JPWO2017204082A1 - 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置 - Google Patents
回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置 Download PDFInfo
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- JPWO2017204082A1 JPWO2017204082A1 JP2018519229A JP2018519229A JPWO2017204082A1 JP WO2017204082 A1 JPWO2017204082 A1 JP WO2017204082A1 JP 2018519229 A JP2018519229 A JP 2018519229A JP 2018519229 A JP2018519229 A JP 2018519229A JP WO2017204082 A1 JPWO2017204082 A1 JP WO2017204082A1
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- Prior art keywords
- wafer
- holding
- outer peripheral
- rotary table
- peripheral movable
- Prior art date
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- 230000007246 mechanism Effects 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims abstract description 83
- 238000012545 processing Methods 0.000 claims abstract description 24
- 238000004140 cleaning Methods 0.000 abstract description 12
- 238000005530 etching Methods 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000005674 electromagnetic induction Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000008155 medical solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Abstract
Description
Claims (5)
- ウェーハ回転保持装置の回転テーブル用ウェーハ保持機構であって、
回転軸と、
前記回転軸の先端に載置され且つ上面にウェーハを保持する回転テーブルと、
前記回転軸に動力を供給する駆動モータと、
前記回転テーブルに設けられ且つウェーハの外周を保持するための可動する複数の外周可動ピンと、
を有し、
前記複数の外周可動ピンが、複数の第一外周可動ピンと前記複数の第一外周可動ピンとはウェーハの保持位置の異なる複数の第二外周可動ピンとから構成されてなり、
前記第一外周可動ピンが前記ウェーハを保持状態の間は前記第二外周可動ピンはウェーハを非保持状態とされてなり、前記第二外周可動ピンが前記ウェーハを保持状態の間は前記第一外周可動ピンがウェーハを非保持状態されてなり、
前記ウェーハの処理中に前記第一外周可動ピンと前記第二外周可動ピンによる保持を替えることにより、前記ウェーハの保持位置を変更するようにした、回転テーブル用ウェーハ保持機構。 - 前記複数の外周可動ピンによる前記ウェーハの保持が、前記回転テーブル内に設けられたソレノイドにより制御される、請求項1記載の回転テーブル用ウェーハ保持機構。
- 請求項1又は2記載の回転テーブル用ウェーハ保持機構を用いて、前記ウェーハを保持してなる、回転テーブル用ウェーハ保持方法。
- 請求項1又は2記載の回転テーブル用ウェーハ保持機構を備えてなる、ウェーハ回転保持装置。
- 前記ウェーハ回転保持装置が、スピン処理機構を備える、請求項4記載のウェーハ回転保持装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016103243 | 2016-05-24 | ||
JP2016103243 | 2016-05-24 | ||
PCT/JP2017/018695 WO2017204082A1 (ja) | 2016-05-24 | 2017-05-18 | 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017204082A1 true JPWO2017204082A1 (ja) | 2019-04-04 |
JP6634154B2 JP6634154B2 (ja) | 2020-01-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018519229A Active JP6634154B2 (ja) | 2016-05-24 | 2017-05-18 | 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10818538B2 (ja) |
EP (1) | EP3442015B1 (ja) |
JP (1) | JP6634154B2 (ja) |
CN (1) | CN109155272A (ja) |
WO (1) | WO2017204082A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111048466A (zh) * | 2019-12-26 | 2020-04-21 | 北京北方华创微电子装备有限公司 | 晶圆夹持装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180121562A (ko) * | 2016-04-21 | 2018-11-07 | 미마스 한도타이 고교 가부시키가이샤 | 회전 테이블용 비접촉 전력 공급 기구 및 공급 방법과 웨이퍼 회전 유지 장치 |
US10818538B2 (en) * | 2016-05-24 | 2020-10-27 | Mimasu Semiconductor Industry Co., Ltd. | Wafer holding mechanism for rotary table and method and wafer rotating and holding device |
KR101856875B1 (ko) * | 2016-12-06 | 2018-05-10 | 에스케이실트론 주식회사 | 웨이퍼 캐리어 두께 측정장치 |
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JPH09107023A (ja) * | 1995-10-13 | 1997-04-22 | Toshiba Microelectron Corp | 被処理物の回転保持装置 |
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2017
- 2017-05-18 US US16/302,859 patent/US10818538B2/en active Active
- 2017-05-18 CN CN201780030916.3A patent/CN109155272A/zh active Pending
- 2017-05-18 WO PCT/JP2017/018695 patent/WO2017204082A1/ja active Application Filing
- 2017-05-18 JP JP2018519229A patent/JP6634154B2/ja active Active
- 2017-05-18 EP EP17802674.6A patent/EP3442015B1/en active Active
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JPH09107023A (ja) * | 1995-10-13 | 1997-04-22 | Toshiba Microelectron Corp | 被処理物の回転保持装置 |
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Also Published As
Publication number | Publication date |
---|---|
EP3442015B1 (en) | 2024-02-14 |
US20190295879A1 (en) | 2019-09-26 |
US10818538B2 (en) | 2020-10-27 |
EP3442015A1 (en) | 2019-02-13 |
WO2017204082A1 (ja) | 2017-11-30 |
CN109155272A (zh) | 2019-01-04 |
JP6634154B2 (ja) | 2020-01-22 |
EP3442015A4 (en) | 2019-11-13 |
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