WO2018034101A1 - 基板収納容器 - Google Patents

基板収納容器 Download PDF

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Publication number
WO2018034101A1
WO2018034101A1 PCT/JP2017/026201 JP2017026201W WO2018034101A1 WO 2018034101 A1 WO2018034101 A1 WO 2018034101A1 JP 2017026201 W JP2017026201 W JP 2017026201W WO 2018034101 A1 WO2018034101 A1 WO 2018034101A1
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WO
WIPO (PCT)
Prior art keywords
container body
engaged
attachment
component
container
Prior art date
Application number
PCT/JP2017/026201
Other languages
English (en)
French (fr)
Inventor
三村　博
戸田　順也
Original Assignee
信越ポリマー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越ポリマー株式会社 filed Critical 信越ポリマー株式会社
Priority to US16/324,712 priority Critical patent/US10727099B2/en
Priority to DE112017004145.7T priority patent/DE112017004145T5/de
Priority to SG11201811785RA priority patent/SG11201811785RA/en
Priority to KR1020197005303A priority patent/KR102344236B1/ko
Priority to CN201780034631.7A priority patent/CN109314072B/zh
Priority to JP2018534308A priority patent/JP6760558B2/ja
Publication of WO2018034101A1 publication Critical patent/WO2018034101A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the present invention relates to a substrate storage container that stores a plurality of substrates.
  • a substrate such as a semiconductor wafer is stored in a warehouse, transported between semiconductor processing apparatuses, and transported between factories while being stored in an internal space of a substrate storage container.
  • a transport component is attached to the ceiling surface of the container body so that it can be handled by an automatic transport device such as a ceiling traveling device or a robot (see Patent Documents 1 and 2).
  • Patent Document 1 an attachment mechanism in which a bifurcated portion is formed by combining a guide piece and an interference engaging portion is provided on the ceiling surface of a container main body, and a conveyance component for conveyance is provided in the bifurcated portion of the attachment mechanism.
  • a substrate storage container is described in which the elastic engagement piece is detachably attached.
  • an object of the present invention is to provide a substrate storage container having an increased mounting force for conveying parts.
  • One aspect of the present invention includes a container body having an opening that is closed by a lid and capable of accommodating a plurality of substrates, and a detachable attachment to an attachment mechanism provided in the container body.
  • the attachment mechanism includes a first attachment portion on the opening portion side of the container body and a second attachment portion on the side away from the opening portion.
  • the attachment mechanism may include a stopper that is provided on the peripheral wall of the container body and that engages and locks the transport component.
  • the conveying component has an engaged portion that engages with the attachment mechanism, and the engaged portion is displaced in a predetermined direction and is You may include the 1st to-be-engaged part engaged with a 1st attaching part, and the 2nd to-be-engaged part displaced to the direction different from the said predetermined direction, and engaging with the said 2nd attaching part.
  • FIG. 3 is a partial cross-sectional view taken along line AA in FIG. 2. It is a partial section perspective view showing the 1st attaching part. It is a partial section perspective view showing the 2nd attaching part.
  • the same members are denoted by the same reference numerals throughout.
  • the front F and the rear B are indicated by white arrows as necessary.
  • the front F and the rear B are shown as the X-axis direction, the up-down direction as the Y-axis direction, and the left-right direction orthogonal to the X-axis direction and the Y-axis direction as the Z-axis direction.
  • FIG. 1 is an exploded perspective view of a substrate storage container according to an embodiment of the present invention.
  • FIG. 2 is a plan view showing the container body.
  • the substrate storage container 1 shown in FIG. 1 includes a lid 10 and a container body 20 that stores a plurality of substrates W.
  • Examples of the substrate W stored in the substrate storage container 1 include a semiconductor wafer having a diameter of 300 mm or 450 mm, a mask glass, and the like.
  • the container body 20 is of a so-called front open box type formed of a front opening frame that forms the opening 21, a rear wall, left and right side walls 23, a ceiling surface 22, and a bottom surface.
  • the opening 21 of the container body 20 is closed by the lid body 10.
  • a transport component 30 described later is detachably attached to the ceiling surface 22 of the container body 20 (see also FIG. 2).
  • the lid body 10 and the container body 20 are configured such that a plurality of parts are injection-molded with a molding material containing a predetermined resin, and a plurality of parts are assembled.
  • the predetermined resin in the molding material include polycarbonate, polyether ether ketone, polyether imide, polybutylene terephthalate, polyacetal, liquid crystal polymer, and cyclic olefin resin, which are excellent in mechanical properties and heat resistance.
  • carbon, a metal fiber, a conductive polymer, an antistatic agent, a flame retardant, etc. may be selectively added to these resins as needed.
  • FIG. 3 is a plan view showing a state in which the conveyance component is separated from the container body
  • FIG. 4 is a perspective view from the back side showing the conveyance component
  • FIG. 5 is a partial cross-sectional view taken along line AA in FIG.
  • the conveyance component 30 is also referred to as a robotic flange, and is held and conveyed by, for example, a ceiling conveyance device while being mounted on the container body 20.
  • the transport component 30 is molded from the same molding material as the lid 10 and the container body 20 from the viewpoint of reliably supporting the substrate storage container 1 storing the substrate W.
