JPWO2019142722A1 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JPWO2019142722A1 JPWO2019142722A1 JP2019566441A JP2019566441A JPWO2019142722A1 JP WO2019142722 A1 JPWO2019142722 A1 JP WO2019142722A1 JP 2019566441 A JP2019566441 A JP 2019566441A JP 2019566441 A JP2019566441 A JP 2019566441A JP WO2019142722 A1 JPWO2019142722 A1 JP WO2019142722A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 195
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 239000010410 layer Substances 0.000 claims abstract description 465
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 118
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 107
- 239000002344 surface layer Substances 0.000 claims abstract description 33
- 230000007423 decrease Effects 0.000 claims abstract description 24
- 230000003247 decreasing effect Effects 0.000 claims abstract description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 59
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 55
- 229910052757 nitrogen Inorganic materials 0.000 claims description 49
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 41
- 239000012535 impurity Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 26
- 238000007254 oxidation reaction Methods 0.000 claims description 19
- 230000003647 oxidation Effects 0.000 claims description 17
- 238000000137 annealing Methods 0.000 claims description 15
- 238000005229 chemical vapour deposition Methods 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 11
- 230000005684 electric field Effects 0.000 claims description 6
- 230000015556 catabolic process Effects 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052681 coesite Inorganic materials 0.000 abstract 4
- 229910052906 cristobalite Inorganic materials 0.000 abstract 4
- 239000000377 silicon dioxide Substances 0.000 abstract 4
- 235000012239 silicon dioxide Nutrition 0.000 abstract 4
- 229910052682 stishovite Inorganic materials 0.000 abstract 4
- 229910052905 tridymite Inorganic materials 0.000 abstract 4
- 210000000746 body region Anatomy 0.000 description 38
- 125000004432 carbon atom Chemical group C* 0.000 description 35
- 239000007789 gas Substances 0.000 description 30
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 24
- 239000011229 interlayer Substances 0.000 description 24
- 230000007547 defect Effects 0.000 description 18
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 17
- 229910052698 phosphorus Inorganic materials 0.000 description 17
- 239000011574 phosphorus Substances 0.000 description 17
- 150000001721 carbon Chemical group 0.000 description 11
- 239000011261 inert gas Substances 0.000 description 11
- 238000005468 ion implantation Methods 0.000 description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 10
- 238000005259 measurement Methods 0.000 description 6
- 230000001590 oxidative effect Effects 0.000 description 6
