SG11202003883RA - Substrate storage container - Google Patents
Substrate storage containerInfo
- Publication number
- SG11202003883RA SG11202003883RA SG11202003883RA SG11202003883RA SG11202003883RA SG 11202003883R A SG11202003883R A SG 11202003883RA SG 11202003883R A SG11202003883R A SG 11202003883RA SG 11202003883R A SG11202003883R A SG 11202003883RA SG 11202003883R A SG11202003883R A SG 11202003883RA
- Authority
- SG
- Singapore
- Prior art keywords
- storage container
- substrate storage
- substrate
- container
- storage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017219818 | 2017-11-15 | ||
| PCT/JP2018/034524 WO2019097832A1 (en) | 2017-11-15 | 2018-09-18 | Substrate storage container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202003883RA true SG11202003883RA (en) | 2020-05-28 |
Family
ID=66538625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202003883RA SG11202003883RA (en) | 2017-11-15 | 2018-09-18 | Substrate storage container |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11227781B2 (en) |
| JP (1) | JP6578551B1 (en) |
| KR (1) | KR102477834B1 (en) |
| CN (1) | CN111247632B (en) |
| DE (1) | DE112018005852B4 (en) |
| SG (1) | SG11202003883RA (en) |
| TW (1) | TWI774869B (en) |
| WO (1) | WO2019097832A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020089986A1 (en) * | 2018-10-29 | 2020-05-07 | ミライアル株式会社 | Method for molding substrate storage container, mold, and substrate storage container |
| CN115428138A (en) * | 2020-03-31 | 2022-12-02 | 未来儿股份有限公司 | Substrate storage container |
| USD954769S1 (en) * | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
| JP7388712B2 (en) * | 2020-07-22 | 2023-11-29 | 信越ポリマー株式会社 | Storage container manufacturing method |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH672584A5 (en) * | 1987-07-03 | 1989-12-15 | Nestle Sa | |
| AU4980493A (en) * | 1992-09-18 | 1994-04-12 | Michael Terence Laugier | A freezer box |
| US5769266A (en) * | 1994-01-28 | 1998-06-23 | Berry Sterling Corporation | Large drink container to fit vehicle cup holders |
| JP3709958B2 (en) | 1998-01-26 | 2005-10-26 | 三菱マテリアル株式会社 | Plate-shaped member storage container, inner box structure thereof, and injection mold for inner box molding |
| TW448120B (en) * | 1999-11-26 | 2001-08-01 | Takeuchi Press | Metal container with thread |
| JP4330761B2 (en) * | 2000-04-17 | 2009-09-16 | 信越ポリマー株式会社 | Wafer transport container support |
| US6761041B2 (en) * | 2002-09-06 | 2004-07-13 | Henry Roth | Thermal energy storage system |
| JP4667769B2 (en) * | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | Substrate storage container |
| WO2007138913A1 (en) * | 2006-05-29 | 2007-12-06 | Shin-Etsu Polymer Co., Ltd. | Substrate container |
| JP2007332271A (en) | 2006-06-15 | 2007-12-27 | Miraial Kk | Polymeric molded product |
| US8733571B2 (en) * | 2008-05-16 | 2014-05-27 | Sca Hygiene Products Ab | Injection molded dispenser part with a seam |
| ES2549358T3 (en) * | 2008-05-16 | 2015-10-27 | Sca Hygiene Products Ab | Method of manufacturing a distributor or a part thereof |
| JP2011018771A (en) * | 2009-07-09 | 2011-01-27 | Shin Etsu Polymer Co Ltd | Substrate-storing container |
| DE112010005511B4 (en) * | 2010-04-20 | 2016-06-02 | Miraial Co., Ltd. | Substrate storage container with movable support structures |
| JP5993560B2 (en) * | 2010-10-06 | 2016-09-14 | ゴールド工業株式会社 | Resin molded product and method for producing resin molded product |
| TWI431712B (en) | 2011-09-20 | 2014-03-21 | Gudeng Prec Ind Co Ltd | Large-sized front opening unified wafer pod |
| JP5881436B2 (en) * | 2012-01-27 | 2016-03-09 | 信越ポリマー株式会社 | Substrate storage container |
| CN103479016A (en) * | 2012-06-11 | 2014-01-01 | 鸿富锦精密工业（深圳）有限公司 | Box body |
| US10304710B2 (en) | 2013-06-18 | 2019-05-28 | Entegris, Inc. | Front opening wafer container with weight ballast |
| KR102098790B1 (en) * | 2013-06-19 | 2020-04-08 | 미라이얼 가부시키가이샤 | Substrate storing container |
| USD766040S1 (en) * | 2014-11-17 | 2016-09-13 | Rastal Gmbh & Co. Kg | Glass |
| WO2017011564A1 (en) * | 2015-07-13 | 2017-01-19 | Entegris, Inc. | Substrate container with enhanced containment |
| JP6701493B2 (en) | 2016-07-25 | 2020-05-27 | 信越ポリマー株式会社 | Manufacturing method of container body |
-
2018
- 2018-09-18 JP JP2018567765A patent/JP6578551B1/en active Active
- 2018-09-18 CN CN201880068270.2A patent/CN111247632B/en active Active
- 2018-09-18 DE DE112018005852.2T patent/DE112018005852B4/en active Active
- 2018-09-18 SG SG11202003883RA patent/SG11202003883RA/en unknown
- 2018-09-18 WO PCT/JP2018/034524 patent/WO2019097832A1/en active Application Filing
- 2018-09-18 KR KR1020207011623A patent/KR102477834B1/en active IP Right Grant
- 2018-09-18 US US16/763,994 patent/US11227781B2/en active Active
- 2018-11-01 TW TW107138864A patent/TWI774869B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019097832A1 (en) | 2019-05-23 |
| JPWO2019097832A1 (en) | 2019-11-21 |
| US11227781B2 (en) | 2022-01-18 |
| DE112018005852B4 (en) | 2024-01-18 |
| JP6578551B1 (en) | 2019-09-25 |
| KR102477834B1 (en) | 2022-12-16 |
| CN111247632B (en) | 2023-11-14 |
| US20200279761A1 (en) | 2020-09-03 |
| DE112018005852T5 (en) | 2020-08-13 |
| TWI774869B (en) | 2022-08-21 |
| TW201932383A (en) | 2019-08-16 |
| KR20200085273A (en) | 2020-07-14 |
| CN111247632A (en) | 2020-06-05 |
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