JPWO2019221246A1 - ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法 - Google Patents
ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法 Download PDFInfo
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- JPWO2019221246A1 JPWO2019221246A1 JP2020519925A JP2020519925A JPWO2019221246A1 JP WO2019221246 A1 JPWO2019221246 A1 JP WO2019221246A1 JP 2020519925 A JP2020519925 A JP 2020519925A JP 2020519925 A JP2020519925 A JP 2020519925A JP WO2019221246 A1 JPWO2019221246 A1 JP WO2019221246A1
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Classifications
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
Description
図1(a)は、本実施形態に係るダイシング・ダイボンディング一体型フィルムを示す平面図であり、図1(b)は、図1のB−B線に沿った模式断面図である。ダイシング・ダイボンディング一体型フィルム10(以下、場合により、単に「フィルム10」という。)は、ウェハWを面積9mm2以下の複数のチップに個片化するダイシング工程及びその後のピックアップ工程を含む半導体装置の製造プロセスに適用されるものである(図5(c)及び図5(d)参照)。
粘着剤層3は、接着剤層5におけるウェハWの貼付け位置に対応する領域Rwを少なくとも含む第1の領域3aと、第1の領域3aを囲むように位置する第2の領域3bとを有する。図1(a)及び図1(b)における破線は第1の領域3aと第2の領域3bの境界を示す。第1の領域3a及び第2の領域3bは、活性エネルギー線の照射前において同一の組成物からなる。第1の領域3aは、紫外線等の活性エネルギー線が照射されることによって、第2の領域3bと比較して粘着力が低下した状態の領域である。第2の領域3bはダイシングリングDRが貼り付けられる領域である(図2参照)。第2の領域3bは活性エネルギー線が照射されていない領域であり、ダイシングリングDRに対する高い粘着力を有する。
粘着剤組成物は、連鎖重合可能な官能基を有する(メタ)アクリル系樹脂を含み、官能基がアクリロイル基及びメタクリロイル基から選ばれる少なくとも1種であることが好ましい。活性エネルギー線照射前の粘着剤層における上記官能基の含有量は、例えば、0.1〜1.2mmol/gであり、0.3〜1.0mmol/g又は0.5〜0.8mmol/gであってもよい。上記官能基の含有量が0.1mmol/g以上であることで、活性エネルギー線の照射によって粘着力が適度に低下した領域(第1の領域3a)を形成しやすく、他方、1.2mmol/g以下であることで、優れたピックアップ性を達成しやすい。
光重合開始剤としては、活性エネルギー線(紫外線、電子線及び可視光線から選ばれる少なくとも1種)を照射することで連鎖重合可能な活性種を発生するものであれば、特に制限はなく、例えば、光ラジカル重合開始剤が挙げられる。ここで連鎖重合可能な活性種とは、連鎖重合可能な官能基と反応することで重合反応が開始されるものを意味する。
架橋剤は、例えば、粘着剤層の弾性率及び/又は粘着性の制御を目的に用いられる。架橋剤は、上記(メタ)アクリル系樹脂が有する水酸基、グリシジル基及びアミノ基等から選ばれる少なくとも1種の官能基と反応し得る官能基を一分子中に2つ以上有する化合物であればよい。架橋剤と(メタ)アクリル系樹脂との反応によって形成される結合としては、エステル結合、エーテル結合、アミド結合、イミド結合、ウレタン結合、ウレア結合等が挙げられる。
