JPWO2018034101A1 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JPWO2018034101A1 JPWO2018034101A1 JP2018534308A JP2018534308A JPWO2018034101A1 JP WO2018034101 A1 JPWO2018034101 A1 JP WO2018034101A1 JP 2018534308 A JP2018534308 A JP 2018534308A JP 2018534308 A JP2018534308 A JP 2018534308A JP WO2018034101 A1 JPWO2018034101 A1 JP WO2018034101A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
(2)上記(1)の態様において、前記取付機構は、前記容器本体の周壁に設けられ、前記搬送部品を嵌合係止するストッパを含んでもよい。
(3)上記(1)又は(2)の態様において、前記搬送部品は、前記取付機構に係合する被係合部を有し、前記被係合部は、所定の方向に変位して前記第1取付部に係合する第1被係合部と、前記所定の方向とは異なる方向に変位して前記第2取付部に係合する第2被係合部とを含んでもよい。
搬送部品30を取付ける取付機構40は、容器本体20の天井面22に一体に形成されている。そのため、取付機構40は、容器本体20と同様の成形材料により成形されている。
搬送部品30を容器本体20の取付機構40に装着するには、容器本体20の天井面22の後方B側に搬送部品30を配置し、取付機構40の複数対の支持レール24間に搬送部品30の被挟持板32をそれぞれ挟持させ、容器本体20の正面F側にスライドさせ、各ストッパ25に搬送部品30の被挟持板32の前部を嵌合係止し、搬送部品30の上方への抜けを防止する(図3参照)。
上記実施形態では、第1取付部40Aは2か所、第2取付部40Bは1か所設けられていたが、これらに限らない。例えば、第1取付部40Aが1か所又は3か所以上設けられていてもよいし、第2取付部40Bが2か所以上設けられていてもよい。このとき、それぞれの第1取付部40A、第2取付部40Bに応じて、第1被係合部36、第2被係合部37を形成する。
10 蓋体
20 容器本体
21 開口部、22 天井面、23 側壁、24 支持レール、25 ストッパ、26 ガイド片、27 干渉係合部、28 二股部
30 搬送部品
31 部品本体、32 被挟持板、33 フランジ、34 縦壁、35 補強リブ、36 第1被係合部、37 第2被係合部
320 側面、321,332,334,340 流通口、322 凹凸部、330 凹部、333 角孔、350 内側辺、360 ロックピン、361 把持片
40 取付機構、40A 第1取付部、40B 第2取付部
F 正面
B 後方
W 基板
Claims (3)
- 蓋体により閉鎖される開口部を有し、複数枚の基板を収納可能な容器本体と、
前記容器本体に設けられた取付機構に着脱自在に取付けられる搬送部品と、を備え、
前記取付機構が、前記容器本体の前記開口部側の第1取付部と、前記開口部から離れる側の第2取付部とを含む
ことを特徴とする基板収納容器。 - 前記取付機構は、前記容器本体の周壁に設けられ、前記搬送部品を嵌合係止するストッパを含む
ことを特徴とする請求項1に記載の基板収納容器。 - 前記搬送部品は、前記取付機構に係合する被係合部を有し、
前記被係合部は、所定の方向に変位して前記第1取付部に係合する第1被係合部と、前記所定の方向とは異なる方向に変位して前記第2取付部に係合する第2被係合部とを含む
ことを特徴とする請求項1又は2に記載の基板収納容器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016161086 | 2016-08-19 | ||
JP2016161086 | 2016-08-19 | ||
PCT/JP2017/026201 WO2018034101A1 (ja) | 2016-08-19 | 2017-07-20 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018034101A1 true JPWO2018034101A1 (ja) | 2019-06-13 |
JP6760558B2 JP6760558B2 (ja) | 2020-09-23 |
Family
ID=61196755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018534308A Active JP6760558B2 (ja) | 2016-08-19 | 2017-07-20 | 基板収納容器 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10727099B2 (ja) |
JP (1) | JP6760558B2 (ja) |
KR (1) | KR102344236B1 (ja) |
CN (1) | CN109314072B (ja) |
DE (1) | DE112017004145T5 (ja) |
SG (1) | SG11201811785RA (ja) |
TW (1) | TWI743167B (ja) |
WO (1) | WO2018034101A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7336923B2 (ja) * | 2019-09-05 | 2023-09-01 | 信越ポリマー株式会社 | 基板収納容器 |
TWI746045B (zh) * | 2020-07-07 | 2021-11-11 | 家登精密工業股份有限公司 | 基板載具鎖扣結構 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008034879A (ja) * | 2007-10-15 | 2008-02-14 | Miraial Kk | 薄板支持容器 |
JP2011129660A (ja) * | 2009-12-17 | 2011-06-30 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2011181867A (ja) * | 2010-03-04 | 2011-09-15 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2013546176A (ja) * | 2010-10-19 | 2013-12-26 | インテグリス・インコーポレーテッド | ロボットフランジを有する前面開口ウェーハ容器 |
WO2014192109A1 (ja) * | 2013-05-29 | 2014-12-04 | ミライアル株式会社 | 基板収納容器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4146718B2 (ja) * | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | 薄板支持容器 |
WO2009114798A2 (en) * | 2008-03-13 | 2009-09-17 | Entegris, Inc. | Wafer container with tubular environmental control components |
JP2011249372A (ja) * | 2010-05-24 | 2011-12-08 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
-
2017
- 2017-07-20 CN CN201780034631.7A patent/CN109314072B/zh active Active
- 2017-07-20 JP JP2018534308A patent/JP6760558B2/ja active Active
- 2017-07-20 US US16/324,712 patent/US10727099B2/en active Active
- 2017-07-20 DE DE112017004145.7T patent/DE112017004145T5/de not_active Withdrawn
- 2017-07-20 SG SG11201811785RA patent/SG11201811785RA/en unknown
- 2017-07-20 KR KR1020197005303A patent/KR102344236B1/ko active IP Right Grant
- 2017-07-20 WO PCT/JP2017/026201 patent/WO2018034101A1/ja active Application Filing
- 2017-08-15 TW TW106127571A patent/TWI743167B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008034879A (ja) * | 2007-10-15 | 2008-02-14 | Miraial Kk | 薄板支持容器 |
JP2011129660A (ja) * | 2009-12-17 | 2011-06-30 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2011181867A (ja) * | 2010-03-04 | 2011-09-15 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2013546176A (ja) * | 2010-10-19 | 2013-12-26 | インテグリス・インコーポレーテッド | ロボットフランジを有する前面開口ウェーハ容器 |
WO2014192109A1 (ja) * | 2013-05-29 | 2014-12-04 | ミライアル株式会社 | 基板収納容器 |
Also Published As
Publication number | Publication date |
---|---|
US20190189489A1 (en) | 2019-06-20 |
SG11201811785RA (en) | 2019-01-30 |
TW201812960A (zh) | 2018-04-01 |
KR102344236B1 (ko) | 2021-12-27 |
CN109314072A (zh) | 2019-02-05 |
US10727099B2 (en) | 2020-07-28 |
CN109314072B (zh) | 2023-02-10 |
WO2018034101A1 (ja) | 2018-02-22 |
KR20190039533A (ko) | 2019-04-12 |
JP6760558B2 (ja) | 2020-09-23 |
TWI743167B (zh) | 2021-10-21 |
DE112017004145T5 (de) | 2019-05-09 |
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