JPWO2017209236A1 - 置換または非置換アリル基含有マレイミド化合物およびその製造方法、並びに前記化合物を用いた組成物および硬化物 - Google Patents
置換または非置換アリル基含有マレイミド化合物およびその製造方法、並びに前記化合物を用いた組成物および硬化物 Download PDFInfo
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Abstract
ベンゼン環を3個以上有する構造を有し、置換または非置換アリル基を有する基を1個以上有し、さらにマレイミド基を1個以上有する化合物であることを特徴とする、置換または非置換アリル基含有マレイミド化合物。
Description
本発明の置換または非置換アリル基含有マレイミド化合物は、ベンゼン環を3個以上有する構造を有し、置換または非置換アリル基を有する基を1個以上有し、さらにマレイミド基を1個以上有する。
本発明の置換または非置換アリル基含有マレイミド化合物の製造方法は、特に限定は無いが、以下の工程を経ることで、効率的に製造を行うことが出来る。
1−2)1−1)で得られた化合物の水酸基に置換または非置換アリル基を導入する工程
1−3)1−2)で得られた化合物の保護アミノ基から脱保護する工程
1−4)1−3)で得られた化合物のアミノ基をマレイミド化する工程
本発明の組成物は、本発明の置換または非置換アリル基含有マレイミド化合物を含有する。
本発明の組成物は、本発明の置換または非置換アリル基含有マレイミド化合物以外の配合物を反応性化合物を含んでいてもよい。当該反応性化合物を含むことで、反応性や耐熱性、ハンドリング性など様々な特徴を樹脂に付与することが可能である。
本発明の組成物は、置換または非置換アリル基含有マレイミド化合物の他に、更にフィラーを含有してもよい。フィラーとしては、無機フィラーと有機フィラーが挙げられる。無機フィラーとしては、例えば無機微粒子が挙げられる。
本発明の組成物は、置換または非置換アリル基含有マレイミド化合物の他に、更に繊維質基質を含有してもよい。本発明の繊維質基質は、特に限定はないが、繊維強化樹脂に用いられるものが好ましく、無機繊維や有機繊維が挙げられる。
本発明の組成物は、組成物の固形分量や粘度を調整する目的として、分散媒を使用してもよい。分散媒としては、本発明の効果を損ねることのない液状媒体であればよく、各種有機溶剤、液状有機ポリマー等が挙げられる。
また、本発明の組成物は、本発明の置換または非置換アリル基含有マレイミド化合物以外の樹脂を有していてもよい。樹脂としては、本発明の効果を損なわない範囲であれば公知慣用の樹脂を配合すればよく、例えば熱硬化性樹脂や熱可塑性樹脂を用いることができる。
本発明の組成物は、配合物に応じて硬化剤を用いてもよい。例えば、アミン系硬化剤、アミド系硬化剤、酸無水物系硬化剤、フェノール系硬化剤、活性エステル系硬化剤、カルボキシル基含有硬化剤、チオール系硬化剤などの各種の硬化剤が挙げられる。
本発明の組成物は、その他の配合物を有していてもかまわない。例えば、触媒、重合開始剤、無機顔料、有機顔料、体質顔料、粘土鉱物、ワックス、界面活性剤、安定剤、流動調整剤、カップリング剤、染料、レベリング剤、レオロジーコントロール剤、紫外線吸収剤、酸化防止剤、難燃剤、可塑剤等が挙げられる。
本発明の組成物を硬化して得られる硬化物は、低線膨張で、高ガラス転移温度、耐熱分解性に優れることから、耐熱部材や電子部材に好適に使用可能である。硬化物の成形方法は特に限定は無く、組成物単独で成形してもよいし、基材と積層することで積層体としてもかまわない。
本発明の硬化物は基材と積層することで積層体とすることができる。
本発明の組成物が繊維質基質を有し、該繊維質基質が強化繊維の場合、繊維質基質を含有する組成物は繊維強化樹脂として用いることができる。
本発明の繊維強化樹脂は、未硬化あるいは半硬化のプリプレグと呼ばれる状態を形成することができる。プリプレグの状態で製品を流通させた後、最終硬化をおこなって硬化物を形成してもよい。積層体を形成する場合は、プリプレグを形成した後、その他の層を積層してから最終硬化を行うことで、各層が密着した積層体を形成できるため、好ましい。
本発明の置換または非置換アリル基含有マレイミド化合物は、その硬化物が低線膨張であって耐熱分解性に優れることから、耐熱部材や電子部材に好適に使用可能である。特に、半導体封止材、回路基板、ビルドアップフィルム、ビルドアップ基板等や、接着剤やレジスト材料に好適に使用可能である。また、繊維強化樹脂のマトリクス樹脂にも好適に使用可能であり、高耐熱性のプリプレグとして特に適している。また、各種溶剤への溶解性を示すことから塗料化が可能であり、従来型の300℃以上の高温焼き付けを要する耐熱塗料と比較し、低温での硬化が可能であることから、耐熱塗料用樹脂としても好適に使用可能である。こうして得られる耐熱部材や電子部材は、各種用途に好適に使用可能であり、例えば、産業用機械部品、一般機械部品、自動車・鉄道・車両等部品、宇宙・航空関連部品、電子・電気部品、建築材料、容器・包装部材、生活用品、スポーツ・レジャー用品、風力発電用筐体部材等が挙げられるが、これらに限定される物ではない。
本発明の組成物から半導体封止材料を得る方法としては、前記組成物、および硬化促進剤、および無機充填剤等の配合剤とを必要に応じて押出機、ニ−ダ、ロ−ル等を用いて均一になるまで充分に溶融混合する方法が挙げられる。その際、無機充填剤としては、通常、溶融シリカが用いられるが、パワートランジスタ、パワーIC用高熱伝導半導体封止材として用いる場合は、溶融シリカよりも熱伝導率の高い結晶シリカ,アルミナ,窒化ケイ素などの高充填化、または溶融シリカ、結晶性シリカ、アルミナ、窒化ケイ素などを用いるとよい。その充填率は硬化性樹脂組成物100質量部当たり、無機充填剤を30〜95質量%の範囲で用いることが好ましく、中でも、難燃性や耐湿性や耐ハンダクラック性の向上、線膨張係数の低下を図るためには、70質量部以上がより好ましく、80質量部以上であることがさらに好ましい。