基材層1としては、既知のポリマーシート又はフィルムを用いることができ、低温条件下において、エキスパンド工程を実施可能なものであれば、特に制限はない。具体的には、基材層1として、結晶性ポリプロピレン、非晶性ポリプロピレン、高密度ポリエチレン、中密度ポリエチレン、低密度ポリエチレン、超低密度ポリエチレン、低密度直鎖ポリエチレン、ポリブテン、ポリメチルペンテン等のポリオレフィン、エチレン−酢酸ビニル共重合体、アイオノマー樹脂、エチレン−(メタ)アクリル酸共重合体、エチレン−(メタ)アクリル酸エステル(ランダム、交互)共重合体、エチレン−ブテン共重合体、エチレン−ヘキセン共重合体、ポリウレタン、ポリエチレンテレフタレート、ポリエチレンナフタレート等のポリエステル、ポリカーボネート、ポリイミド、ポリエーテルエーテルケトン、ポリイミド、ポリエーテルイミド、ポリアミド、全芳香族ポリアミド、ポリフェニルスルフイド、アラミド(紙)、ガラス、ガラスクロス、フッ素樹脂、ポリ塩化ビニル、ポリ塩化ビニリデン、セルロース系樹脂、シリコーン樹脂、又は、これらに可塑剤を混合した混合物、あるいは、電子線照射により架橋を施した硬化物が挙げられる。
接着剤層5には、既知のダイボンディングフィルムを構成する接着剤組成物を適用できる。具体的には、接着剤層5を構成する接着剤組成物は、エポキシ基含有アクリル共重合体、エポキシ樹脂及びエポキシ樹脂硬化剤を含有することが好ましい。これらの成分を含む接着剤層5によれば、チップ/基板間、チップ/チップ間の接着性に優れ、また電極埋め込み性及びワイヤ埋め込み性等も付与可能で、かつダイボンディング工程では低温で接着でき、短時間で優れた硬化が得られる、封止剤でモールド後は優れた信頼性を有する等の特徴があり好ましい。
フィルム10の製造方法は、基材層1の表面上に、活性エネルギー線が照射されることによって粘着力が低下する粘着剤組成物からなる粘着剤層と、粘着剤層の表面上に形成された接着剤層5とを含む積層体を作製する工程と、積層体に含まれる粘着剤層の第1の領域3aとなる領域に活性エネルギー線を照射する工程とをこの順序で含む。第1の領域3aとなる領域に対する活性エネルギー線の照射量は、例えば、10〜1000mJ/cm2であり、100〜700mJ/cm2又は200〜500mJ/cm2であってもよい。
図4は本実施形態に係る半導体装置を模式的に示す断面図である。この図に示す半導体装置100は、基板70と、基板70の表面上に積層された四つのチップS1,S2,S3,S4と、基板70の表面上の電極(不図示)と四つのチップS1,S2,S3,S4とを電気的に接続するワイヤW1,W2,W3,W4と、これらを封止している封止層50とを備える。
[アクリル樹脂の合成(製造例1)]
スリーワンモータ、撹拌翼、窒素導入管が備え付けられた容量2000mlのフラスコに以下の成分を入れた。
・酢酸エチル(溶剤):635g
・2−エチルヘキシルアクリレート:395g
・2−ヒドロキシエチルアクリレート:100g
・メタクリル酸:5g
・アゾビスイソブチロニトリル:0.08g
以下の成分を混合することで、粘着剤層形成用のワニスを調製した(表2参照)。酢酸エチル(溶剤)の量は、ワニスの総固形分含有量が25質量%となるように調整した。
・(A)アクリル樹脂溶液(製造例1):100g(固形分)
・(B)光重合開始剤(1−ヒドロキシシクロヘキシルフェニルケトン、チバスペシャリティケミカルズ株式会社製、イルガキュア184、「イルガキュア」は登録商標):0.8g
・(B)光重合開始剤(ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド、チバスペシャリティケミカルズ株式会社製、イルガキュア819、「イルガキュア」は登録商標):0.2g
・(C)架橋剤(多官能イソシアネート、日本ポリウレタン工業株式会社製、コロネートL、固形分:75%):8.0g(固形分)
・酢酸エチル(溶剤)
まず、以下の組成物にシクロヘキサノン(溶剤)を加えて攪拌混合した後、更にビーズミルを用いて90分混練した。
・エポキシ樹脂(YDCN−700−10(商品名)、新日鉄住金化学株式会社製クレゾールノボラック型エポキシ樹脂、エポキシ当量210、分子量1200、軟化点80℃):14質量部・フェノール樹脂(ミレックスXLC−LL(商品名)、三井化学株式会社製、フェノール樹脂、水酸基当量175、吸水率1.8%、350℃における加熱重量減少率4%):23質量部
・シランカップリング剤(NUC A−189(商品名)株式会社NUC製、γ−メルカプトプロピルトリメトキシシラン):0.2質量部
・シランカップリング剤(NUCA−1160(商品名)、日本ユニカー株式会社製、γ−ウレイドプロピルトリエトキシシラン):0.1質量部
・フィラー(「SC2050−HLG(商品名)、アドマテックス株式会社製、シリカ、平均粒径0.500μm):32質量部
・エポキシ基含有アクリル共重合体(HTR−860P−3(商品名)、ナガセケムテックス株式会社製、重量平均分子量80万):16質量部
・硬化促進剤(キュアゾール2PZ−CN(商品名)、四国化成工業株式会社製、1−シアノエチル−2−フェニルイミダゾール、「キュアゾール」は登録商標)0.0.1質量部