- 150000002926 oxygen Chemical class 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- 239000001569 carbon dioxide Substances 0.000 description 5
- 229910002091 carbon monoxide Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 125000004437 phosphorous atom Chemical group 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000009279 wet oxidation reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
Description
2 SiC半導体層
5 SiC半導体基板
6 SiCエピタキシャル層
12 ゲート酸化層(SiO2層)
13 ゲート電極層
21 ゲート酸化層の接続面
22 ゲート酸化層の非接続面
23 炭素密度漸減領域
24 低炭素密度領域
25 界面領域
51 半導体装置
81 半導体装置
Claims (26)
- 1.0×1022cm−3以上の炭素密度を有するSiC半導体層と、
前記SiC半導体層の上に形成され、前記SiC半導体層に接する接続面、および、前記接続面の反対側に位置する非接続面を有するSiO2層と、
前記SiO2層の前記接続面の表層部に形成され、前記SiO2層の前記非接続面に向けて炭素密度が漸減する炭素密度漸減領域と、
前記SiO2層の前記非接続面の表層部に形成され、1.0×1019cm−3以下の炭素密度を有する低炭素密度領域と、を含む、半導体装置。 - 前記低炭素密度領域は、前記SiO2層の前記接続面および前記非接続面の間の厚さ方向に関して、前記低炭素密度領域が占める割合以上の割合を占めている、請求項1に記載の半導体装置。
- 前記低炭素密度領域は、前記炭素密度漸減領域の厚さ以上の厚さを有している、請求項1または2に記載の半導体装置。
- 前記炭素密度漸減領域の炭素密度は、前記SiC半導体層の炭素密度から1.0×1019cm−3以下まで漸減し、
前記低炭素密度領域は、1.0×1019cm−3未満の炭素密度を有している、請求項1〜3のいずれか一項に記載の半導体装置。 - 前記SiO2層の前記接続面側の窒素原子密度は、前記SiO2層の前記非接続面側の窒素原子密度よりも大きい、請求項1〜4のいずれか一項に記載の半導体装置。
- 前記SiC半導体層において前記SiO2層に接する領域に形成され、伝導帯端からのエネルギー準位が0.2eV以上0.5eV以下の範囲において4.0×1011eV−1・cm−2以下である界面準位密度を有する界面領域をさらに含む、請求項1〜5のいずれか一項に記載の半導体装置。
- 前記SiO2層は、9.0MV・cm−1以上のブレークダウン電界強度を有している、請求項1〜6のいずれか一項に記載の半導体装置。
- 前記SiO2層は、20nm以上の厚さを有している、請求項1〜7のいずれか一項に記載の半導体装置。
- 前記SiC半導体層は、SiC半導体基板、および、前記SiC半導体基板の上に形成されたSiCエピタキシャル層を含み、
前記SiO2層は、前記SiCエピタキシャル層の上に形成されている、請求項1〜8のいずれか一項に記載の半導体装置。 - 前記SiCエピタキシャル層は、1.0×1015cm−3以上1.0×1017cm−3以下のn型不純物濃度を有している、請求項9に記載の半導体装置。
- 前記SiO2層を挟んで前記SiC半導体層に対向する電極をさらに含む、請求項1〜10のいずれか一項に記載の半導体装置。
- 前記SiC半導体層には、トレンチが形成されており、
前記SiO2層は前記トレンチの内壁面に沿って形成されている、請求項1〜10のいずれか一項に記載の半導体装置。 - 前記SiO2層の厚さは、前記トレンチの内壁面を被覆する部分に応じて異なっている、請求項12に記載の半導体装置。
- 前記SiO2層を挟んで前記トレンチに埋め込まれた電極をさらに含む、請求項12または13に記載の半導体装置。
- 前記SiC半導体層において前記SiO2層が形成された面とは反対側の面に形成された電極をさらに含む、請求項1〜14のいずれか一項に記載の半導体装置。
- 前記SiC半導体層は、4H−SiC単結晶を含み、前記4H−SiC単結晶の[0001]面から<11−20>方向に対して10°以下のオフ角を有する主面を含む、請求項1〜15のいずれか一項に記載の半導体装置。
- SiC半導体層を用意する工程と、
前記SiC半導体層の上にSiO2層を形成する工程と、
低酸素分圧雰囲気下でアニール処理を施すことにより、前記SiO2層に酸素原子を導入する酸素原子導入工程と、を含む、半導体装置の製造方法。 - 前記酸素原子導入工程に先立って、窒素原子を含む雰囲気下でアニール処理を施すことにより、前記SiO2層に窒素原子を導入する窒素原子導入工程をさらに含む、請求項17に記載の半導体装置の製造方法。
- 前記窒素原子導入工程は、酸素原子および窒素原子を含む雰囲気下でアニール処理を施す工程を含む、請求項18に記載の半導体装置の製造方法。
- 20nm以上の厚さを有する前記SiO2層が形成される、請求項17〜19のいずれか一項に記載の半導体装置の製造方法。
- 酸化処理法によって前記SiO2層が形成される、請求項17〜20のいずれか一項に記載の半導体装置の製造方法。
- CVD(Chemical Vapor Deposition)法によって前記SiO2層が形成される、請求項17〜20のいずれか一項に記載の半導体装置の製造方法。
- 前記SiC半導体層を用意する工程は、SiC半導体基板を用意する工程、および、エピタキシャル成長法によって前記SiC半導体基板の上にSiCエピタキシャル層を形成する工程を含み、
前記SiO2層は、前記SiCエピタキシャル層の上に形成される、請求項17〜22のいずれか一項に記載の半導体装置の製造方法。 - 1.0×1015cm−3以上1.0×1017cm−3以下のn型不純物濃度を有する前記SiCエピタキシャル層が形成される、請求項23に記載の半導体装置の製造方法。
- 前記SiC半導体層は、4H−SiC単結晶を含み、前記4H−SiC単結晶の[0001]面から<11−20>方向に対して10°以下のオフ角を有する主面を含む、請求項17〜24のいずれか一項に記載の半導体装置の製造方法。
- 前記SiO2層を挟んで前記SiC半導体層に対向する電極を形成する工程をさらに含む、請求項17〜25のいずれか一項に記載の半導体装置の製造方法。
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