  • the conveying component 30 includes a substantially hollow frame-shaped component main body 31 in a plan view.
  • a pair of left and right sandwiched plates 32 extend in the horizontal direction on both sides of the lower end of the component body 31 (on the ceiling surface 22 side).
  • a flange 33 that is gripped by the ceiling conveying device is integrally formed at the upper end of the component main body 31 that is opened.
  • the sandwiched plate 32 is formed in a flat plate shape that overlaps the ceiling surface 22 of the container body 20, and both side surfaces 320 are inclined so as to approach the front F side.
  • the sandwiched plate 32 is provided with a through hole 321 having a long hole shape in plan view. Even if the transporting part 30 is cleaned in a state where it is mounted on the container body 20, the cleaning water and the drying air can be circulated by the circulation port 321, so that the cleaning water does not remain and is dried in a short time. Can do.
  • the sandwiched plate 32 has a plurality of concave and convex portions 322 formed on the front portion and both side portions of the back surface.
  • the plurality of concavo-convex portions 322 may be formed on the back surface of the vertical wall 34 of the component main body 31 as necessary, in addition to the back surface of the sandwiched plate 32.
  • the plurality of uneven portions 322 form a plurality of gaps with the ceiling surface 22 of the container body 20. Even if the transport component 30 is cleaned in the state where it is mounted on the container body 20, the cleaning water and dry air can be circulated by this gap, so that no cleaning water remains. It can be dried in a short time.
  • the flange 33 is formed in a flat rectangular shape with four corners chamfered, and a recess 330 is formed in the center, and is sensed or positioned by the ceiling transport device.
  • the recess 330 is formed in a substantially truncated cone shape and is integrated with the vicinity of the bent portions of the plurality of reinforcing ribs 35.
  • a flow port 332 In the flange 33, a flow port 332, four square holes 333, and a flow port 334 communicating with the component main body 31 are formed. Specifically, the circulation port 332 is formed on the front F center side, and the distribution port 334 is formed on the rear B center side. The four square holes 333 are formed so as to surround the recess 330.
  • the first engaged portion 36 is exposed from a pair of left and right square holes 333 located on the front surface F side of the container body 20 so as to be visible and operable (FIGS. 3 and 5). reference). Further, the second engaged portion 37 is exposed from the circulation port 334 so as to be visible and operable (see FIG. 3).
  • the component main body 31 includes vertical walls 34 on the front, rear, left and right sides, and a plurality of reinforcing ribs 35 that are integrated with the flange 33 and ensure strength are provided on the front, rear, left and right.
  • the pair of left and right reinforcing ribs 35 positioned on the front F side of the container body 20 are integrally formed with first engaged portions 36 that extend toward the front F side and are elastically deformable.
  • the vertical wall 34 is provided with a plurality of flow ports 340 so that cleaning water, dry air, and the like can flow inside and outside the component main body 31.
  • the reinforcing ribs 35 are formed in an L shape in a plan view integrally formed between the inner surfaces of the vertical walls 34 so as to straddle the corners of the vertical walls 34 of the component main body 31. A substantially rectangular space is defined in plan view between them and communicates with the square hole 333.
  • the reinforcing rib 35 is formed lower than the vertical wall 34 of the component main body 31, and a gap (not shown) through which cleaning water and dry air are circulated is formed. Wash water and dry air circulate in and out of the component main body 31 through the clearance and the flow port 340 of the vertical wall 34.
  • the first engaged portion 36 is formed in a substantially linear shape having flexibility, and is opposed to the side reinforcing rib 35 with a gap, and a cylindrical lock pin 360 is integrally formed at a lower end of the tip. Is formed. At the end of the first engaged portion 36, an operation gripping piece 361 bulging upward is integrally formed in a substantially semicircular shape (see FIG. 6).
  • the first engaged portion 36 bends and displaces in the left-right direction of the conveying component 30, that is, the Z-axis direction of the container body 20, the first engaged portion 36 is bent at the inner side 350 of the square hole 333. It is adjusted to the extent that it does not hit.
  • the second engaged portion 37 is formed so as to extend from the recessed portion 330 toward the rear B side into the circulation port 334.
  • the second engaged portion 37 is substantially plate-shaped and is formed toward the rear B side and toward the ceiling surface 22, and the tip of the second engaged portion 37 is bent toward the rear B side to be ceiling surface 22 (see FIG. 7).
  • the second engaged portion 37 may be formed such that the tip of the second engaged portion 37 is in contact with the ceiling surface 22 or may be formed with a slight gap.
  • the front F side of the bent portion is rounded.
  • FIG. 6 is a partial cross-sectional perspective view showing the first mounting portion
  • FIG. 7 is a partial cross-sectional perspective view showing the second mounting portion.
  • the attachment mechanism 40 for attaching the conveyance component 30 is formed integrally with the ceiling surface 22 of the container body 20. Therefore, the attachment mechanism 40 is formed of the same molding material as that of the container body 20.
  • the mounting mechanism 40 includes a first mounting portion 40A and a second mounting portion 40B (see FIGS. 6 and 7).
