CN109791918B - 电路装置的散热结构 - Google Patents

电路装置的散热结构 Download PDF

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Publication number
CN109791918B
CN109791918B CN201780048563.XA CN201780048563A CN109791918B CN 109791918 B CN109791918 B CN 109791918B CN 201780048563 A CN201780048563 A CN 201780048563A CN 109791918 B CN109791918 B CN 109791918B
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China
Prior art keywords
heat dissipation
heat
circuit device
ceramic
transfer member
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CN201780048563.XA
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English (en)
Chinese (zh)
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CN109791918A (zh
Inventor
山县利贵
井之上纱绪梨
广津留秀树
吉松亮
古贺龙士
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Denka Co Ltd
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Denka Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
CN201780048563.XA 2016-08-02 2017-08-02 电路装置的散热结构 Active CN109791918B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-152205 2016-08-02
JP2016152205 2016-08-02
PCT/JP2017/028133 WO2018025933A1 (ja) 2016-08-02 2017-08-02 電気回路装置の放熱構造

Publications (2)

Publication Number Publication Date
CN109791918A CN109791918A (zh) 2019-05-21
CN109791918B true CN109791918B (zh) 2023-09-29

Family

ID=61074093

Family Applications (1)

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CN201780048563.XA Active CN109791918B (zh) 2016-08-02 2017-08-02 电路装置的散热结构

Country Status (6)

Country Link
US (1) US10615096B2 (https=)
EP (1) EP3496139B1 (https=)
JP (2) JPWO2018025933A1 (https=)
KR (1) KR102382407B1 (https=)
CN (1) CN109791918B (https=)
WO (1) WO2018025933A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10487013B2 (en) * 2016-03-10 2019-11-26 Denka Company Limited Ceramic resin composite body
WO2021200724A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 窒化ホウ素焼結体、複合体及びこれらの製造方法、並びに放熱部材
WO2021201012A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 複合体の製造方法
JPWO2021200973A1 (https=) * 2020-03-31 2021-10-07
CN115298150B (zh) * 2020-03-31 2024-02-09 电化株式会社 氮化硼烧结体及其制造方法、以及复合体及其制造方法
WO2022080078A1 (ja) * 2020-10-16 2022-04-21 富士フイルム株式会社 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス
US11647612B2 (en) * 2020-11-23 2023-05-09 Toyota Motor Engineering & Manufacturing North America, Inc. High-density integrated power electronic assembly including double-sided cooling structure
JP2023112739A (ja) * 2022-02-02 2023-08-15 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2025078893A (ja) * 2022-03-30 2025-05-21 デンカ株式会社 放熱構造体
JP7594335B1 (ja) 2024-06-07 2024-12-04 アドバンスコンポジット株式会社 ヘキサゴナル窒化ホウ素粒子分散樹脂複合体及びヘキサゴナル窒化ホウ素粒子分散樹脂複合体の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192717A (ja) * 2009-02-19 2010-09-02 Sumitomo Electric Ind Ltd 冷却構造
WO2014199650A1 (ja) * 2013-06-14 2014-12-18 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
WO2015022956A1 (ja) * 2013-08-14 2015-02-19 電気化学工業株式会社 窒化ホウ素－樹脂複合体回路基板、窒化ホウ素－樹脂複合体放熱板一体型回路基板
JP2015096456A (ja) * 2013-11-15 2015-05-21 電気化学工業株式会社 放熱部材およびその用途
JP2015124122A (ja) * 2013-12-26 2015-07-06 電気化学工業株式会社 樹脂含浸窒化ホウ素焼結体およびその用途
JP2016103611A (ja) * 2014-11-28 2016-06-02 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
JP2016111171A (ja) * 2014-12-05 2016-06-20 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100939A (ja) 2001-09-27 2003-04-04 Tokuyama Corp 放熱基板及びその製造方法
JP3644428B2 (ja) 2001-11-30 2005-04-27 株式会社デンソー パワーモジュールの実装構造
JP2005150420A (ja) * 2003-11-17 2005-06-09 Nippon Soken Inc 半導体装置の冷却構造
US20050252177A1 (en) * 2004-05-12 2005-11-17 Shiro Ishikawa Ceramic filter and smoke treatment device
JP5838065B2 (ja) 2011-09-29 2015-12-24 新光電気工業株式会社 熱伝導部材及び熱伝導部材を用いた接合構造
KR101928005B1 (ko) * 2011-12-01 2019-03-13 삼성전자주식회사 열전 냉각 패키지 및 이의 열관리 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192717A (ja) * 2009-02-19 2010-09-02 Sumitomo Electric Ind Ltd 冷却構造
WO2014199650A1 (ja) * 2013-06-14 2014-12-18 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
WO2015022956A1 (ja) * 2013-08-14 2015-02-19 電気化学工業株式会社 窒化ホウ素－樹脂複合体回路基板、窒化ホウ素－樹脂複合体放熱板一体型回路基板
JP2015096456A (ja) * 2013-11-15 2015-05-21 電気化学工業株式会社 放熱部材およびその用途
JP2015124122A (ja) * 2013-12-26 2015-07-06 電気化学工業株式会社 樹脂含浸窒化ホウ素焼結体およびその用途
JP2016103611A (ja) * 2014-11-28 2016-06-02 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
JP2016111171A (ja) * 2014-12-05 2016-06-20 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール

Also Published As

Publication number Publication date
EP3496139A4 (en) 2019-07-31
US10615096B2 (en) 2020-04-07
KR102382407B1 (ko) 2022-04-01
KR20190046828A (ko) 2019-05-07
WO2018025933A1 (ja) 2018-02-08
EP3496139A1 (en) 2019-06-12
JPWO2018025933A1 (ja) 2019-06-06
EP3496139B1 (en) 2021-06-16
JP7282950B2 (ja) 2023-05-29
CN109791918A (zh) 2019-05-21
US20190189534A1 (en) 2019-06-20
JP2022103256A (ja) 2022-07-07

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