本発明の硬化性樹脂組成物から半導体装置を得る半導体パッケージ成形としては、上記半導体封止材料を注型、或いはトランスファー成形機、射出成形機などを用いて成形し、さらに50〜250℃で2〜10時間の間、加熱する方法が挙げられる。
本発明の組成物からプリント回路基板を得る方法としては、上記プリプレグを、常法により積層し、適宜銅箔を重ねて、1〜10MPaの加圧下に170〜300℃で10分〜3時間、加熱圧着させる方法が挙げられる。
本発明の組成物からビルドアップ基板を得る方法は、例えば以下の工程が挙げられる。まず、ゴム、フィラーなどを適宜配合した上記組成物を、回路を形成した回路基板にスプレーコーティング法、カーテンコーティング法等を用いて塗布した後、硬化させる工程(工程1)。その後、必要に応じて所定のスルーホール部等の穴あけを行った後、粗化剤により処理し、その表面を湯洗することによって凹凸を形成させ、銅などの金属をめっき処理する工程(工程2)。このような操作を所望に応じて順次繰り返し、樹脂絶縁層および所定の回路パターンの導体層を交互にビルドアップして形成する工程(工程3)。なお、スルーホール部の穴あけは、最外層の樹脂絶縁層の形成後に行う。また、本発明のビルドアップ基板は、銅箔上で当該樹脂組成物を半硬化させた樹脂付き銅箔を、回路を形成した配線基板上に、170〜300℃で加熱圧着することで、粗化面を形成、メッキ処理の工程を省き、ビルドアップ基板を作製することも可能である。
本発明の組成物からビルドアップフィルムを得る方法としては、基材である支持フィルム(Y)の表面に、上記組成物を塗布し、更に加熱、あるいは熱風吹きつけ等により有機溶剤を乾燥させて組成物の層(X)を形成させることにより製造することができる。
本発明の組成物から導電ペーストを得る方法としては、例えば、導電性粒子を該組成物中に分散させる方法が挙げられる。上記導電ペーストは、用いる導電性粒子の種類によって、回路接続用ペースト樹脂組成物や異方性導電接着剤とすることができる。
装置:アジレントテクノロジー製「LC1260」
展開溶媒:下記表1に示す
検出器:フォトダイオードアレイ検出器
流量:1.0mL/分
使用カラム:Poroshell 120 EC−C18
装置:JEOL RESONANCE製「JNM−ECA600」
磁場強度:600MHz
積算回数:32回
溶媒:DMSO−d6
試料濃度:30質量%
装置:JEOL RESONANCE製「JNM−ECA600」
磁場強度:150MHz
積算回数:320回
溶媒:DMSO−d6
試料濃度:30質量%
装置:日本電子株式会社製「JMS−T100GC AccuTOF」
測定範囲:m/z=50.00〜2000.00
変化率:25.6mA/min
最終電流値:40mA
カソード電圧:−10kV
装置:日立ハイテクサイエンス社製「X−DSC7000」
雰囲気:窒素
昇温プログラム:30℃5分保持→昇温速度10℃/分→350℃2分保持
(1−1)アミノ基の保護
温度計、冷却管、攪拌機を取り付けた1Lフラスコに9,9−ビス(3−アミノ−4−ヒドロキシフェニル)フルオレン(BAHF、JFEケミカル株式会社製)50.10g(0.132mol)、N,N−ジメチルホルムアミド(DMF)580mL、イオン交換水170mL、無水酢酸33.72g(0.330mol)を仕込み、60℃で2時間反応させた後、室温まで空冷した。析出物をろ過し、イオン交換水で洗浄後、得られた粉末を80℃で8時間真空乾燥させることで反応物(a−1)を42.30g(収率68.9%)得た。
温度計、冷却管、攪拌機を取り付けた1Lフラスコに(a−1)41.91g(0.090mmol)、DMF500mLを仕込み攪拌した。次に炭酸カリウム27.97g(0.202mol)を加え、反応液を60℃まで加熱した後、臭化アリル24.66g(0.204mol)をゆっくりと滴下した。滴下終了後、60℃で8.5時間反応させた後、室温まで空冷した。ろ過後、反応液をイオン交換水で再沈殿を行った。ウェットケーキをろ別し、イオン交換水で洗浄後、80℃で12時間真空乾燥を行い粉末として(a−2)を46.12g(収率94.0%)得た。
温度計、冷却管、攪拌機を取り付けた500mLフラスコに(a−2)44.83g(0.082mol)、エタノール120mLを仕込み攪拌した。濃塩酸52.91gを加え60℃に加熱した。60℃で9時間反応後、室温まで空冷した。反応液を20%水酸化ナトリウム水溶液で中和後、酢酸エチルで抽出した。イオン交換水で洗浄し、硫酸ナトリウムを加え乾燥後、減圧濃縮した。さらに80℃で12時間真空乾燥を行い固体として(a−3)を28.51g(収率75.2%)得た。
温度計、冷却管、ディーンスタークトラップ、攪拌機を取り付けた1Lフラスコに無水マレイン酸13.51g(0.138mol)、トルエン400mLを仕込み室温で攪拌した。次に(a−3)28.51(0.062mmol)gとDMF40mLの混合溶液を30分かけて滴下した。滴下終了後、室温でさらに2時間反応させた。p−トルエンスルホン酸一水和物2.18gを加え、反応液を加熱し還流下で共沸してくる水とトルエンを冷却・分離した後、トルエンだけを系内に戻して脱水反応を12時間行った。室温まで空冷後、析出物をろ別し、80℃で12時間真空乾燥を行いアリル基含有マレイミド化合物Aを16.95g(収率44.1%)得た。