  • the first attachment portion 40A is provided on the opening 21 side that is the front F side of the container body 20, and the second attachment portion 40B is provided on the rear B side that is the side away from the opening 21.
  • the attachment mechanism 40 includes a pair of left and right support rails 24 facing each other on both sides of the surface of the ceiling surface 22 of the container body 20 (see FIG. 3). Specifically, the pair of support rails 24 are arranged with the central portion of the ceiling surface 22 of the container body 20 interposed therebetween. The conveyance component 30 described above is detachably supported between the pair of support rails 24.
  • the pair of support rails 24 are inclined so that the width between the support rails 24 and the support rails 24 gradually decreases from the rear B side of the container body 20 toward the front F side. Further, the support rail 24 is bent and formed in a substantially L-shaped cross section rising from the ceiling surface 22 so as to form a groove between the support rail 24 (see FIG. 5) and linear in the front-rear direction of the container body 20. It extends to.
  • a stopper 25 having a substantially L-shaped cross section similar to that of the support rail 24 is formed on the ceiling surface 22 of the container body 20 on the front side F between the pair of support rails 24 (see FIG. 3).
  • the stopper 25 regulates and locks the movement of the conveying component 30 toward the front F side.
  • a pair of left and right first mounting portions 40A are provided on the ceiling surface 22 of the container body 20 located between the stoppers 25.
  • the first attachment portion 40 ⁇ / b> A includes a guide piece 26 that extends to the front F side of the container body 20, and an interference engagement portion 27 is formed integrally with the front portion of the outer surface of the guide piece 26.
  • the guide piece 26 and the interference engagement portion 27 are combined in a substantially Y-shaped plane with a slightly deformed front portion at the bifurcated portion 28, and the guide piece 26 is inclined inward in the Z-axis direction.
  • the interference engaging portion 27 extends from the guide piece 26 toward the front F side of the container body 20, and the tip thereof is a bifurcated portion 28.
  • the bifurcated portion 28 is not particularly limited, the bifurcated portion 28 is formed so as to be inclined or recessed in the insertion direction from the viewpoint of preventing the conveyance component 30 from being easily pulled out after being locked. It is preferable.
  • the second mounting portion 40B is provided as a protrusion extending in the left-right direction on the rear B side between the pair of first mounting portions 40A.
  • the shape of the second attachment portion 40B is a mountain shape having an inclined surface on the rear B side, the cross-sectional shape is a substantially right triangle, and the top portion is rounded (see FIG. 7).
  • a method for mounting the conveying component on the mounting mechanism will be described.
  • the conveyance component 30 In order to mount the conveyance component 30 on the attachment mechanism 40 of the container body 20, the conveyance component 30 is disposed on the rear B side of the ceiling surface 22 of the container body 20, and the conveyance component is provided between the plurality of pairs of support rails 24 of the attachment mechanism 40.
  • Each of the 30 clamped plates 32 is clamped and slid to the front F side of the container body 20, and the front portion of the clamped plate 32 of the transport component 30 is fitted and locked to each stopper 25, and the transport component 30 is moved upward. Is prevented (see FIG. 3).
  • the conveyance component 30 can be appropriately slid to a predetermined position. Further, since the side surface 320 of the sandwiched plate 32 of the conveying component 30 is also inclined corresponding to the inclination of the support rail 24, the orientation when the conveying component 30 is set is not mistaken.
  • the first engaged portion 36 of the conveyance component 30 is moved to the pair of inclined guide pieces 26 of the first attachment portion 40 ⁇ / b> A of the attachment mechanism 40.
  • the lock pins 360 are guided while being in contact with each other, and the pair of first engaged portions 36 are deflected and displaced in the left-right direction, specifically, the inside of the container body 20 in the Z-axis direction.
  • the front part of 26 is overcome and engaged with a bifurcated part 28 between the guide piece 26 and the interference engaging part 27.
  • the attachment mechanism 40 of the attachment mechanism 40 is almost simultaneously engaged.
  • the second engaged portion 37 is engaged with the 2 attachment portion 40B. That is, when the conveying component 30 slides to the front F side, the second engaged portion 37 is deflected and displaced in the Y-axis direction, and gets over and engages the inclined portion of the second attachment portion 40B.
  • first mounting portion 40A First, with respect to the first mounting portion 40A, a finger is inserted into the square hole 333 of the conveying component 30 from above, and the gripping piece 361 of each first engaged portion 36 is moved in the direction of the inner side 350 of the square hole 333. , The first engaged portions 36 are deflected and displaced inward in the left-right direction of the container body 20, and the engagement between the interference engaging portion 27 and the lock pin 360 is released.
  • the second engaged portion 37 is lifted and displaced in the Y-axis direction to release the engagement with the second mounting portion 40B. Therefore, two operations are performed on the first attachment portion 40A and the second attachment portion 40B, and the conveyance component 30 is slid to the rear B side with respect to the attachment mechanism 40, whereby the conveyance component 30 is removed from the attachment mechanism 40. Can be removed.
  • the substrate storage container 1 has the opening 21 that is closed by the lid body 10, the container main body 20 that can store a plurality of substrates W, and the container main body 20.
