US4765179A
(en)
|
1985-09-09 |
1988-08-23 |
Solid State Farms, Inc. |
Radio frequency spectroscopy apparatus and method using multiple frequency waveforms
|
US4825467A
(en)
|
1986-11-25 |
1989-04-25 |
International Telesystems, Inc. |
Restricted access television transmission system
|
US6165311A
(en)
|
1991-06-27 |
2000-12-26 |
Applied Materials, Inc. |
Inductively coupled RF plasma reactor having an overhead solenoidal antenna
|
JP3132599B2
(ja)
|
1992-08-05 |
2001-02-05 |
株式会社日立製作所 |
マイクロ波プラズマ処理装置
|
US5525159A
(en)
*
|
1993-12-17 |
1996-06-11 |
Tokyo Electron Limited |
Plasma process apparatus
|
US5522934A
(en)
|
1994-04-26 |
1996-06-04 |
Tokyo Electron Limited |
Plasma processing apparatus using vertical gas inlets one on top of another
|
US6082294A
(en)
*
|
1996-06-07 |
2000-07-04 |
Saint-Gobain Industrial Ceramics, Inc. |
Method and apparatus for depositing diamond film
|
US6161499A
(en)
*
|
1997-07-07 |
2000-12-19 |
Cvd Diamond Corporation |
Apparatus and method for nucleation and deposition of diamond using hot-filament DC plasma
|
DE19882883B4
(de)
*
|
1997-12-15 |
2009-02-26 |
Advanced Silicon Materials LLC, (n.d.Ges.d.Staates Delaware), Moses Lake |
System für die chemische Abscheidung aus der Gasphase zum Herstellen polykristalliner Siliziumstangen
|
JP3544136B2
(ja)
|
1998-02-26 |
2004-07-21 |
キヤノン株式会社 |
プラズマ処理装置及びプラズマ処理方法
|
JP3332857B2
(ja)
|
1998-04-15 |
2002-10-07 |
三菱重工業株式会社 |
高周波プラズマ発生装置及び給電方法
|
US6164241A
(en)
|
1998-06-30 |
2000-12-26 |
Lam Research Corporation |
Multiple coil antenna for inductively-coupled plasma generation systems
|
JP3316490B2
(ja)
|
2000-03-13 |
2002-08-19 |
三菱重工業株式会社 |
放電電極への給電方法、高周波プラズマ生成方法および半導体製造方法
|
JP3377773B2
(ja)
|
2000-03-24 |
2003-02-17 |
三菱重工業株式会社 |
放電電極への給電方法、高周波プラズマ発生方法および半導体製造方法
|
TW507256B
(en)
|
2000-03-13 |
2002-10-21 |
Mitsubishi Heavy Ind Ltd |
Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus
|
JP2001274101A
(ja)
|
2000-03-27 |
2001-10-05 |
Mitsubishi Heavy Ind Ltd |
棒状電極を有するプラズマ化学蒸着装置
|
DE60134081D1
(de)
|
2000-04-13 |
2008-07-03 |
Ihi Corp |
Herstellungsverfahren von Dünnschichten, Gerät zur Herstellung von Dünnschichten und Sonnenzelle
|
EP1293588B1
(en)
|
2000-05-17 |
2009-12-16 |
IHI Corporation |
Plasma cvd apparatus and method
|
JP2002305151A
(ja)
*
|
2001-04-05 |
2002-10-18 |
Mitsubishi Heavy Ind Ltd |
表面処理装置及び表面処理方法
|
JP3872363B2
(ja)
|
2002-03-12 |
2007-01-24 |
京セラ株式会社 |
Cat−PECVD法
|
BR0309810A
(pt)
|
2002-05-08 |
2007-04-10 |
Dana Corp |
sistemas e método de tratamento da exaustão de motor e veìculo móvel
|
JP3840147B2
(ja)
*
|
2002-06-21 |
2006-11-01 |
キヤノン株式会社 |
成膜装置、成膜方法およびそれを用いた電子放出素子、電子源、画像形成装置の製造方法
|
JP2004055600A
(ja)
|
2002-07-16 |
2004-02-19 |
Tokyo Electron Ltd |
プラズマ処理装置
|
KR100465907B1
(ko)
|
2002-09-26 |
2005-01-13 |
학교법인 성균관대학 |
자장이 인가된 내장형 선형 안테나를 구비하는 대면적처리용 유도 결합 플라즈마 소오스
|
US7137353B2
(en)
*
|
2002-09-30 |
2006-11-21 |
Tokyo Electron Limited |
Method and apparatus for an improved deposition shield in a plasma processing system
|
JP2004128159A
(ja)
|
2002-10-01 |
2004-04-22 |
Mitsubishi Heavy Ind Ltd |
高周波プラズマ発生装置および高周波プラズマ発生方法
