JPWO2021006037A1 - - Google Patents

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Publication number
JPWO2021006037A1
JPWO2021006037A1 JP2021530582A JP2021530582A JPWO2021006037A1 JP WO2021006037 A1 JPWO2021006037 A1 JP WO2021006037A1 JP 2021530582 A JP2021530582 A JP 2021530582A JP 2021530582 A JP2021530582 A JP 2021530582A JP WO2021006037 A1 JPWO2021006037 A1 JP WO2021006037A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021530582A
Other languages
Japanese (ja)
Other versions
JP7276455B2 (ja
JPWO2021006037A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021006037A1 publication Critical patent/JPWO2021006037A1/ja
Publication of JPWO2021006037A5 publication Critical patent/JPWO2021006037A5/ja
Application granted granted Critical
Publication of JP7276455B2 publication Critical patent/JP7276455B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/088Stacked transmission lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/003Coplanar lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/12Coupling devices having more than two ports
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0242Structural details of individual signal conductors, e.g. related to the skin effect
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09336Signal conductors in same plane as power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09618Via fence, i.e. one-dimensional array of vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672Superposed layout, i.e. in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709Staggered pads, lands or terminals; Parallel conductors in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Waveguides (AREA)
JP2021530582A 2019-07-05 2020-06-24 伝送線路、および電子機器 Active JP7276455B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019126069 2019-07-05
JP2019126069 2019-07-05
PCT/JP2020/024785 WO2021006037A1 (ja) 2019-07-05 2020-06-24 伝送線路、および電子機器

Publications (3)

Publication Number Publication Date
JPWO2021006037A1 true JPWO2021006037A1 (https=) 2021-01-14
JPWO2021006037A5 JPWO2021006037A5 (https=) 2022-01-19
JP7276455B2 JP7276455B2 (ja) 2023-05-18

Family

ID=74114750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021530582A Active JP7276455B2 (ja) 2019-07-05 2020-06-24 伝送線路、および電子機器

Country Status (4)

Country Link
US (1) US11984637B2 (https=)
JP (1) JP7276455B2 (https=)
CN (1) CN217363377U (https=)
WO (1) WO2021006037A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250049703A (ko) * 2023-10-05 2025-04-14 삼성에스디아이 주식회사 스파크 갭을 포함하는 다중구조 커넥터

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10255925A (ja) * 1997-03-11 1998-09-25 Canon Inc 接続装置
JP2005064467A (ja) * 2003-07-25 2005-03-10 Shinko Electric Ind Co Ltd インターポーザ及びこれを用いた半導体装置
WO2005086554A1 (en) * 2004-03-09 2005-09-15 Nec Corporation Via transmission lines for multilayer printed circuit boards
JP2009100003A (ja) * 2004-02-13 2009-05-07 Molex Inc プリント回路基板用の優先的接地及びビア延出構造
WO2016088693A1 (ja) * 2014-12-01 2016-06-09 株式会社村田製作所 電子機器
JP2016162854A (ja) * 2015-02-27 2016-09-05 住友電工プリントサーキット株式会社 プリント配線板
JP2017120932A (ja) * 2017-04-03 2017-07-06 株式会社フジクラ プリント配線板
JP2018082070A (ja) * 2016-11-17 2018-05-24 京セラ株式会社 配線基板およびこれを用いた電子装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6197979B1 (ja) 2015-12-07 2017-09-20 株式会社村田製作所 樹脂基板および電子機器
TW201816967A (zh) 2016-10-28 2018-05-01 京瓷股份有限公司 佈線基板以及使用了該佈線基板的電子裝置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10255925A (ja) * 1997-03-11 1998-09-25 Canon Inc 接続装置
JP2005064467A (ja) * 2003-07-25 2005-03-10 Shinko Electric Ind Co Ltd インターポーザ及びこれを用いた半導体装置
JP2009100003A (ja) * 2004-02-13 2009-05-07 Molex Inc プリント回路基板用の優先的接地及びビア延出構造
WO2005086554A1 (en) * 2004-03-09 2005-09-15 Nec Corporation Via transmission lines for multilayer printed circuit boards
WO2016088693A1 (ja) * 2014-12-01 2016-06-09 株式会社村田製作所 電子機器
JP2016162854A (ja) * 2015-02-27 2016-09-05 住友電工プリントサーキット株式会社 プリント配線板
JP2018082070A (ja) * 2016-11-17 2018-05-24 京セラ株式会社 配線基板およびこれを用いた電子装置
JP2017120932A (ja) * 2017-04-03 2017-07-06 株式会社フジクラ プリント配線板

Also Published As

Publication number Publication date
US20220077556A1 (en) 2022-03-10
JP7276455B2 (ja) 2023-05-18
WO2021006037A1 (ja) 2021-01-14
US11984637B2 (en) 2024-05-14
CN217363377U (zh) 2022-09-02

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