13C−NMR:δ169.73ppm、152.86ppm、150.26ppm、139.34ppm、137.52ppm、134.89ppm、133.01ppm、129.30ppm、128.08ppm、127.87ppm、125.83ppm、120.67ppm、119.90ppm、116.78ppm、113.22ppm、68.32ppm、63.23ppm;
MSスペクトル:M+=620;
純度:95.8%(HPLC面積%、検出波長275nm)
温度計、冷却管、攪拌機を取り付けた500mLフラスコに2,6−ジメチルアニリン193.04g(1.59mol)、6mol/L塩酸58.82gを仕込み攪拌した。反応液を加熱し還流状態とした後、4−ヒドロキシベンズアルデヒド48.61g(0.40mol)とDMF50mLの混合溶液をゆっくりと滴下した。滴下終了後、20時間還流下で反応させた後、60℃まで空冷した。20%水酸化ナトリウム水溶液で中和し、デカンテーションにより上澄み液を取り除いた。メタノールを加え均一溶液とした後、イオン交換水で再沈殿を行った。析出物をろ別し、イオン交換水で洗浄後、80℃で12時間真空乾燥を行い粉末として、下記式(b)で表されるヒドロキシ基含有ジアミンを116.81g(収率84.7%)得た。
13C−NMR:δ169.86ppm、156.71ppm、144.70ppm、136.73ppm、135.00ppm、134.90ppm、133.77ppm、129.99ppm、128.71ppm、127.75ppm、117.47ppm、114.62ppm、68.15ppm、54.40ppm、17.60ppm;
MSスペクトル:M+=546;
融点(DSCピークトップ):246℃;
純度:99.9%(HPLC面積%、検出波長275nm)
温度計、冷却管、ディーンスタークトラップ、攪拌機を取り付けた500mLフラスコにp−ニトロベンズアルデヒド45.12g(0.299mol)、2,6−ジメチルフェノール76.46g(0.626mol)、トルエン140mLを仕込み室温で攪拌した。p−トルエンスルホン酸一水和物5.78gを加え、反応液を加熱し還流下で共沸してくる水とトルエンを冷却・分離した後、トルエンだけを系内に戻して脱水反応を2.5時間行った。80℃まで空冷後、反応液を10%水酸化ナトリウム水溶液で中和し、トルエンで抽出した。イオン交換水で洗浄し、硫酸ナトリウムを加え乾燥後、減圧濃縮し深赤色液体を得た。80℃で12時間真空乾燥を行い橙色固体として下記式(c−0)で表されるジヒドロキシ基含有ニトロ化合物を105.41g(収率93.3%)得た。
13C−NMR:δ169.97ppm、153.91ppm、143.81ppm、138.73ppm、134.65ppm、134.55ppm、130.22ppm、129.43ppm、129.32ppm、129.13ppm、126.57ppm、116.78ppm、72.46ppm、54.48ppm、16.20ppm;
MSスペクトル:M+=507;
融点(DSCピークトップ):147℃;
純度:92.4%(HPLC面積%、検出波長254nm)
温度計、冷却管、攪拌機を取り付けた200mLフラスコに2−メトキシアニリン55.33g(0.449mol)を仕込み攪拌しながら100℃まで加熱した。ベンズアルデヒド23.86g(0.225mol)と濃塩酸11.89gの混合溶液をゆっくりと滴下した。滴下終了後、100℃で5時間反応させた後、70℃まで空冷した。反応液を20%水酸化ナトリウム水溶液で中和後、酢酸エチルで抽出した。イオン交換水で洗浄し、硫酸ナトリウムを加え乾燥後、減圧濃縮し下記式(d−0)で表されるジメトキシ基含有ジアミノ化合物を66.97g(収率88.9%)得た。
13C−NMR:δ169.92ppm、153.85ppm、145.86ppm、142.86ppm、134.99ppm、132.87ppm、130.24ppm、128.99ppm、128.50ppm、126.59ppm、121.29ppm、118.45ppm、117.06ppm、114.33ppm、68.33ppm、55.70ppm;
MSスペクトル:M+=546;
融点(DSCピークトップ):60℃;
純度:95.8%(HPLC面積%、検出波長275nm)
温度計、冷却管、ディーンスタークトラップ、攪拌機を取り付けた1Lフラスコに4,4’−ジアミノジフェニルメタン198.27g(1.00mol)、4−ヒドロキシベンジルアルコール248.28g(2.00mol)を仕込み、140℃まで加熱し、溶融状態で脱水しながら撹拌した。同温度で7時間反応後、室温まで空冷し、下記式(e)で表されるジヒドロキシ基含有ジアミノ化合物を主成分として含む固体を385.89g得た。なお、得られた式(e)で表されるジヒドロキシ基含有ジアミノ化合物のMSスペクトルおよびDSCを測定したところ、以下の結果となった。
純度:26.0%(HPLC面積%、検出波長254nm)
温度計、冷却管、ディーンスタークトラップ、攪拌機を取り付けた2Lフラスコに無水マレイン酸50.85g(0.519mol)、トルエン930mLを仕込み室温で攪拌した。次に4,4’−ジアミノ−2,2’−ジメチルビフェニル(m−TB、和歌山精化工業株式会社製)50.09g(0.236mol)とDMF110mLの混合溶液を1時間かけて滴下した。滴下終了後、室温でさらに2時間反応させた。p−トルエンスルホン酸一水和物7.08gを加え、反応液を加熱し還流下で共沸してくる水とトルエンを冷却・分離した後、トルエンだけを系内に戻して脱水反応を22時間行った。室温まで空冷後、減圧濃縮し黄色のウェットケーキ151.40gを得た。DMFに溶解させ、イオン交換水で再沈殿を行った。析出物をろ別しイオン交換水で洗浄後、80℃で12時間真空乾燥を行い黄色粉末としてビスマレイミドAを84.07g(収率95.8%)得た。なお、得られたビスマレイミドAの1H−NMR、13C−NMR、MSスペクトル、DSCを測定し、また、HPLCを測定して純度を求めたところ、以下の結果となった。
