JPWO2016031860A1 - 金属質銅粒子及びその製造方法 - Google Patents

金属質銅粒子及びその製造方法 Download PDF

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Publication number
JPWO2016031860A1
JPWO2016031860A1 JP2016545578A JP2016545578A JPWO2016031860A1 JP WO2016031860 A1 JPWO2016031860 A1 JP WO2016031860A1 JP 2016545578 A JP2016545578 A JP 2016545578A JP 2016545578 A JP2016545578 A JP 2016545578A JP WO2016031860 A1 JPWO2016031860 A1 JP WO2016031860A1
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Japan
Prior art keywords
metallic copper
particles
gelatin
metallic
acid
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Pending
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JP2016545578A
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English (en)
Japanese (ja)
Inventor
清信 井田
清信 井田
渡辺　満
満 渡辺
友成　雅則
雅則 友成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Sangyo Kaisha Ltd
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Ishihara Sangyo Kaisha Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/09—Mixtures of metallic powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B22F2009/245—Reduction reaction in an Ionic Liquid [IL]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
JP2016545578A 2014-08-28 2015-08-26 金属質銅粒子及びその製造方法 Pending JPWO2016031860A1 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014174251 2014-08-28
JP2014174251 2014-08-28
JP2015081081 2015-04-10
JP2015081081 2015-04-10
PCT/JP2015/074025 WO2016031860A1 (ja) 2014-08-28 2015-08-26 金属質銅粒子及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2016031860A1 true JPWO2016031860A1 (ja) 2017-06-15

Family

ID=55399746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016545578A Pending JPWO2016031860A1 (ja) 2014-08-28 2015-08-26 金属質銅粒子及びその製造方法

Country Status (8)

Country Link
US (1) US20170252801A1 (ko)
EP (1) EP3187288A4 (ko)
JP (1) JPWO2016031860A1 (ko)
KR (1) KR20170046164A (ko)
CN (1) CN106715009A (ko)
CA (1) CA2959294A1 (ko)
TW (1) TWI658156B (ko)
WO (1) WO2016031860A1 (ko)

