JPWO2016117424A1 - シャフト端部取付構造 - Google Patents
シャフト端部取付構造 Download PDFInfo
- Publication number
- JPWO2016117424A1 JPWO2016117424A1 JP2016570587A JP2016570587A JPWO2016117424A1 JP WO2016117424 A1 JPWO2016117424 A1 JP WO2016117424A1 JP 2016570587 A JP2016570587 A JP 2016570587A JP 2016570587 A JP2016570587 A JP 2016570587A JP WO2016117424 A1 JPWO2016117424 A1 JP WO2016117424A1
- Authority
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- Japan
- Prior art keywords
- shaft
- bottom plate
- ring member
- ceramic
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
ウエハを載置するセラミックプレートと一体化された中空セラミックシャフトの端部をチャンバの底板に設けた貫通孔の周縁に気密に取り付けるシャフト端部取付構造であって、
前記中空セラミックシャフトの端面に金属層を介して気密に接合された金属材料製又は金属−セラミック複合材料製のリング部材と、
シール層を介して前記リング部材を前記チャンバの底板に設けた貫通孔の周縁に載置した状態で前記底板及び前記シール層を貫通し前記リング部材を前記底板に引きつけるように締結する締結部材と、
を備えたものである。
Claims (5)
- ウエハを載置するセラミックプレートと一体化された中空セラミックシャフトの端部をチャンバの底板に設けた貫通孔の周縁に気密に取り付けるシャフト端部取付構造であって、
前記中空セラミックシャフトの端面に金属層を介して気密に接合された金属材料製又は金属−セラミック複合材料製のリング部材と、
シール層を介して前記リング部材を前記チャンバの底板に設けた貫通孔の周縁に載置した状態で前記底板及び前記シール層を貫通し前記リング部材を前記底板に引きつけるように締結する締結部材と、
を備えたシャフト端部取付構造。 - 前記締結部材は、前記底板の下面から前記底板及び前記シール層を貫通し前記リング部材のボルト穴に螺合されたボルトである、
請求項1に記載のシャフト端部取付構造。 - 前記中空セラミックシャフトは、AlN製であり、
前記リング部材は、Mo製、W製又はFeNiCo系合金製である、
請求項1又は2に記載のシャフト端部取付構造。 - 前記金属層は、Al層又はAl合金層である、
請求項1〜3のいずれか1項に記載のシャフト端部取付構造。 - 前記金属層は、TCBにより形成されたものである、
請求項4に記載のシャフト端部取付構造。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562105367P | 2015-01-20 | 2015-01-20 | |
US62/105,367 | 2015-01-20 | ||
PCT/JP2016/050796 WO2016117424A1 (ja) | 2015-01-20 | 2016-01-13 | シャフト端部取付構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6085073B2 JP6085073B2 (ja) | 2017-02-22 |
JPWO2016117424A1 true JPWO2016117424A1 (ja) | 2017-04-27 |
Family
ID=56416971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016570587A Active JP6085073B2 (ja) | 2015-01-20 | 2016-01-13 | シャフト端部取付構造 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10388560B2 (ja) |
JP (1) | JP6085073B2 (ja) |
KR (1) | KR101773749B1 (ja) |
CN (1) | CN107078093B (ja) |
TW (1) | TWI666705B (ja) |
WO (1) | WO2016117424A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6834257B2 (ja) * | 2016-08-31 | 2021-02-24 | 日亜化学工業株式会社 | 発光素子の製造方法 |
JP6758143B2 (ja) * | 2016-09-29 | 2020-09-23 | 日本特殊陶業株式会社 | 加熱装置 |
JP6863784B2 (ja) * | 2017-03-16 | 2021-04-21 | 株式会社Screenホールディングス | 基板処理装置 |
CN111095521B (zh) | 2017-10-24 | 2023-03-28 | 日本碍子株式会社 | 晶片载置台及其制法 |
KR102498911B1 (ko) * | 2018-04-11 | 2023-02-10 | 주식회사 디엠에스 | 기판처리장치 |
CN113170536B (zh) * | 2019-01-25 | 2023-06-09 | 日本碍子株式会社 | 陶瓷加热器及其制法 |
KR20210139368A (ko) * | 2019-07-01 | 2021-11-22 | 엔지케이 인슐레이터 엘티디 | 샤프트를 갖는 세라믹 히터 |
CN113939904A (zh) * | 2020-01-15 | 2022-01-14 | 日本特殊陶业株式会社 | 保持装置 |
