SG11201700505UA - Substrate storage container - Google Patents

Substrate storage container

Info

Publication number
SG11201700505UA
SG11201700505UA SG11201700505UA SG11201700505UA SG11201700505UA SG 11201700505U A SG11201700505U A SG 11201700505UA SG 11201700505U A SG11201700505U A SG 11201700505UA SG 11201700505U A SG11201700505U A SG 11201700505UA SG 11201700505U A SG11201700505U A SG 11201700505UA
Authority
SG
Singapore
Prior art keywords
storage container
substrate storage
substrate
container
storage
Prior art date
Application number
SG11201700505UA
Inventor
Osamu Ogawa
Kiminori Tominaga
Yasuhiro Fujimoto
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Publication of SG11201700505UA publication Critical patent/SG11201700505UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
SG11201700505UA 2014-07-25 2015-07-21 Substrate storage container SG11201700505UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014151855 2014-07-25
PCT/JP2015/070655 WO2016013536A1 (en) 2014-07-25 2015-07-21 Substrate storage container

Publications (1)

Publication Number Publication Date
SG11201700505UA true SG11201700505UA (en) 2017-02-27

Family

ID=55163061

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700505UA SG11201700505UA (en) 2014-07-25 2015-07-21 Substrate storage container

Country Status (8)

Country Link
US (1) US10312122B2 (en)
JP (1) JP6532466B2 (en)
KR (1) KR102397525B1 (en)
CN (1) CN106537574B (en)
DE (1) DE112015003423T5 (en)
SG (1) SG11201700505UA (en)
TW (1) TWI661503B (en)
WO (1) WO2016013536A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6553498B2 (en) * 2015-12-15 2019-07-31 信越ポリマー株式会社 Substrate storage container
KR101865636B1 (en) * 2016-07-06 2018-06-08 우범제 Wafer storage container
US10923373B2 (en) * 2016-09-06 2021-02-16 Shin-Etsu Polymer Co., Ltd. Substrate storage container and gas replacement unit
JP6623988B2 (en) * 2016-09-09 2019-12-25 株式会社ダイフク Container storage equipment
US10115607B2 (en) * 2016-09-16 2018-10-30 Applied Materials, Inc. Method and apparatus for wafer outgassing control
US10262884B2 (en) 2016-11-10 2019-04-16 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port
JP6710861B2 (en) * 2017-01-24 2020-06-17 信越ポリマー株式会社 Substrate storage container and method for manufacturing substrate storage container
DE112018001612T5 (en) * 2017-03-27 2020-01-16 Shin-Etsu Polymer Co., Ltd. Substrate storage container
WO2018203384A1 (en) 2017-05-02 2018-11-08 ミライアル株式会社 Substrate storage container
KR102066175B1 (en) * 2017-12-28 2020-01-14 우범제 Wafer storage container
US11355371B2 (en) * 2018-04-02 2022-06-07 Bum Je WOO Wafer storage container
WO2019194326A1 (en) * 2018-04-02 2019-10-10 우범제 Wafer storage container
WO2020065968A1 (en) * 2018-09-28 2020-04-02 ミライアル株式会社 Substrate accommodation container
JP7299474B2 (en) * 2019-03-13 2023-06-28 シンフォニアテクノロジー株式会社 EFEM
CN112289718A (en) * 2019-07-13 2021-01-29 家登精密工业股份有限公司 Substrate carrier and gas diffusion module thereof
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
KR102272005B1 (en) * 2019-10-17 2021-07-02 (주)에스티아이 FOUP cleaning device
CN113937041A (en) * 2021-06-30 2022-01-14 家登精密工业股份有限公司 Substrate container system
TWI832599B (en) * 2022-07-27 2024-02-11 家登精密工業股份有限公司 Top-opening board carrier
TWI817828B (en) 2022-08-11 2023-10-01 家登精密工業股份有限公司 Substrate container with built-in negative pressure cavity
CN117524953A (en) * 2023-03-23 2024-02-06 家登精密工业股份有限公司 Air valve cover and substrate carrier applying same
JP7537570B1 (en) 2023-08-22 2024-08-21 ａｒｔｉｅｎｃｅ株式会社 Thermoplastic resin composition for electrical/electronic packaging material and electrical/electronic packaging material

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19540963C2 (en) 1995-11-03 1999-05-20 Jenoptik Jena Gmbh Transport container for disc-shaped objects
JP2002122382A (en) 2000-01-28 2002-04-26 Ebara Corp Substrate container
US6547953B2 (en) * 2000-01-28 2003-04-15 Ebara Corporation Substrate container and method of dehumidifying substrate container
JP2002170876A (en) * 2000-12-04 2002-06-14 Ebara Corp Substrate transport container
JP3960787B2 (en) 2001-11-30 2007-08-15 信越ポリマー株式会社 Precision substrate storage container
JP4201583B2 (en) 2002-11-28 2008-12-24 信越ポリマー株式会社 Substrate storage container
US6899145B2 (en) * 2003-03-20 2005-05-31 Asm America, Inc. Front opening unified pod
JP4027837B2 (en) 2003-04-28 2007-12-26 Ｔｄｋ株式会社 Purge apparatus and purge method
JP4920565B2 (en) * 2007-12-04 2012-04-18 株式会社アルバック Substrate container and substrate processing method
WO2009114798A2 (en) * 2008-03-13 2009-09-17 Entegris, Inc. Wafer container with tubular environmental control components
CN102812545B (en) * 2009-12-10 2016-08-03 恩特格里公司 The porous barrier of purging gas it is uniformly distributed in microenvironment
CN102939254A (en) * 2010-02-19 2013-02-20 信越聚合物株式会社 Substrate storing container
KR101368706B1 (en) * 2011-07-22 2014-02-28 주식회사 삼에스코리아 Wafer carrier
JP6087161B2 (en) * 2012-02-03 2017-03-01 東京エレクトロン株式会社 Method for purging substrate container
TWI610864B (en) * 2012-11-20 2018-01-11 恩特葛瑞斯股份有限公司 Substrate container with purge ports
TWM453233U (en) * 2013-01-07 2013-05-11 Gudeng Prec Ind Co Ltd Gas filling device for substrate storage container
JP6226190B2 (en) * 2014-02-20 2017-11-08 Tdk株式会社 Purge system, and pod and load port apparatus provided for the purge system
US9881826B2 (en) * 2014-10-24 2018-01-30 Lam Research Corporation Buffer station with single exit-flow direction

Also Published As

Publication number Publication date
US20170213752A1 (en) 2017-07-27
WO2016013536A1 (en) 2016-01-28
DE112015003423T5 (en) 2017-05-04
KR102397525B1 (en) 2022-05-12
CN106537574A (en) 2017-03-22
US10312122B2 (en) 2019-06-04
KR20170038846A (en) 2017-04-07
JP6532466B2 (en) 2019-06-19
TWI661503B (en) 2019-06-01
JPWO2016013536A1 (en) 2017-05-25
CN106537574B (en) 2020-06-05
TW201622047A (en) 2016-06-16

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