JPWO2019131506A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2019131506A5 JPWO2019131506A5 JP2019561646A JP2019561646A JPWO2019131506A5 JP WO2019131506 A5 JPWO2019131506 A5 JP WO2019131506A5 JP 2019561646 A JP2019561646 A JP 2019561646A JP 2019561646 A JP2019561646 A JP 2019561646A JP WO2019131506 A5 JPWO2019131506 A5 JP WO2019131506A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- conductive film
- conductive
- multilayer reflective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- 239000006096 absorbing agent Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 3
- 230000001681 protective effect Effects 0.000 claims 3
- 239000011651 chromium Substances 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000001459 lithography Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000010948 rhodium Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017251163 | 2017-12-27 | ||
| JP2017251163 | 2017-12-27 | ||
| PCT/JP2018/047246 WO2019131506A1 (ja) | 2017-12-27 | 2018-12-21 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2019131506A1 JPWO2019131506A1 (ja) | 2020-12-10 |
| JPWO2019131506A5 true JPWO2019131506A5 (https=) | 2022-07-22 |
| JP7208163B2 JP7208163B2 (ja) | 2023-01-18 |
Family
ID=67067319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019561646A Active JP7208163B2 (ja) | 2017-12-27 | 2018-12-21 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11561463B2 (https=) |
| JP (1) | JP7208163B2 (https=) |
| KR (1) | KR102830574B1 (https=) |
| SG (1) | SG11202005918UA (https=) |
| TW (1) | TWI786243B (https=) |
| WO (1) | WO2019131506A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102002441B1 (ko) | 2017-01-17 | 2019-07-23 | 호야 가부시키가이샤 | 반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 및 반도체 장치의 제조 방법 |
| JP7610346B2 (ja) * | 2019-11-01 | 2025-01-08 | テクセンドフォトマスク株式会社 | 反射型マスク及び反射型マスクの製造方法 |
| JP7525354B2 (ja) * | 2020-09-28 | 2024-07-30 | 株式会社トッパンフォトマスク | 反射型フォトマスクブランク及び反射型フォトマスク |
| US20220137500A1 (en) * | 2020-10-30 | 2022-05-05 | AGC Inc. | Glass substrate for euvl, and mask blank for euvl |
| KR20220058424A (ko) * | 2020-10-30 | 2022-05-09 | 에이지씨 가부시키가이샤 | Euvl용 유리 기판, 및 euvl용 마스크 블랭크 |
| KR102638933B1 (ko) * | 2021-09-28 | 2024-02-22 | 에이지씨 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 및 도전막을 구비한 기판 |
| KR20250060932A (ko) | 2023-03-17 | 2025-05-07 | 에이지씨 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 및 도전막 구비 기판 |
| WO2024195577A1 (ja) * | 2023-03-17 | 2024-09-26 | Ａｇｃ株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランクおよび導電膜付き基板 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6737201B2 (en) | 2000-11-22 | 2004-05-18 | Hoya Corporation | Substrate with multilayer film, reflection type mask blank for exposure, reflection type mask for exposure and production method thereof as well as production method of semiconductor device |
| JP3939132B2 (ja) | 2000-11-22 | 2007-07-04 | Ｈｏｙａ株式会社 | 多層膜付き基板、露光用反射型マスクブランク、露光用反射型マスクおよびその製造方法、並びに半導体の製造方法 |
| TW583503B (en) * | 2000-12-01 | 2004-04-11 | Kansai Paint Co Ltd | Method of forming conductive pattern |
| US7524593B2 (en) * | 2005-08-12 | 2009-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Exposure mask |
| JP5082857B2 (ja) | 2005-12-12 | 2012-11-28 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランク、および該マスクブランク用の導電膜付基板 |
| US7678511B2 (en) | 2006-01-12 | 2010-03-16 | Asahi Glass Company, Limited | Reflective-type mask blank for EUV lithography |