  • the attachment part 40 is detachably attached to the attachment mechanism 40, and the attachment mechanism 40 is separated from the first attachment part 40A on the opening part 21 (front F) side of the container body 20 and the opening part 21 ( And a second mounting portion 40B on the rear B) side.
  • the conveyance component 30 since the conveyance component 30 is engaged with the container main body 20 at the two locations of the first mounting portion 40A and the second mounting portion 40B, the mounting force on the container main body 20 can be increased. Whether or not the transfer component 30 attached to the container body 20 is pushed rearward B to remove the transfer component 30 from the container body 20 is determined based on whether the substrate storage container 1 of the present embodiment and the second mounting portion 40B are not provided. In comparison with the conventional substrate storage container shown in FIG. 1, the substrate storage container 1 of the present embodiment required a force of 550 N or more as compared with the conventional substrate storage container.
  • the conveying component 30 slides from the rear B side to the front F side of the container body 20 and detachably engages with the support rail 24 and is fitted and locked to the stopper 25, the unnecessary sliding is restricted. Is done.
  • the top of the second mounting portion 40B is rounded, and the front F side of the bent portion at the tip of the second engaged portion 37 is also rounded.
  • the portion 37 bends in the Y-axis direction and gets over the inclined portion of the second attachment portion 40B and engages, the portion 37 can be engaged with a smooth movement without being caught.
  • each of the first attachment portion 40A and the second attachment portion 40B is operated to remove the conveyance component 30.
  • the mounting force of the conveyance component 30 to the container main body 20 is high, and the conveyance component 30 is not easily detached by one action.
  • first mounting portions 40A and one second mounting portion 40B are provided.
  • the present invention is not limited to these.
  • the 1st attachment part 40A may be provided in 1 place or 3 or more places
  • the 2nd attachment part 40B may be provided in 2 or more places.
  • the first engaged portion 36 and the second engaged portion 37 are formed in accordance with the first attachment portion 40A and the second attachment portion 40B, respectively.
  • the first engaged portion 36 that engages with the first attachment portion 40A is displaced in the left-right direction that is the X-axis direction
