JPWO2019097832A1 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JPWO2019097832A1 JPWO2019097832A1 JP2018567765A JP2018567765A JPWO2019097832A1 JP WO2019097832 A1 JPWO2019097832 A1 JP WO2019097832A1 JP 2018567765 A JP2018567765 A JP 2018567765A JP 2018567765 A JP2018567765 A JP 2018567765A JP WO2019097832 A1 JPWO2019097832 A1 JP WO2019097832A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 50
- 238000003860 storage Methods 0.000 title claims abstract description 32
- 239000007789 gas Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000000465 moulding Methods 0.000 description 8
- 238000001746 injection moulding Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
(2)上記(1)の態様において、前記各壁は、前記背面壁側から前記開口枠側まで、段階的に薄肉化した肉厚を有してもよい。
(3)上記(2)の態様において、前記各壁は、前記背面壁側から前記開口枠側まで、0.5mm以上1.5mm以下の差の範囲内で段階的に薄肉化した肉厚を有してもよい。
(4)上記(1)の態様において、前記各壁は、前記背面壁側から前記開口枠側まで、段差のない偏肉状に薄肉化した肉厚を有してもよい。
(5)上記(1)から(4)までのいずれか1つの態様において、前記開口枠及び前記各壁は、最厚肉部が3mm以上7mm以下であってもよい。
(6)上記(1)から(5)までのいずれか1つの態様において、前記開口枠及び前記各壁は、最薄肉部は、0.5mm以上2mm以下であってもよい。
(7)上記(1)から(6)までのいずれか1つの態様において、前記開口枠は、前記容器本体とは別の部品であって、前記容器本体に一体化されてもよい。
(8)上記(1)から(7)までのいずれか1つの態様において、前記開口枠は、前記各壁の肉厚よりも薄い肉厚を有してもよい。
上記実施形態では、各壁2b〜2fにおける第1肉厚部t1と第2肉厚部t2との間などの各段差部は、直線状になっていたが、ゲートGから離れる方向に向かって凸の円弧状になっていてもよい。これにより、樹脂の流動性(流速)をより均一にすることができる。
2 容器本体
2a 開口枠、2b 背面壁、2c 右側壁、2d 左側壁、2e 天面壁、2f 底面壁、21 支持片、22 位置規制部、23 グリップ、25 トップフランジ、26 ボトムプレート、2P 突出部
3R,3L 気体置換ユニット
4 蓋体
50 給気部材
60 排気部材
200 金型、210 凹型、220 凸型
G ゲート、R ランナー、S スプルー
t1 第1肉厚部、t2 第2肉厚部、t3 第3肉厚部、t4 第4肉厚部
W 基板
Claims (8)
- 開口枠で形成された開口部を前面に有するとともに、複数枚の基板を収納可能な容器本体と、
前記開口部を閉鎖する蓋体と、を備える基板収納容器において、
前記容器本体は、前記開口枠、背面壁、右側壁、左側壁、天面壁及び底面壁を含む箱状であり、
前記各壁は、前記背面壁側の肉厚よりも、前面の前記開口枠側の肉厚が薄い
ことを特徴とする基板収納容器。 - 前記各壁は、前記背面壁側から前記開口枠側まで、段階的に薄肉化した肉厚を有する
ことを特徴とする請求項1に記載の基板収納容器。 - 前記各壁は、前記背面壁側から前記開口枠側まで、0.5mm以上1.5mm以下の差の範囲内で段階的に薄肉化した肉厚を有する
ことを特徴とする請求項2に記載の基板収納容器。 - 前記各壁は、前記背面壁側から前記開口枠側まで、段差のない偏肉状に薄肉化した肉厚を有する
ことを特徴とする請求項1に記載の基板収納容器。 - 前記開口枠及び前記各壁は、最厚肉部が3mm以上7mm以下である
ことを特徴とする請求項1から4までのいずれか1項に記載の基板収納容器。 - 前記開口枠及び前記各壁は、最薄肉部は0.5mm以上2mm以下である
ことを特徴とする請求項1から5までのいずれか1項に記載の基板収納容器。 - 前記開口枠は、前記容器本体とは別の部品であって、前記容器本体に一体化されている
ことを特徴とする請求項1から6までのいずれか1項に記載の基板収納容器。 - 前記開口枠は、前記各壁の肉厚よりも薄い肉厚を有する
ことを特徴とする請求項1から7までのいずれか1項に記載の基板収納容器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017219818 | 2017-11-15 | ||
JP2017219818 | 2017-11-15 | ||
PCT/JP2018/034524 WO2019097832A1 (ja) | 2017-11-15 | 2018-09-18 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6578551B1 JP6578551B1 (ja) | 2019-09-25 |
JPWO2019097832A1 true JPWO2019097832A1 (ja) | 2019-11-21 |
Family
ID=66538625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018567765A Active JP6578551B1 (ja) | 2017-11-15 | 2018-09-18 | 基板収納容器 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11227781B2 (ja) |
JP (1) | JP6578551B1 (ja) |
KR (1) | KR102477834B1 (ja) |
CN (1) | CN111247632B (ja) |
DE (1) | DE112018005852B4 (ja) |
SG (1) | SG11202003883RA (ja) |
TW (1) | TWI774869B (ja) |
WO (1) | WO2019097832A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020089986A1 (ja) * | 2018-10-29 | 2020-05-07 | ミライアル株式会社 | 基板収納容器の成形方法、金型、及び、基板収納容器 |
US12027397B2 (en) | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
KR102418353B1 (ko) * | 2020-03-31 | 2022-07-06 | 미라이얼 가부시키가이샤 | 기판수납용기 |
USD954769S1 (en) * | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
JP7388712B2 (ja) * | 2020-07-22 | 2023-11-29 | 信越ポリマー株式会社 | 収納容器の製造方法 |