13C−NMR:δ170.01ppm、139.67ppm、136.10ppm、134.72ppm、130.74ppm、129.57ppm、127.97ppm、124.15ppm、19.58ppm;
MSスペクトル:M+=372;
融点(DSCピークトップ):194℃;
純度:91.6%(HPLC面積%、検出波長254nm)
温度計、冷却管、ディーンスタークトラップ、攪拌機を取り付けた500mLフラスコに無水マレイン酸11.09g(0.113mol)、トルエン190mLを仕込み室温で攪拌した。次に1,3−ビス(4−アミノフェノキシ)ベンゼン(TPE−R、和歌山精化工業株式会社製)15.02g(0.051mol)とDMF30mLの混合溶液を1時間かけて滴下した。滴下終了後、室温でさらに2時間反応させた。p−トルエンスルホン酸一水和物1.07gを加え、反応液を加熱し還流下で共沸してくる水とトルエンを冷却・分離した後、トルエンだけを系内に戻して脱水反応を9時間行った。室温まで空冷後、減圧濃縮し得られた反応液を、イオン交換水で再沈殿を行った。析出物をろ別し、イオン交換水で洗浄後、80℃で12時間真空乾燥を行い黄色粉末としてビスマレイミドBを21.90g(収率94.2%)得た。なお、得られたビスマレイミドAの1H−NMR、13C−NMR、MSスペクトル、DSCを測定し、また、HPLCを測定して純度を求めたところ、以下の結果となった。
13C−NMR:δ169.94ppm、157.78ppm、155.45ppm、134.65ppm、131.33ppm、128.60ppm、127.03ppm、119.03ppm、113.79ppm、109.47ppm;
MSスペクトル:M+=452;
融点(DSCピークトップ):160℃;
純度:96.3%(HPLC面積%、検出波長254nm)
比較例3として、下記式で表されるBMI−1000(4,4’−ジフェニルメタンビスマレイミド、大和化成工業株式会社製)を用いた。
実施例3〜5のアリル基含有マレイミド化合物、並びに比較例1〜3のマレイミド化合物を用いて各種評価を行った。なお、以下の評価では、実施例3〜5のアリル基含有マレイミド化合物および比較例1〜3のマレイミド化合物を総称して単に「マレイミド化合物」と称する。
マレイミド化合物を含む組成物を製造し、前記組成物を硬化して硬化物を製造した。
下記表2に従って配合し、組成物1〜8を製造した。また、得られる組成物1〜8について、以下の条件により硬化して硬化物1〜8を製造した。
硬化物板厚:2.4mm
製造した硬化物1〜8(厚さ:2.4mm)を、幅5mm、長さ54mmのサイズに切り出し、これを試験片とした。この試験片を粘弾性測定装置(DMA:日立ハイテクサイエンス社製固体粘弾性測定装置「DMS7100」、変形モード:両持ち曲げ、測定モード:正弦波振動、周波数1Hz、昇温速度3℃/分)を用いて、弾性率変化が最大となる(tanδ変化率が最も大きい)温度をガラス転移温度として評価した。得られた結果を下記表3に示す。
製造した硬化物1〜8(厚さ:2.4mm)を、幅5mm、長さ5mmのサイズに切り出し、これを試験片とした。この試験片を熱機械分析装置(日立ハイテクサイエンス社製「TMA/SS7100」、昇温速度:3℃/分)を用いて40〜60℃の範囲の膨張率を測定した。得られた結果を下記表3に示す。
製造した硬化物1〜8(厚さ:2.4mm)を細かく裁断し、熱重量分析装置(SIIナノテクノロジー社製「TG/DTA6200」)を用いて、昇温速度を5℃/分として窒素雰囲気下で測定を行い、5%重量減少する温度(Td5)を求めた。得られた結果を下記表3に示す。
マレイミド化合物および繊維質基質であるガラス繊維を含む組成物を製造し、前記組成物を硬化して硬化物を製造した。
下記表4に従って配合し、組成物9〜16を製造した。この際、ガラス繊維としてT−725H(成形材向けガラス繊維、日本電気硝子株式会社製)を用いた。
硬化物板厚:2.4mm
硬化物9〜16について、JIS−K6911:2006に準拠して曲げ試験を行い、曲げ弾性率、曲げ歪、曲げ強度を測定した。得られた結果を下記表5に示す。
マレイミド化合物およびフィラーである球状シリカを含む組成物を製造した。
下記表6に従って配合し、2本ロールを用いて150℃の温度で5分間溶融混練して組成物17〜24を製造した。この際、球状シリカとしてFB−560(電気化学株式会社製)、シランカップリング剤としてKBM−403(γ−グリシドキシトリエトキシシラン、信越化学工業株式会社製)、カルナバワックスとしてPEARL WAX No.1−P(株式会社セラリカ野田製)を用いた。
組成物を試験用金型に注入し、175℃、70kg/cm2、120秒の条件でスパイラルフロー値を測定した。この際、組成物20〜22、24は、175℃では組成物が溶融せず、スパイラルフロー値の測定ができなかった。得られた結果を下記表7に示す。
マレイミド化合物および有機溶媒であるメチルエチルケトンを含む組成物を製造した。
下記表8に従って配合し、組成物25〜32を製造した。この際、得られる組成物の不揮発分(N.V.)は58質量%である。
プライ数:6
銅箔:TCR箔(厚さ:18μm、日鉱金属株式会社製)
プリプレグ化条件:160℃/2分
硬化条件:200℃、2.9MPa、2時間
成形後板厚:0.8mm、樹脂量40%
JIS C 6481:1999に準拠し、インピーダンス・マテリアル・アナライザ「HP4291B」(アジレント・テクノロジー株式会社製)により、絶乾後23℃、湿度50%の室内に24時間保管した後の積層体の1GHzでの誘電率および誘電正接を測定した。得られた結果を下記表9に示す。