接着剤層とキャリアフィルムとからなるダイボンディングフィルムを、キャリアフィルムごと直径335mmの円形にカットした。これにポリエチレンテレフタレートフィルムを剥離したダイシングフィルムを室温で貼り付け後、室温で1日放置した。その後、直径370mmの円形にダイシングフィルムをカットした。このようにして得たダイシング・ダイボンディング一体型フィルムの接着剤層におけるウェハの貼付け位置に対応する領域(粘着剤層の第1の領域)に以下のようにして紫外線を照射した。すなわち、パルスドキセノンランプを用いて70W、150mJ/cm2の照射量で部分的に紫外線を照射した。なお、暗幕を用いてフィルムの中心から内径318mmの部分に紫外線を照射した。このようにして、後述の種々の評価試験に供するための複数のダイシング・ダイボンディング一体型フィルムを得た。
紫外線の照射量を150mJ/cm2とする代わりに、300mJ/cm2としたことの他は実施例1と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
紫外線の照射量を150mJ/cm2とする代わりに、500mJ/cm2としたことの他は実施例1と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
ダイボンディングフィルムとして、接着剤層Aを有するものの代わりに、以下のようにして形成した接着剤層Bを有するものを使用したことの他は実施例1と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
[ダイボンディングフィルム(接着剤層B)の作製]
まず、以下の成分にシクロヘキサノン(溶剤)を加えて攪拌混合した後、更にビーズミルを用いて90分混練した。
・フィラー(「SC2050−HLG(商品名)、アドマテックス株式会社製、シリカ、平均粒径0.500μm):50質量部
上記のようにして得た組成物に以下の成分を加えた後、攪拌混合及び真空脱気の工程を経て接着剤層形成用のワニスを得た。
・エポキシ基含有アクリル共重合体(HTR−860P−3(商品名)、ナガセケムテックス株式会社製、重量平均分子量80万):100質量部
・硬化促進剤(キュアゾール2PZ−CN(商品名)、四国化成工業株式会社製、1−シアノエチル−2−フェニルイミダゾール、「キュアゾール」は登録商標)0.1質量部
表1の製造例1に示す原料モノマー組成の代わりに、製造例2に示す原料モノマー組成とし、製造例1と同じ手法で製造した製造例2に係る(A)アクリル樹脂の溶液を得た。この溶液を使用したことの他は実施例2と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
粘着剤層における架橋剤の量を8.0質量部とする代わりに4.0質量部とするとともに、紫外線の照射量を300mJ/cm2とする代わりに500mJ/cm2としたことの他は実施例5と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
表1の製造例1に示す原料モノマー組成の代わりに、製造例3に示す原料モノマー組成とし、製造例1と同じ手法で製造した製造例3に係る(A)アクリル樹脂の溶液を得た。この溶液を使用したことの他は実施例2と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
表1の製造例1に示す原料モノマー組成の代わりに、製造例4に示す原料モノマー組成とし、製造例1と同じ手法で製造した製造例4に係る(A)アクリル樹脂の溶液を得た。この溶液を使用したことの他は実施例3と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
粘着剤層における架橋剤の量を8.0質量部とする代わりに15.0質量部としたことの他は実施例1と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
紫外線の照射量を300mJ/cm2とする代わりに500mJ/cm2としたことの他は実施例5と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
紫外線の照射量を500mJ/cm2とする代わりに150mJ/cm2としたことの他は実施例8と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
表1の製造例1に示す原料モノマー組成の代わりに、製造例5に示す原料モノマー組成とし、製造例1と同じ手法で製造した製造例5に係る(A)アクリル樹脂の溶液を得た。この溶液を使用するとともに、紫外線を照射しなかったことの他は実施例1と同様にして、複数のダイシング・ダイボンディング一体型フィルムを得た。