|
AU2002344594B2
(en)
|
2002-10-29 |
2005-06-09 |
Mitsubishi Heavy Industries, Ltd. |
Method and device for generating uniform high-frequency plasma over large surface area used for plasma chemical vapor deposition apparatus
|
JP3902113B2
(ja)
|
2002-10-31 |
2007-04-04 |
三菱重工業株式会社 |
プラズマ化学蒸着方法
|
US20050067934A1
(en)
|
2003-09-26 |
2005-03-31 |
Ishikawajima-Harima Heavy Industries Co., Ltd. |
Discharge apparatus, plasma processing method and solar cell
|
EP1574597B1
(en)
*
|
2004-03-12 |
2012-01-11 |
Universiteit Utrecht Holding B.V. |
Process for producing thin films and devices
|
US8293069B2
(en)
|
2004-03-15 |
2012-10-23 |
Sungkyunkwan University |
Inductively coupled plasma apparatus
|
US20060021703A1
(en)
|
2004-07-29 |
2006-02-02 |
Applied Materials, Inc. |
Dual gas faceplate for a showerhead in a semiconductor wafer processing system
|
JP4634138B2
(ja)
*
|
2004-12-27 |
2011-02-16 |
日本碍子株式会社 |
プラズマ発生電極及びプラズマ反応器
|
US20060185595A1
(en)
*
|
2005-02-23 |
2006-08-24 |
Coll Bernard F |
Apparatus and process for carbon nanotube growth
|
US7842159B2
(en)
*
|
2005-07-14 |
2010-11-30 |
Sungkyunkwan University Foundation For Corporate Collaboration |
Inductively coupled plasma processing apparatus for very large area using dual frequency
|
JP2007067157A
(ja)
*
|
2005-08-31 |
2007-03-15 |
Tokyo Ohka Kogyo Co Ltd |
気相反応処理装置
|
US7455735B2
(en)
|
2005-09-28 |
2008-11-25 |
Nordson Corporation |
Width adjustable substrate support for plasma processing
|
US9194036B2
(en)
*
|
2007-09-06 |
2015-11-24 |
Infineon Technologies Ag |
Plasma vapor deposition
|
JP2008047938A
(ja)
|
2007-10-17 |
2008-02-28 |
Masayoshi Murata |
高周波プラズマcvd装置と高周波プラズマcvd法及び半導体薄膜製造法。
|
FR2922696B1
(fr)
|
2007-10-22 |
2010-03-12 |
St Microelectronics Sa |
Resonateur a ondes de lamb
|
JP4540742B2
(ja)
|
2008-01-25 |
2010-09-08 |
三井造船株式会社 |
原子層成長装置および薄膜形成方法
|
KR101111494B1
(ko)
*
|
2008-02-18 |
2012-02-23 |
미쯔이 죠센 가부시키가이샤 |
원자층 성장 장치 및 원자층 성장 방법
|
JP5136134B2
(ja)
|
2008-03-18 |
2013-02-06 |
ソニー株式会社 |
バンドパスフィルタ装置、その製造方法、テレビジョンチューナおよびテレビジョン受信機
|
EP2321446B1
(en)
*
|
2008-06-23 |
2017-05-10 |
GTAT Corporation |
Chuck and bridge connection points for tube filaments in a chemical vapor deposition reactor
|
KR100938782B1
(ko)
|
2009-07-06 |
2010-01-27 |
주식회사 테스 |
플라즈마 발생용 전극 및 플라즈마 발생장치
|
KR101073834B1
(ko)
*
|
2009-09-10 |
2011-10-14 |
주성엔지니어링(주) |
플라즈마 처리장치 및 처리방법
|
JP5648349B2
(ja)
|
2009-09-17 |
2015-01-07 |
東京エレクトロン株式会社 |
成膜装置
|
DE202010014805U1
(de)
*
|
2009-11-02 |
2011-02-17 |
Lam Research Corporation (Delaware Corporation) |
Heissrandring mit geneigter oberer Oberfläche
|
US8492736B2
(en)
*
|
2010-06-09 |
2013-07-23 |
Lam Research Corporation |
Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates
|
US8914166B2
(en)
|
2010-08-03 |
2014-12-16 |
Honeywell International Inc. |
Enhanced flight vision system for enhancing approach runway signatures
|
JP5919482B2
(ja)
*
|
2011-03-03 |
2016-05-18 |
パナソニックIpマネジメント株式会社 |
触媒化学気相成膜装置、それを用いた成膜方法及び触媒体の表面処理方法
|
JP5505731B2
(ja)
*
|
2011-03-10 |
2014-05-28 |
日新イオン機器株式会社 |
イオン源
|
US10271416B2
(en)
|
2011-10-28 |