積層体を85℃、85%RHの雰囲気下で168時間放置し、吸湿処理を行った。次いで、吸湿処理を行った積層体を、260℃のハンダ浴に10秒間浸漬させ、クラックの発生の有無を目視で確認した。なお、評価は以下の基準に従い行った。得られた結果を下記表9に示す。
×:クラック発生
マレイミド化合物および光重合開始剤を含む組成物を製造した。
下記表10に従って配合し、組成物33〜40を製造した。この際、光重合開始剤としてイルガキュア907(2−メチル−1−[4−(メチルチオ)フェニル]−2−モルホリノ−1−プロパノン、BASF社製)を用いた。
組成物をガラス基板上に厚さ50μmとなるように塗布した。次いで、50mJ/cm2から10mJ/cm2刻みで紫外線を照射し、塗膜表面がタックフリーになるまでの積算光量を測定した。得られた結果を表11に示す。
マレイミド化合物および有機溶媒であるメチルエチルケトンを含む組成物を製造した。
下記表12に従って配合し、組成物41〜48を製造した。この際、得られる組成物の不揮発分(N.V.)は40質量%である。
組成物を硬化後の厚さ20μmになるように基材に塗布し、250℃で2時間硬化させ、外観を目視で観察し、以下の基準に従って評価した。得られた結果を下記表13に示す。なお、基材は標準的なステンレス板(SUS−304)を用いた。
×…造膜しない
Claims (20)
- ベンゼン環を3個以上有する構造を有し、置換または非置換アリル基を有する基を1個以上有し、さらにマレイミド基を1個以上有する化合物であることを特徴とする、置換または非置換アリル基含有マレイミド化合物。
- 下記式(2):
nおよびmは、それぞれ独立して、1〜5の整数であり、
Alyは、下記式(3):
MIは下記式(4):
Aはベンゼン環を3個以上有する構造である。)
で表されることを特徴とする、請求項1に記載の置換または非置換アリル基含有マレイミド化合物。 - 請求項1〜3のいずれか1項に記載の置換または非置換アリル基含有マレイミド化合物を含有することを特徴とする、組成物。
- さらに反応性化合物を含有する、請求項4に記載の組成物。
- 前記反応性化合物が、エポキシ基、シアナト基、マレイミド基、フェノール性水酸基、オキサジン環、アミノ基、炭素―炭素間二重結合を有する基の中から選ばれる少なくとも1つを有する化合物である、請求項5に記載の組成物。
- さらにフィラーを含有する、請求項4〜6のいずれか1項に記載の組成物。
- さらに繊維質基質を含有する、請求項4〜7のいずれか1項に記載の組成物。
- 請求項4〜8のいずれか1項に記載の組成物を硬化してなる、硬化物。
- 基材と、請求項9に記載の硬化物の層と、を有することを特徴とする、積層体。
- 請求項4〜8のいずれか1項に記載の組成物を含有することを特徴とする、耐熱材料用組成物。
- 請求項9に記載の硬化物を含有することを特徴とする、耐熱部材。
- 請求項4〜8のいずれか1項に記載の組成物を含有することを特徴とする、電子材料用組成物。
- 請求項9に記載の硬化物を含有することを特徴とする、電子部材。
- 請求項4〜8のいずれか1項に記載の組成物を含有することを特徴とする、半導体封止材。
- 請求項8に記載の組成物を含有することを特徴とする、プリプレグ。
- 請求項16に記載のプリプレグと、銅箔層と、を有することを特徴とする、回路基板。
- ビルドアップフィルムである、請求項10に記載の積層体。
- 請求項18に記載のビルドアップフィルムを有することを特徴とする、ビルドアップ基板。
- ベンゼン環を3個以上有する構造を有し、置換または非置換アリル基を有する基を1個以上有し、さらにマレイミド基を1個以上有する化合物であることを特徴とする、置換または非置換アリル基含有マレイミド化合物の製造方法であって、
1−1)ベンゼン環を3個以上有する水酸基含有芳香族アミノ化合物のアミノ基を保護する工程と、
1−2)1−1)で得られた化合物の水酸基に置換または非置換アリル基を導入する工程と、
1−3)1−2)で得られた化合物の保護アミノ基から脱保護する工程と、
1−4)1−3)で得られた化合物のアミノ基をマレイミド化する工程と、
を有することを特徴とする、製造方法。
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CN110088153B (zh) * | 2016-12-20 | 2021-03-30 | Dic株式会社 | 组合物、固化物和层叠体 |
TW201936578A (zh) * | 2018-02-28 | 2019-09-16 | 日商三菱瓦斯化學股份有限公司 | 化合物、樹脂、組成物及使用其之微影用膜形成材料 |
JP7434886B2 (ja) * | 2019-12-25 | 2024-02-21 | Dic株式会社 | (メタ)アクリレート樹脂組成物、硬化性樹脂組成物、硬化物及び物品 |
CN114621559B (zh) * | 2020-12-09 | 2023-07-11 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及包含其的预浸料、层压板和高频电路基板 |
JP2022108927A (ja) * | 2021-01-14 | 2022-07-27 | 味の素株式会社 | 樹脂組成物 |
JP2022108928A (ja) * | 2021-01-14 | 2022-07-27 | 味の素株式会社 | 樹脂組成物 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS625953A (ja) * | 1985-07-01 | 1987-01-12 | ロ−ヌ−プ−ラン・スペシアリテ・シミ−ク | 新規のマレインイミド及びそれらを含有する新規の熱硬化性組成物 |