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JP5941588B2 (ja) * 2014-09-01 2016-06-29 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
US20180264548A1 (en) * 2015-01-09 2018-09-20 Clarkson University Silver Coated Copper Flakes and Methods of Their Manufacture
JP6746094B2 (ja) * 2016-03-22 2020-08-26 株式会社豊田中央研究所 親水性ポリマー被覆銅ナノ粒子の製造方法
TWI623946B (zh) * 2016-07-05 2018-05-11 國立成功大學 奈米銀漿料之製備方法
US10827747B2 (en) * 2016-08-08 2020-11-10 Universiti Brunei Darussalam Anti-bacterial and anti-fungal photocatalytic coating film and method for producing thereof
JP7007140B2 (ja) * 2016-09-30 2022-01-24 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
WO2018083996A1 (ja) * 2016-11-02 2018-05-11 富士フイルム株式会社 微粒子、分散液、及び消臭剤
JP6908398B2 (ja) * 2017-03-08 2021-07-28 株式会社Adeka 樹脂組成物、硬化物を形成する方法および硬化物
WO2019017363A1 (ja) 2017-07-18 2019-01-24 旭化成株式会社 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線
CN108115127A (zh) * 2017-11-29 2018-06-05 上海师范大学 一种纳米铜仿生材料及其制备方法与应用
JP7006872B2 (ja) * 2017-11-29 2022-01-24 国立大学法人北海道大学 低温焼結性銅粒子とそれを用いた焼結体の製造方法
US11127530B2 (en) 2018-01-30 2021-09-21 Tekna Plasma Systems Inc. Metallic powders for use as electrode material in multilayer ceramic capacitors and method of manufacturing and of using same
JP6985202B2 (ja) * 2018-03-30 2021-12-22 トヨタ自動車株式会社 金属ナノ粒子の製造方法
JP6526888B1 (ja) * 2018-08-01 2019-06-05 Ｊｘ金属株式会社 セラミックス層と銅粉ペースト焼結体の積層体
JP6526889B1 (ja) * 2018-08-01 2019-06-05 Ｊｘ金属株式会社 セラミックス層と銅粉ペースト焼結体の積層体
TWI835866B (zh) * 2018-09-28 2024-03-21 日商納美仕有限公司 導電性膏
US11890681B2 (en) * 2018-11-29 2024-02-06 Resonac Corporation Method for producing bonded object and semiconductor device and copper bonding paste
JP2020100888A (ja) * 2018-12-25 2020-07-02 京セラ株式会社 銅粒子、銅粒子の製造方法、銅ペースト及び半導体装置並びに電気・電子部品
CN110202136B (zh) * 2019-05-21 2021-09-03 深圳第三代半导体研究院 一种低温烧结铜膏及其烧结工艺
CN110202137B (zh) * 2019-05-29 2021-07-20 深圳第三代半导体研究院 一种低温烧结铜膏及其烧结工艺
CN110181041B (zh) * 2019-05-29 2021-09-03 深圳第三代半导体研究院 一种表面进行抗氧化保护的铜颗粒、低温烧结铜膏及使用其的烧结工艺
JP7347980B2 (ja) * 2019-07-18 2023-09-20 株式会社リコー 定着装置および画像形成装置
CN110695373B (zh) * 2019-10-14 2022-05-10 天津大学 具有双层谐波结构的石墨烯包覆稀土元素负载铜复合材料的制备方法
JP7488832B2 (ja) * 2019-11-18 2024-05-22 日清エンジニアリング株式会社 微粒子および微粒子の製造方法
CN111128702A (zh) * 2019-12-10 2020-05-08 Tcl华星光电技术有限公司 一种金属电极的制备方法
JP7302487B2 (ja) * 2020-01-14 2023-07-04 トヨタ自動車株式会社 複合粒子、及び複合粒子の製造方法
JP6901227B1 (ja) * 2020-03-25 2021-07-14 石原ケミカル株式会社 銅インク及び導電膜形成方法
JP7465747B2 (ja) 2020-07-31 2024-04-11 京セラ株式会社 被覆銅粒子、被覆銅粒子の製造方法、銅ペースト、銅ペーストの製造方法、及び半導体装置
US20220143538A1 (en) * 2020-10-15 2022-05-12 Engineered Materials, Inc. Filtration system and method of use thereof
WO2022176926A1 (ja) * 2021-02-22 2022-08-25 三菱マテリアル株式会社 接合用ペースト、接合層、接合体及び接合体の製造方法
CN115188589B (zh) * 2021-04-02 2023-08-01 北京元六鸿远电子科技股份有限公司 一种mlcc可印刷用铜外电极浆料
JP7000621B1 (ja) * 2021-06-17 2022-01-19 古河ケミカルズ株式会社 銅微粒子の製造方法
CN114346254B (zh) * 2022-01-21 2023-08-18 重庆科技学院 一种在低共熔离子液体中制备纳米铜粉的方法
CN117600459A (zh) * 2023-11-06 2024-02-27 广东凯洋新材料有限公司 一种散热支架及其制备方法

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JP2004232012A (ja) * 2003-01-29 2004-08-19 Fuji Photo Film Co Ltd 高濃度金属微粒子分散液の製造方法
JP2004256857A (ja) * 2003-02-25 2004-09-16 Ishihara Sangyo Kaisha Ltd 銅微粒子及びその製造方法
JP2005183144A (ja) * 2003-12-18 2005-07-07 Alps Electric Co Ltd 導電性組成物及びその製造方法
WO2006019144A1 (ja) * 2004-08-20 2006-02-23 Ishihara Sangyo Kaisha, Ltd. 銅微粒子及びその製造方法
WO2007013393A1 (ja) * 2005-07-25 2007-02-01 Sumitomo Metal Mining Co., Ltd. 銅微粒子分散液及びその製造方法
JP2007184143A (ja) * 2006-01-06 2007-07-19 Sumitomo Metal Mining Co Ltd 導電粉の表面処理方法と導電粉及び導電性ペースト
JP2007258123A (ja) * 2006-03-27 2007-10-04 Sumitomo Metal Mining Co Ltd 導電性組成物及び導電膜形成方法
WO2009116349A1 (ja) * 2008-03-21 2009-09-24 旭硝子株式会社 銅ナノ粒子被覆銅フィラー、その製造方法、銅ペーストおよび金属膜を有する物品
WO2010024385A1 (ja) * 2008-08-29 2010-03-04 石原産業株式会社 金属銅分散液及びその製造方法並びにそれを用いて形成した電極、配線パターン、塗膜、その塗膜を形成した装飾物品、抗菌性物品及びそれらの製造方法
WO2010032841A1 (ja) * 2008-09-19 2010-03-25 旭硝子株式会社 導電性フィラー、導電性ペーストおよび導電膜を有する物品
WO2010035258A2 (en) * 2008-09-25 2010-04-01 Nanoready Ltd. Discrete metallic copper nanoparticles
WO2012161201A1 (ja) * 2011-05-23 2012-11-29 旭硝子株式会社 導電ペーストおよびこれを用いた導電膜付き基材、ならびに導電膜付き基材の製造方法
JP2013064191A (ja) * 2011-08-30 2013-04-11 Fujifilm Corp コラーゲンペプチド被覆銅ナノ粒子、コラーゲンペプチド被覆銅ナノ粒子分散物、コラーゲンペプチド被覆銅ナノ粒子の製造方法、導電性インク、導電膜の製造方法、及び導体配線