(1)接着剤層に対する粘着剤層の粘着力(30°ピール強度)の測定
接着剤層に対する粘着剤層(紫外線照射領域)の粘着力を30°ピール強度を測定することによって評価した。すなわち、ダイシング・ダイボンディング一体型フィルムから幅25mm及び長さ100mmの測定試料を切り出した。測定試料は、粘着剤層(紫外線照射領域)と、接着剤層の積層体とした。引張試験機を用いて接着剤層に対する粘着剤層(紫外線照射領域)のピール強度を測定した。測定条件は、剥離角度30°、引張速度60mm/分とした。なお、試料の保存及びピール強度の測定は、温度23℃、相対湿度40%の環境下で行った。
剥離角度を15°とするとともに引張速度を150mm/分(2.5mm/秒)としたことの他は、上記の30°ピール強度の測定と同様にして15°ピール強度を測定した。なお、この測定条件は特許文献1の請求項1に記載された条件と同じである。
ステンレス基板に対する粘着剤層(紫外線非照射領域)の粘着力を90°ピール強度を測定することによって評価した。すなわち、ダイシング・ダイボンディング一体型フィルムから幅25mm及び長さ100mmの測定試料を切り出した。測定試料は、粘着剤層(紫外線非照射領域)と、接着剤層の積層体とした。試料の粘着剤層側の面をステンレス基板(SUS430BA)に貼り付けた後、株式会社島津製作所製オートグラフ「AGS−1000」を用いてステンレス基板に対する粘着剤層(紫外線非照射領域)のピール強度を測定した。測定条件は、剥離角度90°、剥離速度50mm/分とした。
ダイシング・ダイボンディング一体型フィルムを80℃×10秒の条件でウェハ(直径:8インチ、厚さ:50μm)に貼り合わせた。その後、以下の条件でウェハのダイシングを行った。
<ダイシング条件>
・ダイサー:DISCO社製、DFD−651
・ブレード:DISCO社製、27HECC
・ブレード回転数:40000rpm
・ダイシング速度:30mm/sec
・ダイシング深さ:25μm
・カットモード:ダウンカット
・ダイシングサイズ:1.0mm×1.0mm
ダイシング時において、粘着剤層からの接着剤片の剥離が生じたか否かを確認した。一枚のウェハをダイシングする間に、上記積層体の飛び及び上記剥離が認められなかった試料を「A」と評価し、上記積層体の飛び又はわずかな面積でも上記剥離が認められたものを「B」と評価した。
ダイシング時において、接着剤層からのチップの剥離が生じたか否かを確認した。一枚のウェハをダイシングする間に、チップの飛びが一回も生じなかった試料を「A」と評価し、チップの飛びが一回でも生じた試料を「B」と評価した。
ダイシング後のチップの切削断面を顕微鏡にて確認し、チップの欠けが生じているか否かを評価した。25個のチップの切削断面を観察し、まったく欠けが認められなかった試料を「A」と評価し、わずかでも欠けが認められる試料を「B」と評価した。
ダイシング時にダイシングリングが粘着剤層から剥離する現象(リング剥がれ)が生じたか否かについて目視により評価した。リング剥がれが生じなかった試料を「A」と評価し、リング剥がれが生じた試料を「B」と評価した。
ダイシング工程後のチップのピックアップ性をルネサス東日本セミコンダクタ社製レキシブルダイボンダー「DB−730」を使用して評価した。ピックアップ用コレットには、マイクロメカニクス社製「RUBBER TIP 13−087E−33(サイズ:1×1mm)」を用い、突上げピンには、マイクロメカニクス社製の「EJECTOR NEEDLE SEN2−83−05(直径:0.7mm、先端形状:直径350μmの半円)」を用いた。突上げピンは、中心部に1本配置した。ピックアップ時のピンの突上げ速度:10mm/秒、突上げ高さ:75μmの条件でピックアップ性を評価した。連続して100個のチップをピックアップし、チップ割れ又はピックアップミス等が発生しなかった場合を「A」と評価し、一つのチップでもチップ割れ又はピックアップミスが発生した場合を「B」と判定した。なお、ダイシング時にリング剥がれが発生したサンプルについては、再度一体型サンプルを作製後、リング密着部を粘着テープで補強しダイシングをした後、評価を行った。
Claims (13)
- 基材層と、前記基材層と対面する第1の面及びその反対側の第2の面を有する粘着剤層と、前記粘着剤層の前記第2の面の中央部を覆うように設けられた接着剤層とを備えるダイシング・ダイボンディング一体型フィルムを準備する工程と、
前記ダイシング・ダイボンディング一体型フィルムの前記接着剤層に対してウェハを貼るとともに、前記粘着剤層の前記第2の面に対してダイシングリングを貼る工程と、
前記ウェハを面積9mm2以下の複数のチップに個片化する工程と、
前記接着剤層が個片化されてなる接着剤片とともに前記チップを前記粘着剤層からピックアップする工程と、