JPS62124126A (ja) * | 1985-11-13 | 1987-06-05 | ロ−ヌ−プ−ラン・スペシアリテ・シミ−ク | イミド基を含有する重合体の製造法 |
JPS63264566A (ja) * | 1987-04-20 | 1988-11-01 | Hitachi Ltd | 付加反応型エーテルイミド系化合物を含む組成物 |
JPS6461457A (en) * | 1987-09-02 | 1989-03-08 | Hitachi Ltd | End ethynyl group-containing unsaturated imide compound and production thereof |
JPH0459759A (ja) * | 1990-06-28 | 1992-02-26 | Hitachi Chem Co Ltd | 可撓性ビスイミド化合物 |
WO2013052290A2 (en) * | 2011-10-04 | 2013-04-11 | Halliburton Energy Services, Inc. | Methods for improving coatings on downhole tools |
WO2016052290A1 (ja) * | 2014-10-01 | 2016-04-07 | Dic株式会社 | エポキシ樹脂組成物及びその硬化物 |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3931224A (en) | 1972-09-07 | 1976-01-06 | Teijin Limited | Aromatic imidodicarboxylic acid diallyl esters, prepolymers thereof, cured resins thereof, and processes for producing these |
US4168366A (en) * | 1978-07-25 | 1979-09-18 | Plastics Engineering Company | Polyimide derivatives |
US5364700A (en) * | 1985-12-27 | 1994-11-15 | Amoco Corporation | Prepregable resin composition and composite |
US4808646A (en) * | 1986-12-18 | 1989-02-28 | Monsanto Company | Maleimide-maleamic acid resin solution |
US4924005A (en) * | 1986-12-18 | 1990-05-08 | Monsanto Company | Bismaleimide resins |
US4861650A (en) * | 1986-12-18 | 1989-08-29 | Monsanto Company | Polyimide laminates |
US5159030A (en) | 1991-03-25 | 1992-10-27 | The Dow Chemical Company | Mesogenic alkenyl functional malemides and thermosets thereof |
AUPM910994A0 (en) | 1994-10-28 | 1994-11-24 | Commonwealth Scientific And Industrial Research Organisation | Bisallyloxyimides |
EP1445115A4 (en) | 2001-10-22 | 2005-02-23 | Mitsui Chemicals Inc | IMIDENCES AND OPTICAL RECORDING MEDIA MANUFACTURED THEREOF |
JP3975263B2 (ja) | 2002-02-01 | 2007-09-12 | 独立行政法人産業技術総合研究所 | ビスベンゾオキサゾール及びその製造方法 |
GB0205256D0 (en) | 2002-03-06 | 2002-04-17 | Oxford Glycosciences Uk Ltd | Novel compounds |
KR100995942B1 (ko) * | 2003-04-30 | 2010-11-22 | 디아이씨 가부시끼가이샤 | 경화성 수지 조성물 |
KR100979692B1 (ko) * | 2006-01-25 | 2010-09-02 | 디아이씨 가부시끼가이샤 | 연료 전지용 세퍼레이터 및 그 제조 방법, 및 이것을사용한 연료 전지 |
WO2009028439A1 (ja) * | 2007-08-28 | 2009-03-05 | Dic Corporation | プリズムシート、それを用いたバックライトユニットおよび液晶表示装置 |
JP2011173827A (ja) | 2010-02-24 | 2011-09-08 | Mitsubishi Chemicals Corp | ビスイミドフェノール誘導体及びその製造方法並びに高分子化合物 |
CN103619803B (zh) * | 2011-05-31 | 2016-01-20 | Dic株式会社 | 肉桂酸衍生物及其聚合物、以及由其固化物构成的液晶取向层 |
