デンソー | 多層回路基板およびその製造方法 |
| WO2011058938A1 (ja) * | 2009-11-10 | 2011-05-19 | 株式会社村田製作所 | 多層基板およびその製造方法 |
| CN103329637B (zh) | 2011-02-08 | 2016-04-13 | 株式会社村田制作所 | 树脂多层基板及其制造方法 |
| CN103430639B (zh) * | 2011-03-17 | 2016-09-28 | 株式会社村田制作所 | 树脂多层基板 |
| JP6641726B2 (ja) * | 2015-05-13 | 2020-02-05 | 株式会社村田製作所 | 樹脂多層基板の製造方法 |
| EP3926756A4 (en) * | 2019-02-13 | 2022-11-09 | The University of Tokyo | CIRCUIT SUBSTRATE, ANTENNA ELEMENT, MILLIMETER WAVE ABSORBER FOR INCORPORATION INTO A SUBSTRATE AND METHOD OF NOISE REDUCTION IN A CIRCUIT SUBSTRATE |
| JP7325891B2 (ja) * | 2019-10-24 | 2023-08-15 | エルジー・ケム・リミテッド | 多層印刷回路基板用絶縁層、これを含む多層印刷回路基板およびその製造方法 |
-
2021
- 2021-06-03 WO PCT/JP2021/021109 patent/WO2021246467A1/ja not_active Ceased
- 2021-06-03 JP JP2022528882A patent/JP7338793B2/ja active Active
- 2021-06-03 CN CN202190000490.9U patent/CN219204859U/zh active Active
-
2022
- 2022-11-02 US US17/979,032 patent/US12336093B2/en active Active
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