  • the second engaged portion 37 that engages with the second attachment portion 40B is displaced upward in the Y-axis direction, but if the direction of displacement of the first engaged portion 36 and the direction of displacement of the second engaged portion 37 are different, the direction of displacement is limited to these directions. Absent.
  • the conveyance component 30 is engaged with the first attachment portion 40A and the second attachment portion 40B of the attachment mechanism 40 at substantially the same time, but the conveyance component 30 is attached to the container body 20.
  • the positions of forming the first mounting portion 40A and the first engaged portion 36, and the second mounting portion 40B and the second engaged portion 37 are shifted.
  • the engaging timing may be shifted.
  • the attachment mechanism 40 is provided on the ceiling surface 22 of the container body 20 and the robotic flange is mounted as the conveyance component 30, but the attachment mechanism 40 is provided on the outer surface of the left and right side walls 23 that are the peripheral walls of the container body 20, A manual handle may be mounted as the conveying component 30.
  • a dedicated jig may be prepared and removed using the dedicated jig.
  • Substrate storage container 10 Lid 20 Container body 21 Opening part, 22 Ceiling surface, 23 Side wall, 24 Support rail, 25 Stopper, 26 Guide piece, 27 Interference engaging part, 28 Fork part 30 Conveying parts 31 Parts main body, 32 Cover Clamping plate, 33 flange, 34 vertical wall, 35 reinforcing rib, 36 first engaged portion, 37 second engaged portion 320 side surface, 321, 332, 334, 340 flow outlet, 322 uneven portion, 330 recessed portion, 333 Square hole, 350 inner side, 360 lock pin, 361 gripping piece 40 mounting mechanism, 40A first mounting portion, 40B second mounting portion F front surface B rear W substrate

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Abstract

搬送部品の装着力を高めた基板収納容器を提供すること。　蓋体により閉鎖される開口部を有し、複数枚の基板を収納可能な容器本体２０と、容器本体２０に着脱自在に取付けられる搬送部品３０と、を備え、取付機構４０が、容器本体２０の開口部側の第１取付部４０Ａと、開口部から離れる側の第２取付部４０Ｂとを含むこと。また、搬送部品３０は、取付機構４０に係合する被係合部を有し、被係合部は、所定の方向に変位して係合する第１被係合部３６と、所定の方向とは異なる方向に変位して係合する第２被係合部３７とを含むこと。

Description

基板収納容器
　本発明は、複数枚の基板を収納する基板収納容器に関する。
　半導体ウェーハなどの基板は、基板収納容器の内部空間に収納された状態で、倉庫での保管、半導体加工装置間での搬送、工場間での輸送などが行われている。この基板収納容器は、天井走行装置やロボットなどの自動搬送装置で取扱ができるように、容器本体の天井面に搬送部品が取付けられている（特許文献１及び２参照）。
　例えば、特許文献１には、容器本体の天井面に、ガイド片と干渉係合部とを組み合わせて二股部が形成された取付機構を設け、取付機構の二股部に搬送用の搬送部品に設けられた弾性係合片を着脱自在に取付けるようにした基板収納容器が記載されている。
特開２０１１－１８１８６７号公報 特開２００８－０３４８７９号公報
　しかしながら、特許文献１のように、左右方向又は前後方向の１方向だけの動きにより係止する構造では、基板収納容器の搬送中の急停止又は移動による衝撃により、搬送部品が容器本体から外れることがあった。また、作業者が取扱う場合でも、搬送部品が容器本体から簡単に外れないようにすることが望まれていた。