TWI535814B (zh) * | 2011-06-02 | 2016-06-01 | 迪愛生股份有限公司 | 易解體性黏著劑組成物及易解體性黏著帶 |
CN104204031B (zh) * | 2012-03-21 | 2015-10-21 | Dic株式会社 | 活性酯树脂、热固性树脂组合物、其固化物、半导体密封材料、预浸料、电路基板、和积层薄膜 |
TWI572665B (zh) * | 2012-10-17 | 2017-03-01 | Dainippon Ink & Chemicals | 活性酯樹脂、環氧樹脂組成物、其硬化物、預浸體、 電路基板以及積層膜 |
CN104936774B (zh) * | 2013-01-23 | 2017-11-14 | Dic株式会社 | 层叠体、导电性图案、电路及层叠体的制造方法 |
TWI634105B (zh) * | 2013-05-29 | 2018-09-01 | 迪愛生股份有限公司 | 聚合性組成物溶液、及使用其之光學異向體 |
CN105392817B (zh) * | 2013-06-10 | 2017-01-25 | Dic株式会社 | 含磷原子活性酯树脂、环氧树脂组合物、其固化物、预浸料、电路基板和积层薄膜 |
US20160202560A1 (en) * | 2013-08-14 | 2016-07-14 | Tokyo Institute Of Technology | Photo-alignment material and photo-alignment method |
US9690013B2 (en) * | 2013-09-27 | 2017-06-27 | Dic Corporation | Resin composition for optical material, optical film, and liquid crystal display device |
EP3061786A4 (en) * | 2013-10-24 | 2017-05-17 | DIC Corporation | Resin composition, heat-dissipating material, and heat-dissipating member |
JP6333857B2 (ja) * | 2013-12-25 | 2018-05-30 | Dic株式会社 | メソゲン基を含有する化合物、それを用いた混合物、組成物、及び、光学異方体 |
JP6509009B2 (ja) | 2014-03-28 | 2019-05-08 | 日鉄ケミカル&マテリアル株式会社 | ビスマレイミド化合物、それを含む組成物、及び硬化物 |
JP6011744B2 (ja) * | 2014-05-15 | 2016-10-19 | Dic株式会社 | 化合物、活性エネルギー線硬化性組成物、その硬化物、印刷インキ及びインクジェット記録用インキ |
US9708535B2 (en) * | 2014-06-02 | 2017-07-18 | Dic Corporation | Liquid crystal alignment layer |
WO2016002241A1 (ja) * | 2014-06-30 | 2016-01-07 | Dic株式会社 | エポキシ樹脂、硬化性樹脂組成物、硬化物、半導体封止材料、半導体装置、プレプリグ、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、及び繊維強化成形品 |
KR20170081740A (ko) * | 2014-07-15 | 2017-07-12 | 디아이씨 가부시끼가이샤 | 액정 표시 장치 |
EP3246340B1 (en) * | 2015-01-16 | 2019-10-09 | DIC Corporation | Polymerizable composition and optically anisotropic body using same |
JP6460128B2 (ja) * | 2015-01-16 | 2019-01-30 | Dic株式会社 | 位相差板及び円偏光板 |
CN105153009B (zh) | 2015-06-23 | 2018-11-13 | 复旦大学 | 具有不对称分子结构的双马来酰亚胺、其制备方法及在制备复合树脂中的应用 |
CN107709468B (zh) * | 2015-07-06 | 2020-06-16 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板和印刷电路板 |
TWI711655B (zh) * | 2015-12-02 | 2020-12-01 | 日商迪愛生股份有限公司 | 含酚性羥基之樹脂及抗蝕劑膜 |
WO2017098927A1 (ja) * | 2015-12-08 | 2017-06-15 | Dic株式会社 | オキサジン化合物、組成物及び硬化物 |
KR102644665B1 (ko) * | 2015-12-16 | 2024-03-07 | 디아이씨 가부시끼가이샤 | 옥사진 화합물, 조성물 및 경화물 |
JP6687445B2 (ja) * | 2016-03-30 | 2020-04-22 | 株式会社ダイセル | 熱硬化性化合物 |
WO2017209237A1 (ja) * | 2016-06-03 | 2017-12-07 | Dic株式会社 | 置換または非置換アリル基含有マレイミド化合物およびその製造方法、並びに前記化合物を用いた組成物および硬化物 |