前記接着剤片を介して前記チップを、基板又は他のチップ上にマウントする工程と、
を含み、
前記粘着剤層は、前記接着剤層における前記ウェハが貼り付けられる領域に対応する第1の領域と、前記ダイシングリングが貼り付けられる第2の領域とを有し、
前記第1の領域は、活性エネルギー線の照射により、前記第2の領域と比較して粘着力が低下した状態の領域であり、
温度23℃において剥離角度30°及び剥離速度60mm/分の条件で測定される、前記接着剤層に対する前記第1の領域の粘着力が1.2N/25mm以上4.5N/25mm以下である、半導体装置の製造方法。 - 温度23℃において剥離角度90°及び剥離速度50mm/分の条件で測定される、前記第2の領域のステンレス基板に対する粘着力が0.2N/25mm以上である、請求項1に記載の半導体装置の製造方法。
- 前記複数のチップは、正方形又は長方形の形状を有し且つ3mm以下の辺を有する、請求項1又は2に記載の半導体装置の製造方法。
- 前記粘着剤層の前記第1及び第2の領域は、活性エネルギー線の照射前において同一の組成物からなり、
前記第1の領域は、当該第1の領域となる領域に対して10〜1000mJ/cm2の量の活性エネルギー線を照射する工程を経て形成されたものである、請求項1〜3のいずれか一項に記載の半導体装置の製造方法。 - 基材層と、
前記基材層と対面する第1の面及びその反対側の第2の面を有する粘着剤層と、
前記第2の面の中央部を覆うように設けられた接着剤層と、
を備え、
前記粘着剤層は、前記接着剤層におけるウェハの貼付け位置に対応する領域を少なくとも含む第1の領域と、前記第1の領域を囲むように位置する第2の領域とを有し、
前記第1の領域は、活性エネルギー線の照射により、前記第2の領域と比較して粘着力が低下した状態の領域であり、
温度23℃において剥離角度30°及び剥離速度60mm/分の条件で測定される、前記接着剤層に対する前記第1の領域の粘着力が1.2N/25mm以上4.5N/25mm以下である、ダイシング・ダイボンディング一体型フィルム。 - 温度23℃において剥離角度90°及び剥離速度50mm/分の条件で測定される、前記第2の領域のステンレス基板に対する粘着力が0.2N/25mm以上である、請求項5に記載のダイシング・ダイボンディング一体型フィルム。
- ウェハを面積9mm2以下の複数のチップに個片化する工程を含む半導体装置製造プロセスに適用される、請求項5又は6に記載のダイシング・ダイボンディング一体型フィルム。
- 前記第2の領域が連鎖重合可能な官能基を有する(メタ)アクリル系樹脂を含み、
前記官能基がアクリロイル基及びメタクリロイル基から選ばれる少なくとも1種であり、
前記第2の領域における前記官能基の含有量が0.1mmol/g〜1.2mmol/gである、請求項5〜7のいずれか一項に記載のダイシング・ダイボンディング一体型フィルム。 - 前記第2の領域が架橋剤を含み、
前記第2の領域における前記架橋剤の含有量が0.1〜20質量%である、請求項5〜8のいずれか一項に記載のダイシング・ダイボンディング一体型フィルム。 - 前記架橋剤が、一分子中に2つ以上のイソシアネート基を有する多官能イソシアネートと、一分子中に3つ以上のOH基を有する多価アルコールの反応物である、請求項9に記載のダイシング・ダイボンディング一体型フィルム。
- 前記接着剤層が、エネルギー硬化性基含有(メタ)アクリル共重合体と、硬化促進剤と、フィラーとを含む組成物からなる、請求項5〜10のいずれか一項に記載のダイシング・ダイボンディング一体型フィルム。
- 請求項5〜11のいずれか一項に記載のダイシング・ダイボンディング一体型フィルムの製造方法であって、
基材層の表面上に、活性エネルギー線が照射されることによって粘着力が低下する組成物からなる粘着剤層と、前記粘着剤層の表面上に形成された前記接着剤層とを含む積層体を作製する工程と、
前記積層体に含まれる前記粘着剤層の前記第1の領域となる領域に活性エネルギー線を照射する工程と、
をこの順序で含む、ダイシング・ダイボンディング一体型フィルムの製造方法。 - 請求項5〜11のいずれか一項に記載のダイシング・ダイボンディング一体型フィルムの製造方法であって、
基材層の表面上に、活性エネルギー線が照射されることによって粘着力が低下する組成物からなる粘着剤層を形成する工程と、
前記粘着剤層の前記第1の領域となる領域に活性エネルギー線を照射する工程と、
前記活性エネルギー線を照射した後の前記粘着剤層の表面上に前記接着剤層を積層する工程と、
をこの順序で含む、ダイシング・ダイボンディング一体型フィルムの製造方法。
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