　そこで、本発明は以上の課題を鑑みてなされたものであり、搬送部品の装着力を高めた基板収納容器を提供することを目的とする。
（１）本発明に係る１つの態様は、蓋体により閉鎖される開口部を有し、複数枚の基板を収納可能な容器本体と、前記容器本体に設けられた取付機構に着脱自在に取付けられる搬送部品と、を備え、前記取付機構が、前記容器本体の前記開口部側の第１取付部と、前記開口部から離れる側の第２取付部とを含むものである。
（２）上記（１）の態様において、前記取付機構は、前記容器本体の周壁に設けられ、前記搬送部品を嵌合係止するストッパを含んでもよい。
（３）上記（１）又は（２）の態様において、前記搬送部品は、前記取付機構に係合する被係合部を有し、前記被係合部は、所定の方向に変位して前記第１取付部に係合する第１被係合部と、前記所定の方向とは異なる方向に変位して前記第２取付部に係合する第２被係合部とを含んでもよい。
　本発明によれば、搬送部品の装着力を高めた基板収納容器を提供することができる。
本発明の実施形態に係る基板収納容器を示す分解斜視図である。 容器本体を示す平面図である。 容器本体から搬送部品を分離した状態を示す平面図である。 搬送部品を示す裏側からの斜視図である。 図２のＡ－Ａ線で切断した部分断面図である。 第１取付部を示す部分断面斜視図である。 第２取付部を示す部分断面斜視図である。
　以下、本発明の実施形態について、図面を参照して詳細に説明する。なお、本明細書の実施形態においては、全体を通じて、同一の部材には同一の符号を付している。図中には必要に応じて、正面Ｆと後方Ｂとを白抜き矢印で示した。また、図中に正面Ｆ及び後方ＢをＸ軸方向、上下方向をＹ軸方向、Ｘ軸方向及びＹ軸方向と直交する左右方向をＺ軸方向として示した。
　基板収納容器について説明する。図１は、本発明の実施形態に係る基板収納容器の分解斜視図である。図２は、容器本体を示す平面図である。
　図１に示される基板収納容器１は、蓋体１０と、複数枚の基板Ｗを収納する容器本体２０とを備えている。基板収納容器１に収納される基板Ｗとしては、直径が３００ｍｍや４５０ｍｍの半導体ウェーハ、マスクガラスなどが挙げられる。
　容器本体２０は、開口部２１を形成する正面開口枠と、背面壁と、左右の側壁２３と、天井面２２と、底面とで形成される、いわゆるフロントオープンボックスタイプのものである。この容器本体２０の開口部２１は、蓋体１０により閉鎖される。容器本体２０の天井面２２には、後述する搬送部品３０が着脱自在に取付けられている（図２も参照）。
　これらの蓋体１０及び容器本体２０は、所定の樹脂を含有する成形材料により複数の部品がそれぞれ射出成形され、複数の部品が組立てられて構成されている。成形材料中の所定の樹脂としては、例えば機械特性や耐熱性などに優れるポリカーボネート、ポリエーテルエーテルケトン、ポリエーテルイミド、ポリブチレンテレフタレート、ポリアセタール、液晶ポリマー、あるいは環状オレフィン樹脂などが挙げられる。また、必要に応じてこれらの樹脂に、カーボン、金属繊維、導電性ポリマー、帯電防止剤、又は難燃剤などが選択的に添加されることもある。
　搬送部品について説明する。図３は、容器本体から搬送部品を分離した状態を示す平面図であり、図４は、搬送部品を示す裏側からの斜視図である。図５は、図２のＡ－Ａ線で切断した部分断面図である。
　図４に示される搬送部品３０は、容器本体２０の天井面２２の略中央部に着脱自在に装着されるものである。搬送部品３０は、ロボティックフランジとも呼ばれ、容器本体２０に装着された状態で、例えば、天井搬送装置に把持され、搬送される。この搬送部品３０は、基板Ｗを収納した基板収納容器１を確実に支持する観点から、蓋体１０及び容器本体２０と同様の成形材料により成形される。
　搬送部品３０は、平面視で略中空枠形の部品本体３１を備えている。この部品本体３１の（天井面２２側）下端部両側には、左右一対の被挟持板３２が水平方向に延出している。一方、部品本体３１の開口した上端部には、天井搬送装置に把持されるフランジ３３が一体に形成されている。
　被挟持板３２は、容器本体２０の天井面２２に重なる平坦な板状に形成されて、その両側面３２０が、正面Ｆ側で近づくように傾斜している。被挟持板３２には、平面視で長穴状の流通口３２１が穿設されている。この流通口３２１により、搬送部品３０が容器本体２０に装着された状態で洗浄されたとしても、洗浄水や乾燥エアを流通させることができるから、洗浄水が残らず、短時間で乾燥させることができる。
　また、被挟持板３２には、裏面の前部及び両側部には複数の凹凸部３２２が形成されている。複数の凹凸部３２２は、被挟持板３２の裏面の他、必要に応じて部品本体３１の縦壁３４の裏面などにも形成されてもよい。この複数の凹凸部３２２は、容器本体２０の天井面２２との間に複数の隙間を形成する。この隙間により、流通口３２１と同じように、搬送部品３０が容器本体２０に装着された状態で洗浄されたとしても、洗浄水や乾燥エアを流通させることができるから、洗浄水が残らず、短時間で乾燥させることができる。
　フランジ３３は、四隅部が面取りされた平面矩形に形成され、中央部に凹部３３０が形成されており、天井搬送装置でセンシングされたり、位置決めされたりする。凹部３３０は、略円錐台形状に形成されて複数の補強リブ３５の屈曲部付近と一体化している。
　フランジ３３には、部品本体３１内に連通する、流通口３３２と、４つの角孔３３３と、流通口３３４とが、穿設されている。具体的には、流通口３３２が正面Ｆ中央側に、流通口３３４が後方Ｂ中央側に、それぞれ穿設されている。また、４つの角孔３３３は、凹部３３０を囲むように穿設されている。
　４つの角孔３３３のうち、容器本体２０の正面Ｆ側に位置する左右一対の角孔３３３からは、第１被係合部３６が視認可能かつ操作可能に露出している（図３及び５参照）。また、流通口３３４からは、第２被係合部３７が視認可能かつ操作可能に露出している（図３参照）。