CN112485471A (zh) * | 2020-12-03 | 2021-03-12 | 中国航空工业集团公司北京航空精密机械研究所 | 温控转台台面和陶瓷轴的安装方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1012711A (ja) * | 1996-06-25 | 1998-01-16 | Applied Materials Inc | ウェハ支持装置 |
JP2002009079A (ja) * | 2000-06-26 | 2002-01-11 | Tokyo Electron Ltd | 枚葉式処理装置 |
JP2004152865A (ja) * | 2002-10-29 | 2004-05-27 | Nhk Spring Co Ltd | ステージ |
JP2004207465A (ja) * | 2002-12-25 | 2004-07-22 | Nhk Spring Co Ltd | ステージ |
JP2005317749A (ja) * | 2004-04-28 | 2005-11-10 | Sumitomo Electric Ind Ltd | 半導体製造装置用保持体及びそれを搭載した半導体製造装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3563564B2 (ja) * | 1997-06-09 | 2004-09-08 | 東京エレクトロン株式会社 | ガス処理装置 |
JP4398064B2 (ja) * | 2000-05-12 | 2010-01-13 | 日本発條株式会社 | 加熱装置 |
JP3925702B2 (ja) | 2002-03-18 | 2007-06-06 | 日本碍子株式会社 | セラミックヒーター |
EP1612854A4 (en) | 2003-04-07 | 2007-10-17 | Tokyo Electron Ltd | LOADING TABLE AND HEAT TREATMENT DEVICE WITH LOADING TABLE |
US7126093B2 (en) * | 2005-02-23 | 2006-10-24 | Ngk Insulators, Ltd. | Heating systems |
US8055125B2 (en) * | 2005-07-14 | 2011-11-08 | Tokyo Electron Limited | Substrate stage mechanism and substrate processing apparatus |
JP2010232532A (ja) * | 2009-03-27 | 2010-10-14 | Sumitomo Electric Ind Ltd | 高周波電極の接続方法を改善したウエハ保持体及びそれを搭載した半導体製造装置 |
JP2011165891A (ja) * | 2010-02-09 | 2011-08-25 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
JP5501467B2 (ja) * | 2010-09-24 | 2014-05-21 | 日本碍子株式会社 | 半導体製造装置部材 |
US8908349B2 (en) * | 2011-03-31 | 2014-12-09 | Ngk Insulators, Ltd. | Member for semiconductor manufacturing apparatus |
-
2016
- 2016-01-13 KR KR1020177006594A patent/KR101773749B1/ko active IP Right Grant
- 2016-01-13 JP JP2016570587A patent/JP6085073B2/ja active Active
- 2016-01-13 WO PCT/JP2016/050796 patent/WO2016117424A1/ja active Application Filing
- 2016-01-13 CN CN201680002554.2A patent/CN107078093B/zh active Active
- 2016-01-18 TW TW105101346A patent/TWI666705B/zh active
-
2017
- 2017-02-28 US US15/444,919 patent/US10388560B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1012711A (ja) * | 1996-06-25 | 1998-01-16 | Applied Materials Inc | ウェハ支持装置 |
JP2002009079A (ja) * | 2000-06-26 | 2002-01-11 | Tokyo Electron Ltd | 枚葉式処理装置 |
JP2004152865A (ja) * | 2002-10-29 | 2004-05-27 | Nhk Spring Co Ltd | ステージ |
JP2004207465A (ja) * | 2002-12-25 | 2004-07-22 | Nhk Spring Co Ltd | ステージ |
JP2005317749A (ja) * | 2004-04-28 | 2005-11-10 | Sumitomo Electric Ind Ltd | 半導体製造装置用保持体及びそれを搭載した半導体製造装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101773749B1 (ko) | 2017-08-31 |
TW201642345A (zh) | 2016-12-01 |
TWI666705B (zh) | 2019-07-21 |
KR20170036795A (ko) | 2017-04-03 |
JP6085073B2 (ja) | 2017-02-22 |
CN107078093B (zh) | 2020-01-07 |
US20170170052A1 (en) | 2017-06-15 |
US10388560B2 (en) | 2019-08-20 |
WO2016117424A1 (ja) | 2016-07-28 |
CN107078093A (zh) | 2017-08-18 |
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