Patent Citations (13)

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Publication number Priority date Publication date Assignee Title
JP2004232012A (ja) * 2003-01-29 2004-08-19 Fuji Photo Film Co Ltd 高濃度金属微粒子分散液の製造方法
JP2004256857A (ja) * 2003-02-25 2004-09-16 Ishihara Sangyo Kaisha Ltd 銅微粒子及びその製造方法
JP2005183144A (ja) * 2003-12-18 2005-07-07 Alps Electric Co Ltd 導電性組成物及びその製造方法
WO2006019144A1 (ja) * 2004-08-20 2006-02-23 Ishihara Sangyo Kaisha, Ltd. 銅微粒子及びその製造方法
WO2007013393A1 (ja) * 2005-07-25 2007-02-01 Sumitomo Metal Mining Co., Ltd. 銅微粒子分散液及びその製造方法
JP2007184143A (ja) * 2006-01-06 2007-07-19 Sumitomo Metal Mining Co Ltd 導電粉の表面処理方法と導電粉及び導電性ペースト
JP2007258123A (ja) * 2006-03-27 2007-10-04 Sumitomo Metal Mining Co Ltd 導電性組成物及び導電膜形成方法
WO2009116349A1 (ja) * 2008-03-21 2009-09-24 旭硝子株式会社 銅ナノ粒子被覆銅フィラー、その製造方法、銅ペーストおよび金属膜を有する物品
WO2010024385A1 (ja) * 2008-08-29 2010-03-04 石原産業株式会社 金属銅分散液及びその製造方法並びにそれを用いて形成した電極、配線パターン、塗膜、その塗膜を形成した装飾物品、抗菌性物品及びそれらの製造方法
WO2010032841A1 (ja) * 2008-09-19 2010-03-25 旭硝子株式会社 導電性フィラー、導電性ペーストおよび導電膜を有する物品
WO2010035258A2 (en) * 2008-09-25 2010-04-01 Nanoready Ltd. Discrete metallic copper nanoparticles
WO2012161201A1 (ja) * 2011-05-23 2012-11-29 旭硝子株式会社 導電ペーストおよびこれを用いた導電膜付き基材、ならびに導電膜付き基材の製造方法
JP2013064191A (ja) * 2011-08-30 2013-04-11 Fujifilm Corp コラーゲンペプチド被覆銅ナノ粒子、コラーゲンペプチド被覆銅ナノ粒子分散物、コラーゲンペプチド被覆銅ナノ粒子の製造方法、導電性インク、導電膜の製造方法、及び導体配線

Also Published As

Publication number Publication date
CN106715009A (zh) 2017-05-24
EP3187288A1 (en) 2017-07-05
CA2959294A1 (en) 2016-03-03
TW201623639A (zh) 2016-07-01
WO2016031860A1 (ja) 2016-03-03
EP3187288A4 (en) 2018-04-11
TWI658156B (zh) 2019-05-01
KR20170046164A (ko) 2017-04-28
US20170252801A1 (en) 2017-09-07

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