JPWO2021246467A1 - - Google Patents

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Publication number
JPWO2021246467A1
JPWO2021246467A1 JP2022528882A JP2022528882A JPWO2021246467A1 JP WO2021246467 A1 JPWO2021246467 A1 JP WO2021246467A1 JP 2022528882 A JP2022528882 A JP 2022528882A JP 2022528882 A JP2022528882 A JP 2022528882A JP WO2021246467 A1 JPWO2021246467 A1 JP WO2021246467A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022528882A
Other languages
Japanese (ja)
Other versions
JP7338793B2 (ja
JPWO2021246467A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021246467A1 publication Critical patent/JPWO2021246467A1/ja
Publication of JPWO2021246467A5 publication Critical patent/JPWO2021246467A5/ja
Application granted granted Critical
Publication of JP7338793B2 publication Critical patent/JP7338793B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022528882A 2020-06-03 2021-06-03 多層基板及びその製造方法 Active JP7338793B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020096562 2020-06-03
JP2020096562 2020-06-03
PCT/JP2021/021109 WO2021246467A1 (ja) 2020-06-03 2021-06-03 多層基板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2021246467A1 true JPWO2021246467A1 (https=) 2021-12-09
JPWO2021246467A5 JPWO2021246467A5 (https=) 2023-01-24
JP7338793B2 JP7338793B2 (ja) 2023-09-05

Family

ID=78831224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022528882A Active JP7338793B2 (ja) 2020-06-03 2021-06-03 多層基板及びその製造方法

Country Status (4)

Country Link
US (1) US12336093B2 (https=)
JP (1) JP7338793B2 (https=)
CN (1) CN219204859U (https=)
WO (1) WO2021246467A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884561B (zh) * 2023-02-13 2025-05-21 胡迪群 半導體基板及其製造方法
US12148688B2 (en) 2023-02-13 2024-11-19 Dyi-chung Hu Semiconductor substrate and manufacturing method thereof
CN121040212A (zh) * 2023-04-20 2025-11-28 株式会社村田制作所 电路基板以及电路基板的制造方法
WO2026048351A1 (ja) * 2024-09-02 2026-03-05 日東電工株式会社 フレキシブル多層回路基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229663A (ja) * 2002-02-05 2003-08-15 Sony Corp 多層配線基板とそれを用いた半導体装置搭載基板及び多層配線基板の製造方法
JP2005251949A (ja) * 2004-03-03 2005-09-15 Sony Corp 配線基板及びその製造方法
JP2010087429A (ja) * 2008-10-02 2010-04-15 Denso Corp 多層回路基板およびその製造方法
WO2011058938A1 (ja) * 2009-11-10 2011-05-19 株式会社村田製作所 多層基板およびその製造方法
WO2012124362A1 (ja) * 2011-03-17 2012-09-20 株式会社 村田製作所 樹脂多層基板
JP2016213416A (ja) * 2015-05-13 2016-12-15 株式会社村田製作所 樹脂多層基板およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4186756B2 (ja) * 2003-08-29 2008-11-26 松下電器産業株式会社 回路基板及びその製造方法
US6908960B2 (en) * 1999-12-28 2005-06-21 Tdk Corporation Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin
JP2002026520A (ja) 2000-07-06 2002-01-25 Matsushita Electric Ind Co Ltd 多層配線基板及びその製造方法
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Industrial Co Ltd Module with built-in components and the manufacturing method thereof
CN103329637B (zh) 2011-02-08 2016-04-13 株式会社村田制作所 树脂多层基板及其制造方法
EP3926756A4 (en) * 2019-02-13 2022-11-09 The University of Tokyo CIRCUIT SUBSTRATE, ANTENNA ELEMENT, MILLIMETER WAVE ABSORBER FOR INCORPORATION INTO A SUBSTRATE AND METHOD OF NOISE REDUCTION IN A CIRCUIT SUBSTRATE
JP7325891B2 (ja) * 2019-10-24 2023-08-15 エルジー・ケム・リミテッド 多層印刷回路基板用絶縁層、これを含む多層印刷回路基板およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229663A (ja) * 2002-02-05 2003-08-15 Sony Corp 多層配線基板とそれを用いた半導体装置搭載基板及び多層配線基板の製造方法
JP2005251949A (ja) * 2004-03-03 2005-09-15 Sony Corp 配線基板及びその製造方法
JP2010087429A (ja) * 2008-10-02 2010-04-15 Denso Corp 多層回路基板およびその製造方法
WO2011058938A1 (ja) * 2009-11-10 2011-05-19 株式会社村田製作所 多層基板およびその製造方法
WO2012124362A1 (ja) * 2011-03-17 2012-09-20 株式会社 村田製作所 樹脂多層基板
JP2016213416A (ja) * 2015-05-13 2016-12-15 株式会社村田製作所 樹脂多層基板およびその製造方法

Also Published As

Publication number Publication date
JP7338793B2 (ja) 2023-09-05
WO2021246467A1 (ja) 2021-12-09
US12336093B2 (en) 2025-06-17
CN219204859U (zh) 2023-06-16
US20230053211A1 (en) 2023-02-16

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