JPWO2019065355A1 - 吸着ステージ - Google Patents
吸着ステージ Download PDFInfo
- Publication number
- JPWO2019065355A1 JPWO2019065355A1 JP2019544980A JP2019544980A JPWO2019065355A1 JP WO2019065355 A1 JPWO2019065355 A1 JP WO2019065355A1 JP 2019544980 A JP2019544980 A JP 2019544980A JP 2019544980 A JP2019544980 A JP 2019544980A JP WO2019065355 A1 JPWO2019065355 A1 JP WO2019065355A1
- Authority
- JP
- Japan
- Prior art keywords
- suction
- semiconductor die
- valve
- vacuum
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001179 sorption measurement Methods 0.000 title claims description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 92
- 238000012856 packing Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
Description
導体ダイのサイズに合わせて吸着ステージを交換することが必要であった。このため、ボンディングのタクトタイムが長くなってしまうという問題があった。
[0006]
そこで、本発明は、複数のサイズの半導体ダイを好適に吸着保持可能な吸着ステージを提供することを目的とする。
課題を解決するための手段
[0007]
本発明の吸着ステージは、異なるサイズの半導体ダイを吸着保持する吸着ステージであって、複数の吸着孔が設けられた上板と、上板に設けられた複数の吸着孔を半導体ダイのサイズに応じた複数のグループ毎に真空装置に接続する複数の真空流路と、複数の真空流路の内の少なくとも1つの真空流路に設けられた逆止弁と、を含み、逆止弁は、吸着孔が大気開放されている場合に閉となり、半導体ダイによって吸着孔が塞がれると開となり、逆止弁は、弁座面が粗面であり、閉状態において弁体と弁座面との間から空気の微小リークが発生する弁であることを特徴とする。
[0008]
[0009]
本発明の吸着ステージにおいて、弁座面は空気が通流する孔が設けられた円弧面状の面であり、弁体は弁座面の一端に取り付けられた弾性体で構成された帯状体であり、逆止弁は、孔を弁体が開閉する弁としてもよい。また、本発明の吸着ステージにおいて、吸着孔が均等に配置されていることとしてもよい。
発明の効果
[0010]
本発明は、複数のサイズの半導体ダイを好適に吸着保持可能な吸着ステージを提供できる。
図面の簡単な説明
[0011]
[図1]実施形態の吸着ステージを組み込んだダイボンディング装置の構成を示す説明図である。
[図2]実施形態の吸着ステージの斜視図である。
Claims (4)
- 異なるサイズの半導体ダイを吸着保持する吸着ステージであって、
複数の吸着孔が設けられた上板と、
前記上板に設けられた複数の前記吸着孔を半導体ダイのサイズに応じた複数のグループ毎に真空装置に接続する複数の真空流路と、
複数の前記真空流路の内の少なくとも1つの前記真空流路に設けられた逆止弁と、を含み、
前記逆止弁は、前記吸着孔が大気開放されている場合に閉となり、半導体ダイによって前記吸着孔が塞がれると開となること、
を特徴とする吸着ステージ。 - 請求項1に記載の吸着ステージであって、
前記逆止弁は、弁座面が粗面であり、閉状態において弁体と前記弁座面との間から空気の微小リークが発生する弁であること、
を特徴とする吸着ステージ。 - 請求項2に記載の吸着ステージであって、
前記弁座面は空気が通流する孔が設けられた円弧面状の面であり、前記弁体は前記弁座面の一端に取り付けられた弾性体で構成された帯状体であり、前記逆止弁は、前記孔を前記弁体が開閉する弁であること、
を特徴とする吸着ステージ。 - 請求項1から3のいずれか1項に記載の吸着ステージであって、
前記吸着孔が均等に配置されていること、
を特徴とする吸着ステージ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017188635 | 2017-09-28 | ||
JP2017188635 | 2017-09-28 | ||
PCT/JP2018/034388 WO2019065355A1 (ja) | 2017-09-28 | 2018-09-18 | 吸着ステージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019065355A1 true JPWO2019065355A1 (ja) | 2020-07-30 |
JP6817658B2 JP6817658B2 (ja) | 2021-01-27 |
Family
ID=65901325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019544980A Active JP6817658B2 (ja) | 2017-09-28 | 2018-09-18 | 吸着ステージ |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6817658B2 (ja) |
KR (1) | KR102339079B1 (ja) |
CN (1) | CN111149197B (ja) |
SG (1) | SG11202004896TA (ja) |
TW (1) | TWI684223B (ja) |