　また、部品本体３１は、前後左右に縦壁３４を備えており、内部にはフランジ３３と一体化して強度を確保する複数の補強リブ３５が前後左右に設けられている。複数の補強リブ３５のうち、容器本体２０の正面Ｆ側に位置する左右一対の補強リブ３５には、正面Ｆ側に延びて弾性変形可能な第１被係合部３６がそれぞれ一体に形成されている。なお、縦壁３４には、流通口３４０が複数穿設されており、部品本体３１の内外に洗浄水や乾燥エアなどが流通可能になっている。
　補強リブ３５は、部品本体３１の縦壁３４の隅部を跨ぐように縦壁３４の内面間に一体的に架設される平面視でＬ字状に形成され、部品本体３１の縦壁３４との間に平面視で略矩形の空間を区画しており、角孔３３３に連通している。補強リブ３５は、部品本体３１の縦壁３４よりも低く形成されており、洗浄水や乾燥エアを流通させる図示しない隙間が形成されている。この隙間と縦壁３４の流通口３４０を介して洗浄水や乾燥エアが部品本体３１の内外を流通する。
　第１被係合部３６は、可撓性を有する直線的な略板状に形成されて側方の補強リブ３５に隙間をおいて対向し、先端下部に円柱形のロックピン３６０が一体に形成されている。第１被係合部３６の端部には、上方に膨出する操作用の把持片３６１が略半円形に一体に形成されている（図６参照）。
　第１被係合部３６は、搬送部品３０の左右方向、すなわち容器本体２０のＺ軸方向に撓んで変位するので、第１被係合部３６の撓みは、角孔３３３の内側辺３５０に当たらない程度に調整されている。
　第２被係合部３７は、凹部３３０から後方Ｂ側に向かって、流通口３３４の中に延びて形成されている。第２被係合部３７は、略板状であり、後方Ｂ側に向かうとともに天井面２２に向かって形成され、第２被係合部３７の先端は、後方Ｂ側に屈曲して天井面２２に平行になるように形成されている（図７参照）。
　ここで、第２被係合部３７の先端が、天井面２２と接触するように第２被係合部３７を形成してもよいし、わずかな隙間を設けて形成してもよい。屈曲部の正面Ｆ側は丸みを帯びて形成されている。
　つぎに、取付機構について説明する。図６は、第１取付部を示す部分断面斜視図であり、図７は、第２取付部を示す部分断面斜視図である。
　搬送部品３０を取付ける取付機構４０は、容器本体２０の天井面２２に一体に形成されている。そのため、取付機構４０は、容器本体２０と同様の成形材料により成形されている。
　取付機構４０は、第１取付部４０Ａと第２取付部４０Ｂとを含んでいる（図６及び７参照）。第１取付部４０Ａは、容器本体２０の正面Ｆ側である開口部２１側に設けられ、第２取付部４０Ｂは、開口部２１から離れる側である後方Ｂ側に設けられている。
　この取付機構４０は、容器本体２０の天井面２２の表面の両側部に、相対向する左右一対の支持レール２４を備えている（図３参照）。具体的には、一対の支持レール２４は、容器本体２０の天井面２２の中央部を挟んで配置されている。上述した搬送部品３０は、一対の支持レール２４間に着脱自在に支持される。
　一対の支持レール２４は、容器本体２０の後方Ｂ側から正面Ｆ側に向かうに従い、支持レール２４と支持レール２４との間の幅が徐々に狭まるよう傾斜して設けられている。また、支持レール２４は、天井面２２との間に溝を形成するように、天井面２２から立ち上がる断面略Ｌ字状に屈曲形成され（図５参照）、容器本体２０の前後方向に直線的に延びている。
　一対の支持レール２４間の正面Ｆ側には、容器本体２０の天井面２２に支持レール２４と同様の断面略Ｌ字形のストッパ２５が形成されている（図３参照）。ストッパ２５は、搬送部品３０の正面Ｆ側への移動を規制し嵌合係止する。
　第１取付部４０Ａは、ストッパ２５間に位置する容器本体２０の天井面２２に左右一対設けられている。第１取付部４０Ａは、容器本体２０の正面Ｆ側に延びるガイド片２６を備え、ガイド片２６の外側面前部には干渉係合部２７が一体に形成されている。
　ガイド片２６と干渉係合部２７とは、前部が二股部２８のやや変形した平面略Ｙ字状に組み合わされ、ガイド片２６がＺ軸方向のそれぞれ内側に向かって傾斜している。干渉係合部２７は、ガイド片２６よりも容器本体２０の正面Ｆ側に向け延出されており、その先端が二股部２８となっている。二股部２８は、特に限定されるものではないが、搬送部品３０が係止した後に簡単に挿入方向に抜けてしまうのを防止する観点から、挿入方向に傾斜したり、窪むように形成されたりすることが好ましい。
　第２取付部４０Ｂは、一対の第１取付部４０Ａの間の後方Ｂ側に左右方向に延びる突起として１か所設けられている。第２取付部４０Ｂの形状は、後方Ｂ側に斜面を有する山形状で、断面形状が略直角三角形であり、その頂部は、丸みを帯びて形成されている（図７参照）。
　搬送部品の取付機構への装着方法について説明する。
　搬送部品３０を容器本体２０の取付機構４０に装着するには、容器本体２０の天井面２２の後方Ｂ側に搬送部品３０を配置し、取付機構４０の複数対の支持レール２４間に搬送部品３０の被挟持板３２をそれぞれ挟持させ、容器本体２０の正面Ｆ側にスライドさせ、各ストッパ２５に搬送部品３０の被挟持板３２の前部を嵌合係止し、搬送部品３０の上方への抜けを防止する（図３参照）。
　このとき、取付機構４０の複数対の支持レール２４が容器本体２０の前後方向に傾斜しているので、容器本体２０に対する搬送部品３０の位置ズレやガタツキを簡易な構成で防止することができる。したがって、所定の位置に搬送部品３０を適切にスライドさせることができる。また、搬送部品３０の被挟持板３２の側面３２０も支持レール２４の傾斜に対応して傾いているので、搬送部品３０をセットする際の向きを間違えることがない。
　また、図６に示すように、搬送部品３０が正面Ｆ側にスライドすると、取付機構４０の第１取付部４０Ａの傾斜した一対のガイド片２６に、搬送部品３０の第１被係合部３６のロックピン３６０が接しながら案内され、一対の第１被係合部３６が左右方向、具体的には容器本体２０のＺ軸方向内側にそれぞれ撓んで変位した後、各ロックピン３６０がガイド片２６の前部を乗り越えてガイド片２６と干渉係合部２７との分岐した二股部２８に係合する。
　また、図７に示すように、ロックピン３６０がガイド片２６の前部を乗り越えてガイド片２６と干渉係合部２７との分岐した二股部２８に係合すると、略同時に取付機構４０の第２取付部４０Ｂに第２被係合部３７が係合する。すなわち、搬送部品３０が正面Ｆ側にスライドすると、第２被係合部３７がＹ軸方向に撓んで変位し、第２取付部４０Ｂの傾斜部を乗り越えて係合する。
