JP7480861B2 - 積層基板および積層基板の製造方法 - Google Patents

積層基板および積層基板の製造方法 Download PDF

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Publication number
JP7480861B2
JP7480861B2 JP2022565222A JP2022565222A JP7480861B2 JP 7480861 B2 JP7480861 B2 JP 7480861B2 JP 2022565222 A JP2022565222 A JP 2022565222A JP 2022565222 A JP2022565222 A JP 2022565222A JP 7480861 B2 JP7480861 B2 JP 7480861B2
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Japan
Prior art keywords
laminated substrate
conductor
opening
view
conductor pattern
Prior art date
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JP2022565222A
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English (en)
Japanese (ja)
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JPWO2022113779A5 (https=
JPWO2022113779A1 (https=
Inventor
恒亮 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of JPWO2022113779A1 publication Critical patent/JPWO2022113779A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing & Machinery (AREA)
JP2022565222A 2020-11-30 2021-11-12 積層基板および積層基板の製造方法 Active JP7480861B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020198383 2020-11-30
JP2020198383 2020-11-30
PCT/JP2021/041721 WO2022113779A1 (ja) 2020-11-30 2021-11-12 積層基板および積層基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022113779A1 JPWO2022113779A1 (https=) 2022-06-02
JPWO2022113779A5 JPWO2022113779A5 (https=) 2023-08-02
JP7480861B2 true JP7480861B2 (ja) 2024-05-10

Family

ID=81755933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565222A Active JP7480861B2 (ja) 2020-11-30 2021-11-12 積層基板および積層基板の製造方法

Country Status (4)

Country Link
US (1) US12477648B2 (https=)
JP (1) JP7480861B2 (https=)
CN (1) CN219802645U (https=)
WO (1) WO2022113779A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323741B1 (en) 1998-10-13 2001-11-27 Lg Electronics Inc. Microstrip coupler with a longitudinal recess
JP2002170215A (ja) 2000-11-30 2002-06-14 Nec Corp 磁気記録用ヘッドジンバルアセンブリ
US20050110138A1 (en) 2003-11-25 2005-05-26 Banpil Photonics, Inc. High Speed Electrical On-Chip Interconnects and Method of Manufacturing
JP2005191903A (ja) 2003-12-25 2005-07-14 Ngk Spark Plug Co Ltd メッシュホールグランドストリップライン構造を有する積層体基板
JP2007207629A (ja) 2006-02-02 2007-08-16 Sumitomo Electric Ind Ltd フレキシブルフラットケーブル
JP2013157308A (ja) 2012-01-06 2013-08-15 Murata Mfg Co Ltd 高周波信号線路
WO2015005029A1 (ja) 2013-07-11 2015-01-15 株式会社村田製作所 樹脂多層基板、および樹脂多層基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3679500A (en) * 1970-08-07 1972-07-25 Dainippon Screen Mfg Method for forming perforations in metal sheets by etching
US3971661A (en) * 1972-06-14 1976-07-27 Westinghouse Electric Corporation Formation of openings in dielectric sheet
JP3282347B2 (ja) * 1993-09-07 2002-05-13 ソニー株式会社 エッチング法、色選別機構及びその作製方法、並びに、陰極線管
JP3206428B2 (ja) * 1996-04-09 2001-09-10 ティーディーケイ株式会社 ヘッドジンバルアセンブリを具備するハードディスク装置
US6449839B1 (en) * 2000-09-06 2002-09-17 Visteon Global Tech., Inc. Electrical circuit board and a method for making the same
KR102822073B1 (ko) * 2020-06-05 2025-06-18 주식회사 아모센스 연성기판형 ｒｆ 케이블

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323741B1 (en) 1998-10-13 2001-11-27 Lg Electronics Inc. Microstrip coupler with a longitudinal recess
JP2002170215A (ja) 2000-11-30 2002-06-14 Nec Corp 磁気記録用ヘッドジンバルアセンブリ
US20050110138A1 (en) 2003-11-25 2005-05-26 Banpil Photonics, Inc. High Speed Electrical On-Chip Interconnects and Method of Manufacturing
JP2005191903A (ja) 2003-12-25 2005-07-14 Ngk Spark Plug Co Ltd メッシュホールグランドストリップライン構造を有する積層体基板
JP2007207629A (ja) 2006-02-02 2007-08-16 Sumitomo Electric Ind Ltd フレキシブルフラットケーブル
JP2013157308A (ja) 2012-01-06 2013-08-15 Murata Mfg Co Ltd 高周波信号線路
WO2015005029A1 (ja) 2013-07-11 2015-01-15 株式会社村田製作所 樹脂多層基板、および樹脂多層基板の製造方法

Also Published As

Publication number Publication date
US12477648B2 (en) 2025-11-18
US20230284381A1 (en) 2023-09-07
WO2022113779A1 (ja) 2022-06-02
CN219802645U (zh) 2023-10-03
JPWO2022113779A1 (https=) 2022-06-02

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