KR102382407B1 - 전기 회로 장치의 방열 구조 - Google Patents

전기 회로 장치의 방열 구조 Download PDF

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Publication number
KR102382407B1
KR102382407B1 KR1020197006260A KR20197006260A KR102382407B1 KR 102382407 B1 KR102382407 B1 KR 102382407B1 KR 1020197006260 A KR1020197006260 A KR 1020197006260A KR 20197006260 A KR20197006260 A KR 20197006260A KR 102382407 B1 KR102382407 B1 KR 102382407B1
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South Korea
Prior art keywords
heat dissipation
heat
circuit device
transfer member
ceramic
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KR1020197006260A
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Korean (ko)
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KR20190046828A (ko
Inventor
도시타카 야마가타
사오리 이노우에
히데키 히로츠루
료 요시마츠
류지 고가
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덴카 주식회사
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H01L23/373—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H01L23/367—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
KR1020197006260A 2016-08-02 2017-08-02 전기 회로 장치의 방열 구조 Active KR102382407B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-152205 2016-08-02
JP2016152205 2016-08-02
PCT/JP2017/028133 WO2018025933A1 (ja) 2016-08-02 2017-08-02 電気回路装置の放熱構造

Publications (2)

Publication Number Publication Date
KR20190046828A KR20190046828A (ko) 2019-05-07
KR102382407B1 true KR102382407B1 (ko) 2022-04-01

Family

ID=61074093

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Application Number Title Priority Date Filing Date
KR1020197006260A Active KR102382407B1 (ko) 2016-08-02 2017-08-02 전기 회로 장치의 방열 구조

Country Status (6)

Country Link
US (1) US10615096B2 (https=)
EP (1) EP3496139B1 (https=)
JP (2) JPWO2018025933A1 (https=)
KR (1) KR102382407B1 (https=)
CN (1) CN109791918B (https=)
WO (1) WO2018025933A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10487013B2 (en) * 2016-03-10 2019-11-26 Denka Company Limited Ceramic resin composite body
WO2021200724A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 窒化ホウ素焼結体、複合体及びこれらの製造方法、並びに放熱部材
WO2021201012A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 複合体の製造方法
JPWO2021200973A1 (https=) * 2020-03-31 2021-10-07
CN115298150B (zh) * 2020-03-31 2024-02-09 电化株式会社 氮化硼烧结体及其制造方法、以及复合体及其制造方法
WO2022080078A1 (ja) * 2020-10-16 2022-04-21 富士フイルム株式会社 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス
US11647612B2 (en) * 2020-11-23 2023-05-09 Toyota Motor Engineering & Manufacturing North America, Inc. High-density integrated power electronic assembly including double-sided cooling structure
JP2023112739A (ja) * 2022-02-02 2023-08-15 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2025078893A (ja) * 2022-03-30 2025-05-21 デンカ株式会社 放熱構造体
JP7594335B1 (ja) 2024-06-07 2024-12-04 アドバンスコンポジット株式会社 ヘキサゴナル窒化ホウ素粒子分散樹脂複合体及びヘキサゴナル窒化ホウ素粒子分散樹脂複合体の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100939A (ja) 2001-09-27 2003-04-04 Tokuyama Corp 放熱基板及びその製造方法
JP2005150420A (ja) * 2003-11-17 2005-06-09 Nippon Soken Inc 半導体装置の冷却構造
JP2010192717A (ja) * 2009-02-19 2010-09-02 Sumitomo Electric Ind Ltd 冷却構造
JP2013077598A (ja) 2011-09-29 2013-04-25 Shinko Electric Ind Co Ltd 熱伝導部材、熱伝導部材の製造方法及び熱伝導部材を用いた接合構造
WO2014199650A1 (ja) * 2013-06-14 2014-12-18 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
JP2015096456A (ja) * 2013-11-15 2015-05-21 電気化学工業株式会社 放熱部材およびその用途
JP2016103611A (ja) 2014-11-28 2016-06-02 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
JP2016111171A (ja) * 2014-12-05 2016-06-20 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3644428B2 (ja) 2001-11-30 2005-04-27 株式会社デンソー パワーモジュールの実装構造
US20050252177A1 (en) * 2004-05-12 2005-11-17 Shiro Ishikawa Ceramic filter and smoke treatment device
KR101928005B1 (ko) * 2011-12-01 2019-03-13 삼성전자주식회사 열전 냉각 패키지 및 이의 열관리 방법
EP3035778B1 (en) 2013-08-14 2018-10-03 Denka Company Limited Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
JP6262522B2 (ja) * 2013-12-26 2018-01-17 デンカ株式会社 樹脂含浸窒化ホウ素焼結体およびその用途

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100939A (ja) 2001-09-27 2003-04-04 Tokuyama Corp 放熱基板及びその製造方法
JP2005150420A (ja) * 2003-11-17 2005-06-09 Nippon Soken Inc 半導体装置の冷却構造
JP2010192717A (ja) * 2009-02-19 2010-09-02 Sumitomo Electric Ind Ltd 冷却構造
JP2013077598A (ja) 2011-09-29 2013-04-25 Shinko Electric Ind Co Ltd 熱伝導部材、熱伝導部材の製造方法及び熱伝導部材を用いた接合構造
WO2014199650A1 (ja) * 2013-06-14 2014-12-18 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性シートの製造方法、及びパワーモジュール
JP2015096456A (ja) * 2013-11-15 2015-05-21 電気化学工業株式会社 放熱部材およびその用途
JP2016103611A (ja) 2014-11-28 2016-06-02 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
JP2016111171A (ja) * 2014-12-05 2016-06-20 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール

Also Published As

Publication number Publication date
EP3496139A4 (en) 2019-07-31
US10615096B2 (en) 2020-04-07
KR20190046828A (ko) 2019-05-07
WO2018025933A1 (ja) 2018-02-08
EP3496139A1 (en) 2019-06-12
JPWO2018025933A1 (ja) 2019-06-06
EP3496139B1 (en) 2021-06-16
JP7282950B2 (ja) 2023-05-29
CN109791918A (zh) 2019-05-21
US20190189534A1 (en) 2019-06-20
JP2022103256A (ja) 2022-07-07
CN109791918B (zh) 2023-09-29

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