　逆に、搬送部品３０を容器本体２０の取付機構４０から取外すには、第１取付部４０Ａと第２取付部４０Ｂに対し、２つの操作を行わなければならない。
　まず、第１取付部４０Ａに対しては、搬送部品３０の角孔３３３に上方から指を挿入して各第１被係合部３６の把持片３６１を角孔３３３の内側辺３５０方向に左右から押圧操作し、各第１被係合部３６を容器本体２０の左右方向内側に撓ませて変位させ、干渉係合部２７とロックピン３６０との係合を解除する。
　つぎに、第２取付部４０Ｂに対しては、第２被係合部３７をＹ軸方向に持ち上げて変位させ、第２取付部４０Ｂとの係合を解除する。したがって、第１取付部４０Ａと第２取付部４０Ｂに対し、２つの操作を行って、搬送部品３０を取付機構４０に対して後方Ｂ側にスライドさせることで、搬送部品３０を取付機構４０から取外すことができる。
　以上のとおり、本発明の実施形態に係る基板収納容器１は、蓋体１０により閉鎖される開口部２１を有し、複数枚の基板Ｗを収納可能な容器本体２０と、容器本体２０に設けられた取付機構４０に着脱自在に取付けられる搬送部品３０と、を備え、取付機構４０が、容器本体２０の開口部２１（正面Ｆ）側の第１取付部４０Ａと、開口部２１から離れる（後方Ｂ）側の第２取付部４０Ｂとを含むものである。
　これにより、搬送部品３０が、容器本体２０に第１取付部４０Ａと第２取付部４０Ｂとの２か所で係合しているので、容器本体２０に対する装着力を高めることができる。容器本体２０に装着された搬送部品３０を後方Ｂ側に押して、容器本体２０から搬送部品３０が外れるか否かを、本実施形態の基板収納容器１と、第２取付部４０Ｂが無い特許文献１にみられる従来の基板収納容器とを比較して実験したところ、本実施形態の基板収納容器１では、従来の基板収納容器に比べて更に５５０Ｎ以上の力が必要であった。
　また、搬送部品３０は、容器本体２０の後方Ｂ側から正面Ｆ側にスライドして支持レール２４に着脱自在に係合し、かつストッパ２５に嵌合係止するので、必要以上のスライドが規制される。
　さらに、第２取付部４０Ｂの頂部は、丸みを帯びて形成され、第２被係合部３７の先端の屈曲部の正面Ｆ側も丸みを帯びて形成されているので、第２被係合部３７がＹ軸方向に撓んで、第２取付部４０Ｂの傾斜部を乗り越えて係合するときに、引っ掛かりがなく、滑らかな動きで係合できる。
　実施形態では、第１取付部４０Ａと第２取付部４０Ｂに対し、それぞれ操作を行って、搬送部品３０を取外すようになっている。これにより、容器本体２０への搬送部品３０の装着力が高く、ワンアクションで搬送部品３０が容易に外れることがない。
　（変形例）
　上記実施形態では、第１取付部４０Ａは２か所、第２取付部４０Ｂは１か所設けられていたが、これらに限らない。例えば、第１取付部４０Ａが１か所又は３か所以上設けられていてもよいし、第２取付部４０Ｂが２か所以上設けられていてもよい。このとき、それぞれの第１取付部４０Ａ、第２取付部４０Ｂに応じて、第１被係合部３６、第２被係合部３７を形成する。
　上記実施形態では、第１取付部４０Ａに係合する第１被係合部３６は、Ｘ軸方向である左右方向に変位し、第２取付部４０Ｂに係合する第２被係合部３７は、Ｙ軸方向である上方向に変位するが、第１被係合部３６の変位の方向と第２被係合部３７の変位の方向が異なれば、変位の方向はこれらの方向に限らない。
　上記実施形態では、搬送部品３０は、取付機構４０の第１取付部４０Ａ及び第２取付部４０Ｂの２か所に対して、略同時に係合したが、搬送部品３０を容器本体２０に装着させる時の力（スライドさせる力）を分散するため、第１取付部４０Ａ及び第１被係合部３６と、第２取付部４０Ｂ及び第２被係合部３７とを、形成する位置をずらして、係合するタイミングをずらすように構成してもよい。
　上記実施形態では、容器本体２０の天井面２２に取付機構４０を設け、ロボティックフランジを搬送部品３０として装着したが、容器本体２０の周壁である左右側壁２３の外面に取付機構４０を設け、マニュアルハンドルを搬送部品３０として装着するようにしてもよい。
　また、容器本体２０の取付機構４０に装着した搬送部品３０を取外す場合、専用治具を作製し、専用治具を用いて取外してもよい。
　以上、本発明の好ましい実施形態について詳述したが、本発明は上述した実施形態に限定されるものではなく、請求の範囲に記載された本発明の要旨の範囲内において、種々の変形、変更が可能である。
１　　　基板収納容器
１０　　蓋体
２０　　容器本体
　２１　開口部、２２　天井面、２３　側壁、２４　支持レール、２５　ストッパ、２６　ガイド片、２７　干渉係合部、２８　二股部
３０　　搬送部品
　３１　部品本体、３２　被挟持板、３３　フランジ、３４　縦壁、３５　補強リブ、３６　第１被係合部、３７　第２被係合部
　３２０　側面、３２１，３３２，３３４，３４０　流通口、３２２　凹凸部、３３０　凹部、３３３　角孔、３５０　内側辺、３６０　ロックピン、３６１　把持片
４０　　取付機構、４０Ａ　第１取付部、４０Ｂ　第２取付部
Ｆ　　　正面
Ｂ　　　後方
Ｗ　　　基板

Claims (3)

  1. 　蓋体により閉鎖される開口部を有し、複数枚の基板を収納可能な容器本体と、
    　前記容器本体に設けられた取付機構に着脱自在に取付けられる搬送部品と、を備え、
    　前記取付機構が、前記容器本体の前記開口部側の第１取付部と、前記開口部から離れる側の第２取付部とを含む
    　ことを特徴とする基板収納容器。
  2. 　前記取付機構は、前記容器本体の周壁に設けられ、前記搬送部品を嵌合係止するストッパを含む
    　ことを特徴とする請求項１に記載の基板収納容器。
  3. 　前記搬送部品は、前記取付機構に係合する被係合部を有し、
    　前記被係合部は、所定の方向に変位して前記第１取付部に係合する第１被係合部と、前記所定の方向とは異なる方向に変位して前記第２取付部に係合する第２被係合部とを含む
    　ことを特徴とする請求項１又は２に記載の基板収納容器。
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