CN219204859U - 多层基板 - Google Patents

多层基板 Download PDF

Info

Publication number
CN219204859U
CN219204859U CN202190000490.9U CN202190000490U CN219204859U CN 219204859 U CN219204859 U CN 219204859U CN 202190000490 U CN202190000490 U CN 202190000490U CN 219204859 U CN219204859 U CN 219204859U
Authority
CN
China
Prior art keywords
conductor
thermoplastic resin
multilayer substrate
interlayer connection
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202190000490.9U
Other languages
English (en)
Chinese (zh)
Inventor
西尾恒亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN219204859U publication Critical patent/CN219204859U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202190000490.9U 2020-06-03 2021-06-03 多层基板 Active CN219204859U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-096562 2020-06-03
JP2020096562 2020-06-03
PCT/JP2021/021109 WO2021246467A1 (ja) 2020-06-03 2021-06-03 多層基板及びその製造方法

Publications (1)

Publication Number Publication Date
CN219204859U true CN219204859U (zh) 2023-06-16

Family

ID=78831224

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202190000490.9U Active CN219204859U (zh) 2020-06-03 2021-06-03 多层基板

Country Status (4)

Country Link
US (1) US12336093B2 (https=)
JP (1) JP7338793B2 (https=)
CN (1) CN219204859U (https=)
WO (1) WO2021246467A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884561B (zh) * 2023-02-13 2025-05-21 胡迪群 半導體基板及其製造方法
US12148688B2 (en) 2023-02-13 2024-11-19 Dyi-chung Hu Semiconductor substrate and manufacturing method thereof
CN121040212A (zh) * 2023-04-20 2025-11-28 株式会社村田制作所 电路基板以及电路基板的制造方法
WO2026048351A1 (ja) * 2024-09-02 2026-03-05 日東電工株式会社 フレキシブル多層回路基板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4186756B2 (ja) * 2003-08-29 2008-11-26 松下電器産業株式会社 回路基板及びその製造方法
US6908960B2 (en) * 1999-12-28 2005-06-21 Tdk Corporation Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin
JP2002026520A (ja) 2000-07-06 2002-01-25 Matsushita Electric Ind Co Ltd 多層配線基板及びその製造方法
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Industrial Co Ltd Module with built-in components and the manufacturing method thereof
JP4181778B2 (ja) * 2002-02-05 2008-11-19 ソニー株式会社 配線基板の製造方法
JP2005251949A (ja) * 2004-03-03 2005-09-15 Sony Corp 配線基板及びその製造方法
JP5293060B2 (ja) * 2008-10-02 2013-09-18 株式会社デンソー 多層回路基板およびその製造方法
WO2011058938A1 (ja) * 2009-11-10 2011-05-19 株式会社村田製作所 多層基板およびその製造方法
CN103329637B (zh) 2011-02-08 2016-04-13 株式会社村田制作所 树脂多层基板及其制造方法
CN103430639B (zh) * 2011-03-17 2016-09-28 株式会社村田制作所 树脂多层基板
JP6641726B2 (ja) * 2015-05-13 2020-02-05 株式会社村田製作所 樹脂多層基板の製造方法
EP3926756A4 (en) * 2019-02-13 2022-11-09 The University of Tokyo CIRCUIT SUBSTRATE, ANTENNA ELEMENT, MILLIMETER WAVE ABSORBER FOR INCORPORATION INTO A SUBSTRATE AND METHOD OF NOISE REDUCTION IN A CIRCUIT SUBSTRATE
JP7325891B2 (ja) * 2019-10-24 2023-08-15 エルジー・ケム・リミテッド 多層印刷回路基板用絶縁層、これを含む多層印刷回路基板およびその製造方法

Also Published As

Publication number Publication date
JP7338793B2 (ja) 2023-09-05
WO2021246467A1 (ja) 2021-12-09
US12336093B2 (en) 2025-06-17
JPWO2021246467A1 (https=) 2021-12-09
US20230053211A1 (en) 2023-02-16

Similar Documents

Publication Publication Date Title
CN219204859U (zh) 多层基板
CN211606926U (zh) 内插器以及电子设备
JP6065119B2 (ja) 多層基板
CN105474762B (zh) 多层基板的制造方法及多层基板
CN110402615A (zh) 高频传输用印刷线路板
CN213124101U (zh) 多层基板以及多层基板的安装构造
JP6741183B2 (ja) 多層基板および電気素子
JP2000151041A (ja) プリント配線板
JP2017208371A (ja) 回路基板、回路基板の製造方法及び電子装置
JP7597526B2 (ja) 表面実装型受動部品
CN111149177B (zh) 电感器及其制造方法
US12328857B2 (en) Electronic component module and method of manufacturing electronic component module
JP2019021863A (ja) 多層基板
US12376221B2 (en) Circuit board and method of manufacturing circuit board
CN211828497U (zh) 树脂多层基板以及电子设备
US11856693B2 (en) Resin multilayer substrate and method for manufacturing resin multilayer substrate
CN217405406U (zh) 多层基板
JP7480861B2 (ja) 積層基板および積層基板の製造方法
CN218587412U (zh) 多层基板
JP7095739B2 (ja) 電気素子の製造方法
JP2006261586A (ja) コイル部品の製造方法
CN119521570A (zh) 电路板的制作方法以及电路板
JPWO2022113779A5 (https=)

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant