JP2010232532A - 高周波電極の接続方法を改善したウエハ保持体及びそれを搭載した半導体製造装置 - Google Patents
高周波電極の接続方法を改善したウエハ保持体及びそれを搭載した半導体製造装置 Download PDFInfo
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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Abstract
【解決手段】 チャンバー内に設置され、高周波電極回路5が埋設されたウエハ保持部1と、ウエハ保持部1をそのウエハ載置面1aの反対側の面1bから支持する支持部材2と、支持部材2に関してウエハ保持部1の反対側に設けられたアース部品3と、支持部材2の内部に挿通され、高周波電極回路5とアース部品3とを電気的に接続する導電性接続部品7とを有するウエハ保持体10であって、導電性接続部品7は鉛直方向に変形能を有し、かつ、導電性接続部品7の主たる電流パスを担う接続部分が面接触で固着している。
【選択図】 図1
Description
そして、重ね合わせたシートに圧力を加えて一体化する。加える圧力は、1〜100MPaの範囲が好ましい。1MPa未満の圧力では、シートが充分に一体化せず、その後の工程中に剥離することがある。また、100MPaを超える圧力を加えると、シートの変形量が大きくなりすぎる。
窒化アルミニウム粉末99.5重量部に焼結助剤として酸化イットリウム0.5重量部を加え、更にバインダー、有機溶剤を加えてボールミル混合することによってスラリーを作製した。得られたスラリーをスプレードライすることにより顆粒を作製し、これをプレス成形して成形体を作製した。次に、この成形体を窒素雰囲気中にて700℃の条件で脱脂した後、窒素雰囲気中において1850℃で焼結して窒化アルミニウム焼結体を得た。得られた焼結体を、直径330mm、厚み10mmに加工した。このときの表面粗さはRaで0.8μm、平面度は50μmであった。
高周波電極回路用の導電性接続部品として、実施例1の平板状の金属リードに代えて、幅8mm、厚さ0.3mmのステンレス箔を準備し、棒状の外径5mmの治具を芯材の周りにステンレス箔同士が互いにオーバーラップしないように予め巻きつけた後、治具を取り除き、下側に開口部を有する外径10mm、内径6mmの電極保護用セラミックパイプの内壁に沿うように装てんし、その下部開口部からステンレス箔の端部を取り出してそこに穴を開け、アース部となるアース部品に直接ねじ止めを行って図5に示すような構造のウエハ保持体を作製した。これに上記実施例1と同様の長期信頼性試験を行った。その結果、100,000ショットのプラズマを安定して印加し続けることが可能であった。
高周波電極回路用の導電性接続部品として、実施例1の平板状の金属リードに代えて、幅8mm、厚さ1mmのステンレス平板を両端部を除いて全体的に湾曲させて板バネとし、これを鉛直方向に延在して一端部を電極部品に接続すると共に、他端部をアース部となるアース部品に直接ねじ止めを行って図4に示すような構造のウエハ保持体を作製した。これに実施例1と同様の長期信頼性試験を行った。その結果、100,000ショットのプラズマを安定して印加し続けることが可能であった。
平板状の金属リードを、下記表1に示す種々の材料及びサイズにした以外は実施例1と同様にしてウエハ保持体を作製した。これら試料1〜11に対して、実施例1と同様のプラズマ印加条件で100回のプラズマ印加を行い、問題が生じないか観察した。その結果、下記表1に示す観察結果が得られた。
図6に示すような、金属ロッド57をアース部品3に直接固定した以外は実施例1と同様にしてウエハ保持体を作製した。このウエハ保持体に対して、実施例1と同様のプラズマ印加条件でプラズマ印加を行なったところ、32枚目のウエハ処理を行った段階で、金属ロッド57がウエハ保持部1を突き上げてしまい、ウエハ保持部1が破損してしまうトラブルが発生した。
図7に示すような、金属ロッド67の下部にスリットを設け、コイル状のスプリングコンタクトと呼ばれる接触子67aを介在させてアース部品3に電気的、機械的に接触させた以外は実施例1と同様にしてウエハ保持体を作製した。その際、材質として高電力通電可能なベリリウム銅タイプと、強度的に反発力のあるステンレスタイプの2種を使用した。これらウエハ保持体に対して、プラズマ印加を行なった。
図8に示すような、両端に圧着端子を取り付けた撚り線77を用い、直接アース部品3にねじ止め固定を行った以外は実施例1と同様にしてウエハ保持体を作製した。このウエハ保持体に対して、実施例1と同様のプラズマ印加条件で100回のプラズマ印加を行い、問題が生じないか観察した。その結果、2kWのプラズマ印加にすると、100ショットに3回程度ちらつきが見られ、安定したプラズマ印加ができなくなった。これは、撚り線77の構造が、主たる電流パスの中に点接触しかない部分を多く抱えたものであるために発生しているものと思われる。
2 支持部材
3 アース部品
4 抵抗発熱体回路
5 高周波電極回路
6 抵抗発熱体回路用の導電性接続部品
7 高周波電極回路用の導電性接続部品
7a、17a、27a 金属ロッド
7b、17b、27b 金属リード
10 ウエハ保持体
Claims (5)
- チャンバー内に設置され、高周波電極回路が埋設されたウエハ保持部と、該ウエハ保持部をそのウエハ載置面の反対側の面から支持する支持部材と、該支持部材に関してウエハ保持部の反対側に設けられたアース部品と、該支持部材の内部に挿通され、該高周波電極回路と該アース部品とを電気的に接続する導電性接続部品とを有するウエハ保持体であって、該導電性接続部品は鉛直方向に変形能を有し、かつ、導電性接続部品の主たる電流パスを担う接続部分が面接触で固着していることを特徴とするウエハ保持体。
- 前記導電性接続部品は、前記高周波電極回路に接続する鉛直方向下向きに延在する金属製の剛性部材と、該剛性部材に接続する可とう性部材とを有することを特徴とする、請求項1に記載のウエハ保持体。
- 前記可とう性部材は、鉛直方向下向きに延在するらせん状部材若しくは板バネ状部材、又は水平方向に延在する平板状部材であることを特徴とする、請求項2に記載のウエハ保持体。
- 前記導電性接続部品と前記アース部品との接続部分が、前記支持部材と前記アース部品との接続と同時又はその後に接続可能な構造であることを特徴とする、請求項1〜3のいずれかに記載のウエハ保持体。
- 請求項1〜4のいずれかに記載のウエハ保持体を搭載していることを特徴とする半導体製造装置。
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JP2009080166A JP2010232532A (ja) | 2009-03-27 | 2009-03-27 | 高周波電極の接続方法を改善したウエハ保持体及びそれを搭載した半導体製造装置 |
PCT/JP2010/054506 WO2010110137A1 (ja) | 2009-03-27 | 2010-03-17 | 高周波電極の接続方法を改善したウエハ保持体及びそれを搭載した半導体製造装置 |
CN2010800016762A CN102047383A (zh) | 2009-03-27 | 2010-03-17 | 改善高频电极的连接方法的晶片保持体及搭载该晶片保持体的半导体制造装置 |
KR1020107024455A KR20110128722A (ko) | 2009-03-27 | 2010-03-17 | 고주파 전극의 접속 방법을 개선한 웨이퍼 유지체 및 그것을 탑재한 반도체 제조 장치 |
TW099108407A TWI480972B (zh) | 2009-03-27 | 2010-03-22 | A wafer holding body for improving the connection method of the high-frequency electrode, and a semiconductor manufacturing apparatus comprising the same |
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KR20140038910A (ko) * | 2012-09-21 | 2014-03-31 | 노벨러스 시스템즈, 인코포레이티드 | 고온 전극 연결들 |
WO2014175425A1 (ja) * | 2013-04-26 | 2014-10-30 | 京セラ株式会社 | 試料保持具 |
JP2019016676A (ja) * | 2017-07-06 | 2019-01-31 | 日本特殊陶業株式会社 | 半導体製造装置用部品、および、半導体製造装置用部品の製造方法 |
WO2020116259A1 (ja) * | 2018-12-06 | 2020-06-11 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
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JP5891953B2 (ja) * | 2012-05-31 | 2016-03-23 | 新東工業株式会社 | 支持部材、加熱プレート支持装置及び加熱装置 |
KR101773749B1 (ko) * | 2015-01-20 | 2017-08-31 | 엔지케이 인슐레이터 엘티디 | 샤프트 단부 부착 구조 |
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JP2017216287A (ja) * | 2016-05-30 | 2017-12-07 | 日本特殊陶業株式会社 | 基板支持部材及び給電端子 |
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JP7038496B2 (ja) | 2017-07-06 | 2022-03-18 | 日本特殊陶業株式会社 | 半導体製造装置用部品、および、半導体製造装置用部品の製造方法 |
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CN102047383A (zh) | 2011-05-04 |
WO2010110137A1 (ja) | 2010-09-30 |
TWI480972B (zh) | 2015-04-11 |
KR20110128722A (ko) | 2011-11-30 |
TW201036103A (en) | 2010-10-01 |
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