| EP1993781A4 (en) * | 2006-02-03 | 2016-11-09 | Semiconductor Energy Lab Co Ltd | MANUFACTURING METHOD FOR MEMORY ELEMENT, LASER RADIATION APPARATUS AND LASER RADIATION METHOD |
| WO2008072706A1 (ja) | 2006-12-15 | 2008-06-19 | Asahi Glass Company, Limited | Ｅｕｖリソグラフィ用反射型マスクブランク、および該マスクブランク用の機能膜付基板 |
| DE102011078927B4 (de) | 2010-07-12 | 2019-01-31 | Carl Zeiss Sms Ltd. | Verfahren zum Korrigieren von Fehlern einer photolithographischen Maske |
| EP2581789B1 (en) * | 2011-10-14 | 2020-04-29 | Fundació Institut de Ciències Fotòniques | Optically transparent and electrically conductive coatings and method for their deposition on a substrate |
| JP6157874B2 (ja) * | 2012-03-19 | 2017-07-05 | Hoya株式会社 | Ｅｕｖリソグラフィー用多層反射膜付き基板及びｅｕｖリソグラフィー用反射型マスクブランク、並びにｅｕｖリソグラフィー用反射型マスク及び半導体装置の製造方法 |
| JP6039207B2 (ja) * | 2012-03-23 | 2016-12-07 | Hoya株式会社 | Ｅｕｖリソグラフィー用多層反射膜付き基板の製造方法及びｅｕｖリソグラフィー用反射型マスクブランクの製造方法、ｅｕｖリソグラフィー用反射型マスクの製造方法、及び半導体装置の製造方法 |
| US10431354B2 (en) * | 2013-03-15 | 2019-10-01 | Guardian Glass, LLC | Methods for direct production of graphene on dielectric substrates, and associated articles/devices |
| JP6297321B2 (ja) | 2013-12-09 | 2018-03-20 | Hoya株式会社 | 機能膜付き基板の製造方法、多層膜付き基板の製造方法、マスクブランクの製造方法、及び転写用マスクの製造方法 |
| US9618836B2 (en) | 2014-04-22 | 2017-04-11 | Asahi Glass Company, Limited | Reflective mask blank for EUV lithography, substrate with funtion film for the mask blank, and methods for their production |
| JP6033987B1 (ja) * | 2014-12-19 | 2016-11-30 | Hoya株式会社 | マスクブランク用基板、マスクブランク及びこれらの製造方法、転写用マスクの製造方法並びに半導体デバイスの製造方法 |
| DE102015108569B4 (de) * | 2015-05-29 | 2020-10-08 | Advanced Mask Technology Center Gmbh & Co. Kg | Reflektierende Fotomaske und Reflexionstyp-Maskenrohling |
| JP6288327B2 (ja) * | 2017-02-06 | 2018-03-07 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランク、および、ｅｕｖリソグラフィ用反射型マスク |
-
2018
- 2018-12-21 WO PCT/JP2018/047246 patent/WO2019131506A1/ja not_active Ceased
- 2018-12-21 SG SG11202005918UA patent/SG11202005918UA/en unknown
- 2018-12-21 TW TW107146312A patent/TWI786243B/zh active
- 2018-12-21 KR KR1020207011177A patent/KR102830574B1/ko active Active
- 2018-12-21 JP JP2019561646A patent/JP7208163B2/ja active Active
- 2018-12-21 US US16/955,734 patent/US11561463B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2019131506A5 (https=) | ||
| JP2017181571A5 (https=) | ||
| JP2024096901A5 (https=) | ||
| JP2021128247A5 (https=) | ||
| JP6544012B2 (ja) | Ｅｕｖリソグラフィ用反射型マスクブランク、該マスクブランク用の機能膜付基板および、それらの製造方法 | |
| JPWO2020184473A5 (https=) | ||
| JP2011501426A5 (https=) | ||
| TWI456271B (zh) | 線柵偏光板及其製造方法 | |
| JPWO2022138360A5 (https=) | ||
| TW200842939A (en) | Reflective mask blank for EUV lithography, and substrate with function film for the mask blank | |
| JP2010513942A5 (https=) | ||
| JP7208163B2 (ja) | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 | |
| CN105980935A (zh) | 形成导电网格图案的方法及由其制造的网格电极和层叠体 | |
| JP2016122684A5 (https=) | ||
| CN106648201B (zh) | 黑化金属网格结构及其制造方法 | |
| TW201545215A (zh) | 金屬線路微結構之製法 | |
| JP2014104600A5 (https=) | ||
| TWI860925B (zh) | Euv微影用反射型光罩基底及附有導電膜之基板 | |
| JP2012243876A5 (ja) | パワー半導体素子用Ａｌ合金膜 | |
| JP2023010987A5 (https=) | ||
| JP2017532586A5 (https=) | ||
| JPWO2023190696A5 (https=) | ||
| JP2020065038A (ja) | 銅箔電気抵抗とその銅箔電気抵抗を備える電気回路基板構造 | |
| CN111799340A (zh) | 一种可延展红外探测器及其制备方法 | |
| JP2018522281A5 (https=) |