JP6950686B2 (ja) * | 2016-06-03 | 2021-10-13 | Dic株式会社 | 多環芳香族アミノフェノール化合物および樹脂組成物の製造方法、並びに前記多環芳香族アミノフェノール化合物、樹脂組成物、および硬化物 |
CN110088153B (zh) * | 2016-12-20 | 2021-03-30 | Dic株式会社 | 组合物、固化物和层叠体 |
-
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS625953A (ja) * | 1985-07-01 | 1987-01-12 | ロ−ヌ−プ−ラン・スペシアリテ・シミ−ク | 新規のマレインイミド及びそれらを含有する新規の熱硬化性組成物 |
JPS62124126A (ja) * | 1985-11-13 | 1987-06-05 | ロ−ヌ−プ−ラン・スペシアリテ・シミ−ク | イミド基を含有する重合体の製造法 |
JPS63264566A (ja) * | 1987-04-20 | 1988-11-01 | Hitachi Ltd | 付加反応型エーテルイミド系化合物を含む組成物 |
JPS6461457A (en) * | 1987-09-02 | 1989-03-08 | Hitachi Ltd | End ethynyl group-containing unsaturated imide compound and production thereof |
JPH0459759A (ja) * | 1990-06-28 | 1992-02-26 | Hitachi Chem Co Ltd | 可撓性ビスイミド化合物 |
WO2013052290A2 (en) * | 2011-10-04 | 2013-04-11 | Halliburton Energy Services, Inc. | Methods for improving coatings on downhole tools |
WO2016052290A1 (ja) * | 2014-10-01 | 2016-04-07 | Dic株式会社 | エポキシ樹脂組成物及びその硬化物 |
Non-Patent Citations (4)
Title |
---|
CHIA-FU CHENG ET AL.: "Total synthesis of (+-)-camphorataimides and (+-)-himanimides by NaBH4/Ni(OAC)2 or Zn/AcOH stereosel", TETRAHEDRON, vol. 64, JPN6017024849, 2008, pages 4347 - 4353, XP022589420, ISSN: 0004534174, DOI: 10.1016/j.tet.2008.02.077 * |
ELANGO KUMARASAMY ET AL.: "Tailoring Atropisomeric Maleimides for Stereospecific [2+2] Photocycloaddition-Photochemical and Pho", JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, vol. 136, JPN6017024846, 2014, pages 8729 - 8737, XP055444988, ISSN: 0004534172, DOI: 10.1021/ja5034638 * |
HAOYU TANG ET AL.: "Synthesis, preparation and properties of novel high-performance allyl-maleimide resins", POLYMER, vol. 50, JPN6017024844, 2009, pages 1414 - 1422, XP025992732, ISSN: 0004534171, DOI: 10.1016/j.polymer.2009.01.037 * |
JIN WEN BIN ET AL.: "Structure-Activity Relationship Study of Permethyl Ningalin B Analogues as P-Glycoprotein Chemosensi", JOURNAL OF MEDICINAL CHEMISTRY, vol. 56, JPN6017024847, 2013, pages 9057 - 9070, XP055444990, ISSN: 0004534173, DOI: 10.1021/jm400930e * |
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EP3466925A1 (en) | 2019-04-10 |
US20200325101A1 (en) | 2020-10-15 |
JP6939780B2 (ja) | 2021-09-22 |
CN109219593A (zh) | 2019-01-15 |
TWI737743B (zh) | 2021-09-01 |
EP3466925A4 (en) | 2019-11-13 |
KR20190015258A (ko) | 2019-02-13 |
TW201819359A (zh) | 2018-06-01 |
WO2017209236A1 (ja) | 2017-12-07 |
KR102320490B1 (ko) | 2021-11-02 |
US10981865B2 (en) | 2021-04-20 |
CN109219593B (zh) | 2022-04-22 |
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