JPWO2018216476A1 - 基板処理装置および基板処理方法 - Google Patents
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Abstract
Description
まずは、図1を参照しながら、実施形態に係る基板処理システム1の概略構成について説明する。図1は、実施形態に係る基板処理システム1の概略構成を示す図である。以下では、位置関係を明確にするために、互いに直交するX軸、Y軸およびZ軸を規定し、Z軸正方向を鉛直上向き方向とする。
次に、図2を参照しながら、洗浄処理ユニット16の概略構成について説明する。図2は、実施形態に係る洗浄処理ユニット16の構成を示す断面図である。なお、洗浄処理ユニット16は、液処理部の一例である。洗浄処理ユニット16は、たとえば、スピン洗浄によりウェハWを1枚ずつ洗浄する枚葉式の洗浄処理ユニットとして構成される。
つづいて、乾燥処理ユニット17の構成について説明する。図3は、実施形態に係る乾燥処理ユニット17の構成を示す外観斜視図である。なお、乾燥処理ユニット17は、後処理部の一例である。
つづいて、図7を参照しながら、実施形態に係る基板処理の詳細について説明する。図7は、実施形態に係る基板処理システム1が実行する基板処理の処理手順を示すフローチャートである。
つづいて、上述の実施形態における各種変形例について説明する。
1 基板処理システム
4 制御装置
14 受渡部
15 搬送部
16 洗浄処理ユニット
17 乾燥処理ユニット
19 制御部
19b 判定部
20 記憶部
41 撮像部
42 調整部
100 エッジ
Claims (10)
- 基板に液体を供給し、前記基板に液膜を形成する液処理部と、
前記液膜が形成された前記基板の表面を撮像する撮像部と、
撮像された前記基板の画像に基づいて、前記液膜の形成状態の良否を判定する判定部と、
前記液膜の形成状態が良好であると判定された場合に、前記液膜が形成された前記基板を処理する後処理部と、を備える
基板処理装置。 - 前記液膜の形成状態が良好ではないと判定された場合に、前記液膜の形成状態が良好となるように前記液膜の形成状態を調整する調整部をさらに備える
請求項1に記載の基板処理装置。 - 前記撮像部は、
前記後処理部に隣接して設けられる
請求項1または2に記載の基板処理装置。 - 前記基板を搬送する搬送系をさらに備え、
前記撮像部は、
前記搬送系に設けられる
請求項1〜3のいずれか一つに記載の基板処理装置。 - 前記判定部は、
前記撮像部で撮像された画像におけるコントラスト差に基づいて前記液膜と前記基板の表面における乾燥部分との界面を検出し、検出された前記界面の位置に基づいて前記液膜の形成状態の良否を判定する
請求項1〜4のいずれか一つに記載の基板処理装置。 - 前記撮像部は、
異なる箇所で前記基板の表面を撮像する第1撮像部と第2撮像部とを有し、
前記判定部は、
前記第1撮像部で撮像された前記基板の画像と、前記第2撮像部で撮像された前記基板の画像との差分画像に基づいて、前記液膜の形成状態の良否を判定する
請求項1〜4のいずれか一つに記載の基板処理装置。 - 前記判定部は、
前記撮像部で撮像された前記基板の画像と所定の基準画像との差分画像に基づいて、前記液膜の形成状態の良否を判定する
請求項1〜4のいずれか一つに記載の基板処理装置。 - 前記後処理部は、
前記液膜が形成された前記基板を超臨界状態の処理流体と接触させて、前記基板を乾燥させる
請求項1〜7のいずれか一つに記載の基板処理装置。 - 前記液処理部は、
前記液膜を形成する液体が前記基板上に吐出される前に、前記液体を融点以上かつ室温以下に冷却する冷却部を有する
請求項1〜8のいずれか一つに記載の基板処理装置。 - 基板に液体を供給し、前記基板に液膜を形成する液処理工程と、
前記液膜が形成された前記基板の表面を撮像する撮像工程と、
撮像された前記基板の画像に基づいて、前記液膜の形成状態の良否を判定する判定工程と、
前記液膜の形成状態が良好であると判定された場合に、前記液膜が形成された前記基板を処理する後処理工程と、を含む
基板処理方法。
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JP2017102455 | 2017-05-24 | ||
JP2017102455 | 2017-05-24 | ||
PCT/JP2018/018038 WO2018216476A1 (ja) | 2017-05-24 | 2018-05-10 | 基板処理装置および基板処理方法 |
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JP7261052B2 (ja) * | 2019-03-26 | 2023-04-19 | 株式会社Screenホールディングス | 基板処理装置およびその搬送制御方法 |
JP2022121188A (ja) * | 2021-02-08 | 2022-08-19 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP2023096642A (ja) * | 2021-12-27 | 2023-07-07 | 株式会社Screenホールディングス | 動作監視方法および製造装置 |
JP2024117888A (ja) | 2023-02-20 | 2024-08-30 | 東京エレクトロン株式会社 | 基板処理装置における処理液の流量推定方法および基板処理装置 |
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TWI787263B (zh) | 2022-12-21 |
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US11508588B2 (en) | 2022-11-22 |
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