2019-04-23 |
Applied Materials, Inc. |
High efficiency triple-coil inductively coupled plasma source with phase control
|
JP5495138B2
(ja)
|
2011-10-31 |
2014-05-21 |
日新イオン機器株式会社 |
イオン源
|
US20130105083A1
(en)
|
2011-11-01 |
2013-05-02 |
Lam Research Corporation |
Systems Comprising Silicon Coated Gas Supply Conduits And Methods For Applying Coatings
|
US9396900B2
(en)
|
2011-11-16 |
2016-07-19 |
Tokyo Electron Limited |
Radio frequency (RF) power coupling system utilizing multiple RF power coupling elements for control of plasma properties
|
CN102548177B
(zh)
|
2012-01-13 |
2014-07-02 |
北京交通大学 |
等离子体空气净化装置的放电电极结构
|
DE102012103425A1
(de)
|
2012-04-19 |
2013-10-24 |
Roth & Rau Ag |
Mikrowellenplasmaerzeugungsvorrichtung und Verfahren zu deren Betrieb
|
US20130292057A1
(en)
*
|
2012-04-26 |
2013-11-07 |
Applied Materials, Inc. |
Capacitively coupled plasma source with rf coupled grounded electrode
|
JP2014049541A
(ja)
|
2012-08-30 |
2014-03-17 |
Mitsubishi Heavy Ind Ltd |
薄膜製造装置及びその電極電圧調整方法
|
WO2014149962A1
(en)
|
2013-03-14 |
2014-09-25 |
Applied Materials, Inc. |
Apparatus for coupling a hot wire source to a process chamber
|
US9419583B2
(en)
|
2013-04-22 |
2016-08-16 |
Northeastern University |
Nano- and micro-electromechanical resonators
|
US9355821B2
(en)
|
2013-06-19 |
2016-05-31 |
Institute Of Nuclear Energy Research Atomic Energy Council, Executive Yuan |
Large-area plasma generating apparatus
|
EP2849204B1
(de)
*
|
2013-09-12 |
2017-11-29 |
Meyer Burger (Germany) AG |
Plasmaerzeugungsvorrichtung
|
DE102013112855A1
(de)
|
2013-11-21 |
2015-05-21 |
Aixtron Se |
Vorrichtung und Verfahren zum Fertigen von aus Kohlenstoff bestehenden Nanostrukturen
|
US9673025B2
(en)
*
|
2015-07-27 |
2017-06-06 |
Lam Research Corporation |
Electrostatic chuck including embedded faraday cage for RF delivery and associated methods for operation, monitoring, and control
|
US9673042B2
(en)
*
|
2015-09-01 |
2017-06-06 |
Applied Materials, Inc. |
Methods and apparatus for in-situ cleaning of copper surfaces and deposition and removal of self-assembled monolayers
|
US9554738B1
(en)
|
2016-03-30 |
2017-01-31 |
Zyomed Corp. |
Spectroscopic tomography systems and methods for noninvasive detection and measurement of analytes using collision computing
|
US11424104B2
(en)
*
|
2017-04-24 |
2022-08-23 |
Applied Materials, Inc. |
Plasma reactor with electrode filaments extending from ceiling
|
US20180308667A1
(en)
*
|
2017-04-24 |
2018-10-25 |
Kenneth S. Collins |
Plasma reactor with groups of electrodes
|
US20180308663A1
(en)
*
|
2017-04-24 |
2018-10-25 |
Kenneth S. Collins |
Plasma reactor with phase shift applied across electrode array
|
US20180308664A1
(en)
*
|
2017-04-24 |
2018-10-25 |
Kenneth S. Collins |
Plasma reactor with filaments and rf power applied at multiple frequencies
|
US11114284B2
(en)
*
|
2017-06-22 |
2021-09-07 |
Applied Materials, Inc. |
Plasma reactor with electrode array in ceiling
|
US10510515B2
(en)
*
|
2017-06-22 |
2019-12-17 |
Applied Materials, Inc. |
Processing tool with electrically switched electrode assembly
|