JPWO2022113779A5 - - Google Patents
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- Publication number
- JPWO2022113779A5 JPWO2022113779A5 JP2022565222A JP2022565222A JPWO2022113779A5 JP WO2022113779 A5 JPWO2022113779 A5 JP WO2022113779A5 JP 2022565222 A JP2022565222 A JP 2022565222A JP 2022565222 A JP2022565222 A JP 2022565222A JP WO2022113779 A5 JPWO2022113779 A5 JP WO2022113779A5
- Authority
- JP
- Japan
- Prior art keywords
- laminated substrate
- conductor
- opening
- view
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 100
- 239000000758 substrate Substances 0.000 claims description 90
- 238000005452 bending Methods 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims 3
- 229920005989 resin Polymers 0.000 description 60
- 239000011347 resin Substances 0.000 description 60
- 239000000463 material Substances 0.000 description 48
- 239000010410 layer Substances 0.000 description 27
- 239000011229 interlayer Substances 0.000 description 16
- 230000004048 modification Effects 0.000 description 14
- 238000012986 modification Methods 0.000 description 14
- 239000012790 adhesive layer Substances 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 9
- 239000011295 pitch Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020198383 | 2020-11-30 | ||
| JP2020198383 | 2020-11-30 | ||
| PCT/JP2021/041721 WO2022113779A1 (ja) | 2020-11-30 | 2021-11-12 | 積層基板および積層基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022113779A1 JPWO2022113779A1 (https=) | 2022-06-02 |
| JPWO2022113779A5 true JPWO2022113779A5 (https=) | 2023-08-02 |
| JP7480861B2 JP7480861B2 (ja) | 2024-05-10 |
Family
ID=81755933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022565222A Active JP7480861B2 (ja) | 2020-11-30 | 2021-11-12 | 積層基板および積層基板の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12477648B2 (https=) |
| JP (1) | JP7480861B2 (https=) |
| CN (1) | CN219802645U (https=) |
| WO (1) | WO2022113779A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3679500A (en) * | 1970-08-07 | 1972-07-25 | Dainippon Screen Mfg | Method for forming perforations in metal sheets by etching |
| US3971661A (en) * | 1972-06-14 | 1976-07-27 | Westinghouse Electric Corporation | Formation of openings in dielectric sheet |
| JP3282347B2 (ja) * | 1993-09-07 | 2002-05-13 | ソニー株式会社 | エッチング法、色選別機構及びその作製方法、並びに、陰極線管 |
| JP3206428B2 (ja) * | 1996-04-09 | 2001-09-10 | ティーディーケイ株式会社 | ヘッドジンバルアセンブリを具備するハードディスク装置 |
| KR100339373B1 (ko) * | 1998-10-13 | 2002-07-18 | 구자홍 | 마이크로스트립카플러및그의제조방법 |
| US6449839B1 (en) * | 2000-09-06 | 2002-09-17 | Visteon Global Tech., Inc. | Electrical circuit board and a method for making the same |
| JP3848531B2 (ja) * | 2000-11-30 | 2006-11-22 | Ｔｄｋ株式会社 | 磁気記録用ヘッドジンバルアセンブリ |
| US20050110138A1 (en) * | 2003-11-25 | 2005-05-26 | Banpil Photonics, Inc. | High Speed Electrical On-Chip Interconnects and Method of Manufacturing |
| JP2005191903A (ja) * | 2003-12-25 | 2005-07-14 | Ngk Spark Plug Co Ltd | メッシュホールグランドストリップライン構造を有する積層体基板 |
| JP2007207629A (ja) * | 2006-02-02 | 2007-08-16 | Sumitomo Electric Ind Ltd | フレキシブルフラットケーブル |
| JP5477422B2 (ja) * | 2012-01-06 | 2014-04-23 | 株式会社村田製作所 | 高周波信号線路 |
| WO2015005029A1 (ja) * | 2013-07-11 | 2015-01-15 | 株式会社村田製作所 | 樹脂多層基板、および樹脂多層基板の製造方法 |
| KR102822073B1 (ko) * | 2020-06-05 | 2025-06-18 | 주식회사 아모센스 | 연성기판형 ｒｆ 케이블 |
-
2021
- 2021-11-12 WO PCT/JP2021/041721 patent/WO2022113779A1/ja not_active Ceased
- 2021-11-12 CN CN202190000868.5U patent/CN219802645U/zh active Active
- 2021-11-12 JP JP2022565222A patent/JP7480861B2/ja active Active
-
2023
- 2023-05-12 US US18/196,523 patent/US12477648B2/en active Active
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