WO (1) | WO2019065355A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114939852B (zh) * | 2022-06-06 | 2023-02-24 | 深圳宜美智科技股份有限公司 | 高精度可移动真空吸附平台及高精度检测设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0490946U (ja) * | 1990-12-26 | 1992-08-07 | ||
JP2009200377A (ja) * | 2008-02-25 | 2009-09-03 | Panasonic Corp | ダイボンディング装置 |
JP2009212254A (ja) * | 2008-03-04 | 2009-09-17 | Toray Eng Co Ltd | チップ搭載方法およびチップ搭載装置 |
JP2013179207A (ja) * | 2012-02-29 | 2013-09-09 | Hitachi High-Tech Instruments Co Ltd | 電子部品の載置テーブルと同テーブルを備えたダイボンダ |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618250A (ja) * | 1984-06-23 | 1986-01-14 | Mitsubishi Electric Corp | 真空吸着台 |
JPH081464A (ja) * | 1992-06-17 | 1996-01-09 | Shibayama Kikai Kk | ユニバーサルチャック機構の自動切換装置 |
WO2007114331A1 (ja) * | 2006-04-04 | 2007-10-11 | Miraial Co., Ltd. | 薄板収納容器 |
JP5126091B2 (ja) * | 2009-02-02 | 2013-01-23 | ウシオ電機株式会社 | ワークステージ及び該ワークステージを使用した露光装置 |
KR101974670B1 (ko) * | 2011-05-27 | 2019-05-02 | 토레이 엔지니어링 컴퍼니, 리미티드 | 실장 방법 및 실장 장치 |
JP5815345B2 (ja) | 2011-09-16 | 2015-11-17 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
JP2013232466A (ja) * | 2012-04-27 | 2013-11-14 | Mitsuboshi Diamond Industrial Co Ltd | 基板吸着装置 |
CN103904013B (zh) * | 2012-12-28 | 2016-12-28 | 上海微电子装备有限公司 | 一种真空吸附装置及吸附测校方法 |
JP2015013737A (ja) * | 2013-07-08 | 2015-01-22 | 三菱電機株式会社 | ワーク吸着装置およびワーク吸着方法 |
WO2015043638A1 (en) * | 2013-09-26 | 2015-04-02 | Süss Microtec Lithography Gmbh | Chuck for suction and holding a wafer |
-
2018
- 2018-09-18 CN CN201880062674.0A patent/CN111149197B/zh active Active
- 2018-09-18 KR KR1020207011459A patent/KR102339079B1/ko active IP Right Grant
- 2018-09-18 SG SG11202004896TA patent/SG11202004896TA/en unknown
- 2018-09-18 WO PCT/JP2018/034388 patent/WO2019065355A1/ja active Application Filing
- 2018-09-18 JP JP2019544980A patent/JP6817658B2/ja active Active
- 2018-09-26 TW TW107133701A patent/TWI684223B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0490946U (ja) * | 1990-12-26 | 1992-08-07 | ||
JP2009200377A (ja) * | 2008-02-25 | 2009-09-03 | Panasonic Corp | ダイボンディング装置 |
JP2009212254A (ja) * | 2008-03-04 | 2009-09-17 | Toray Eng Co Ltd | チップ搭載方法およびチップ搭載装置 |
JP2013179207A (ja) * | 2012-02-29 | 2013-09-09 | Hitachi High-Tech Instruments Co Ltd | 電子部品の載置テーブルと同テーブルを備えたダイボンダ |
Also Published As
Publication number | Publication date |
---|---|
JP6817658B2 (ja) | 2021-01-27 |
KR102339079B1 (ko) | 2021-12-14 |
WO2019065355A1 (ja) | 2019-04-04 |
TW201921522A (zh) | 2019-06-01 |
CN111149197A (zh) | 2020-05-12 |
CN111149197B (zh) | 2023-06-02 |
KR20200051815A (ko) | 2020-05-13 |
TWI684223B (zh) | 2020-02-01 |
SG11202004896TA (en) | 2020-06-29 |
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