JPWO2018025933A1 - 電気回路装置の放熱構造 - Google Patents

電気回路装置の放熱構造 Download PDF

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Publication number
JPWO2018025933A1
JPWO2018025933A1 JP2018531962A JP2018531962A JPWO2018025933A1 JP WO2018025933 A1 JPWO2018025933 A1 JP WO2018025933A1 JP 2018531962 A JP2018531962 A JP 2018531962A JP 2018531962 A JP2018531962 A JP 2018531962A JP WO2018025933 A1 JPWO2018025933 A1 JP WO2018025933A1
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JP
Japan
Prior art keywords
heat dissipation
heat
circuit device
electric circuit
transfer member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018531962A
Other languages
English (en)
Japanese (ja)
Inventor
山縣　利貴
利貴 山縣
紗緒梨 井之上
紗緒梨 井之上
秀樹 広津留
秀樹 広津留
亮 吉松
亮 吉松
竜士 古賀
竜士 古賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2018025933A1 publication Critical patent/JPWO2018025933A1/ja
Priority to JP2022076224A priority Critical patent/JP7282950B2/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
JP2018531962A 2016-08-02 2017-08-02 電気回路装置の放熱構造 Pending JPWO2018025933A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022076224A JP7282950B2 (ja) 2016-08-02 2022-05-02 電気回路装置の放熱構造

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016152205 2016-08-02
JP2016152205 2016-08-02
PCT/JP2017/028133 WO2018025933A1 (ja) 2016-08-02 2017-08-02 電気回路装置の放熱構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022076224A Division JP7282950B2 (ja) 2016-08-02 2022-05-02 電気回路装置の放熱構造

Publications (1)

Publication Number Publication Date
JPWO2018025933A1 true JPWO2018025933A1 (ja) 2019-06-06

Family

ID=61074093

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018531962A Pending JPWO2018025933A1 (ja) 2016-08-02 2017-08-02 電気回路装置の放熱構造
JP2022076224A Active JP7282950B2 (ja) 2016-08-02 2022-05-02 電気回路装置の放熱構造

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022076224A Active JP7282950B2 (ja) 2016-08-02 2022-05-02 電気回路装置の放熱構造

Country Status (6)

Country Link
US (1) US10615096B2 (https=)
EP (1) EP3496139B1 (https=)
JP (2) JPWO2018025933A1 (https=)
KR (1) KR102382407B1 (https=)
CN (1) CN109791918B (https=)
WO (1) WO2018025933A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10487013B2 (en) * 2016-03-10 2019-11-26 Denka Company Limited Ceramic resin composite body
WO2021200724A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 窒化ホウ素焼結体、複合体及びこれらの製造方法、並びに放熱部材
WO2021201012A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 複合体の製造方法
JPWO2021200973A1 (https=) * 2020-03-31 2021-10-07
CN115298150B (zh) * 2020-03-31 2024-02-09 电化株式会社 氮化硼烧结体及其制造方法、以及复合体及其制造方法
WO2022080078A1 (ja) * 2020-10-16 2022-04-21 富士フイルム株式会社 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス
US11647612B2 (en) * 2020-11-23 2023-05-09 Toyota Motor Engineering & Manufacturing North America, Inc. High-density integrated power electronic assembly including double-sided cooling structure
JP2023112739A (ja) * 2022-02-02 2023-08-15 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2025078893A (ja) * 2022-03-30 2025-05-21 デンカ株式会社 放熱構造体
JP7594335B1 (ja) 2024-06-07 2024-12-04 アドバンスコンポジット株式会社 ヘキサゴナル窒化ホウ素粒子分散樹脂複合体及びヘキサゴナル窒化ホウ素粒子分散樹脂複合体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150420A (ja) * 2003-11-17 2005-06-09 Nippon Soken Inc 半導体装置の冷却構造
WO2014199650A1 (ja) * 2013-06-14 2014-12-18 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
JP2015096456A (ja) * 2013-11-15 2015-05-21 電気化学工業株式会社 放熱部材およびその用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100939A (ja) 2001-09-27 2003-04-04 Tokuyama Corp 放熱基板及びその製造方法
JP3644428B2 (ja) 2001-11-30 2005-04-27 株式会社デンソー パワーモジュールの実装構造
US20050252177A1 (en) * 2004-05-12 2005-11-17 Shiro Ishikawa Ceramic filter and smoke treatment device
JP2010192717A (ja) * 2009-02-19 2010-09-02 Sumitomo Electric Ind Ltd 冷却構造
JP5838065B2 (ja) 2011-09-29 2015-12-24 新光電気工業株式会社 熱伝導部材及び熱伝導部材を用いた接合構造
KR101928005B1 (ko) * 2011-12-01 2019-03-13 삼성전자주식회사 열전 냉각 패키지 및 이의 열관리 방법
EP3035778B1 (en) 2013-08-14 2018-10-03 Denka Company Limited Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
JP6262522B2 (ja) * 2013-12-26 2018-01-17 デンカ株式会社 樹脂含浸窒化ホウ素焼結体およびその用途
JP6189822B2 (ja) 2014-11-28 2017-08-30 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
JP6170486B2 (ja) 2014-12-05 2017-07-26 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150420A (ja) * 2003-11-17 2005-06-09 Nippon Soken Inc 半導体装置の冷却構造
WO2014199650A1 (ja) * 2013-06-14 2014-12-18 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
JP2015096456A (ja) * 2013-11-15 2015-05-21 電気化学工業株式会社 放熱部材およびその用途

Also Published As

Publication number Publication date
EP3496139A4 (en) 2019-07-31
US10615096B2 (en) 2020-04-07
KR102382407B1 (ko) 2022-04-01
KR20190046828A (ko) 2019-05-07
WO2018025933A1 (ja) 2018-02-08
EP3496139A1 (en) 2019-06-12
EP3496139B1 (en) 2021-06-16
JP7282950B2 (ja) 2023-05-29
CN109791918A (zh) 2019-05-21
US20190189534A1 (en) 2019-06-20
JP2022103256A (ja) 2022-07-07
CN109791918B (zh) 2023-09-29

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