WO2024176449A1 (ja) * | 2023-02-24 | 2024-08-29 | ミライアル株式会社 | 基板収納容器 |
WO2024176450A1 (ja) * | 2023-02-24 | 2024-08-29 | ミライアル株式会社 | 基板収納容器 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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CH672584A5 (ja) * | 1987-07-03 | 1989-12-15 | Nestle Sa | |
ES2101340T3 (es) * | 1992-09-18 | 1997-07-01 | Michael Terence Laugier | Heladora. |
US5769266A (en) * | 1994-01-28 | 1998-06-23 | Berry Sterling Corporation | Large drink container to fit vehicle cup holders |
JP3709958B2 (ja) | 1998-01-26 | 2005-10-26 | 三菱マテリアル株式会社 | 板状部材収納容器及びその内箱構造、及び内箱成形用の射出成形金型 |
TW448120B (en) * | 1999-11-26 | 2001-08-01 | Takeuchi Press | Metal container with thread |
JP4330761B2 (ja) | 2000-04-17 | 2009-09-16 | 信越ポリマー株式会社 | ウェーハ輸送容器のサポート具 |
US6761041B2 (en) * | 2002-09-06 | 2004-07-13 | Henry Roth | Thermal energy storage system |
JP4667769B2 (ja) * | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | 基板収納容器 |
WO2007138913A1 (ja) * | 2006-05-29 | 2007-12-06 | Shin-Etsu Polymer Co., Ltd. | 基板収納容器 |
JP2007332271A (ja) | 2006-06-15 | 2007-12-27 | Miraial Kk | 高分子成形製品 |
EP2318192B1 (en) * | 2008-05-16 | 2015-08-12 | Sca Hygiene Products Ab | Method of making a dispenser or a part thereof |
PL2313243T3 (pl) * | 2008-05-16 | 2017-05-31 | Sca Hygiene Products Ab | Dwuskładnikowa część dozownika formowana wtryskowo |
JP2011018771A (ja) | 2009-07-09 | 2011-01-27 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP5374640B2 (ja) * | 2010-04-20 | 2013-12-25 | ミライアル株式会社 | 基板収納容器 |
JP5993560B2 (ja) | 2010-10-06 | 2016-09-14 | ゴールド工業株式会社 | 樹脂成形品、及び樹脂成形品の製造方法 |
TWI431712B (zh) | 2011-09-20 | 2014-03-21 | Gudeng Prec Ind Co Ltd | 大型前開式晶圓盒 |
JP5881436B2 (ja) | 2012-01-27 | 2016-03-09 | 信越ポリマー株式会社 | 基板収納容器 |
CN103479016A (zh) * | 2012-06-11 | 2014-01-01 | 鸿富锦精密工业(深圳)有限公司 | 箱体 |
JP2016522586A (ja) | 2013-06-18 | 2016-07-28 | インテグリス・インコーポレーテッド | 重量バラストを備えた前面開口型ウェーハ容器 |
WO2014203359A1 (ja) * | 2013-06-19 | 2014-12-24 | ミライアル株式会社 | 基板収納容器 |
USD766040S1 (en) * | 2014-11-17 | 2016-09-13 | Rastal Gmbh & Co. Kg | Glass |
TWI690468B (zh) * | 2015-07-13 | 2020-04-11 | 美商恩特葛瑞斯股份有限公司 | 具有強化圍阻的基板容器 |
JP6701493B2 (ja) | 2016-07-25 | 2020-05-27 | 信越ポリマー株式会社 | 容器本体の製造方法 |
-
2018
- 2018-09-18 US US16/763,994 patent/US11227781B2/en active Active
- 2018-09-18 WO PCT/JP2018/034524 patent/WO2019097832A1/ja active Application Filing
- 2018-09-18 SG SG11202003883RA patent/SG11202003883RA/en unknown
- 2018-09-18 CN CN201880068270.2A patent/CN111247632B/zh active Active
- 2018-09-18 JP JP2018567765A patent/JP6578551B1/ja active Active
- 2018-09-18 KR KR1020207011623A patent/KR102477834B1/ko active IP Right Grant
- 2018-09-18 DE DE112018005852.2T patent/DE112018005852B4/de active Active
- 2018-11-01 TW TW107138864A patent/TWI774869B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP6578551B1 (ja) | 2019-09-25 |
US20200279761A1 (en) | 2020-09-03 |
KR102477834B1 (ko) | 2022-12-16 |
TW201932383A (zh) | 2019-08-16 |
TWI774869B (zh) | 2022-08-21 |
US11227781B2 (en) | 2022-01-18 |
CN111247632B (zh) | 2023-11-14 |
SG11202003883RA (en) | 2020-05-28 |
DE112018005852B4 (de) | 2024-01-18 |
CN111247632A (zh) | 2020-06-05 |
DE112018005852T5 (de) | 2020-08-13 |
WO2019097832A1 (ja) | 2019-05-23 |
KR20200085273A (ko) | 2020-07-14 |
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