JPWO2016031067A1 - はんだ材料、はんだ継手及びはんだ材料の製造方法 - Google Patents
はんだ材料、はんだ継手及びはんだ材料の製造方法 Download PDFInfo
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- JPWO2016031067A1 JPWO2016031067A1 JP2015525662A JP2015525662A JPWO2016031067A1 JP WO2016031067 A1 JPWO2016031067 A1 JP WO2016031067A1 JP 2015525662 A JP2015525662 A JP 2015525662A JP 2015525662 A JP2015525662 A JP 2015525662A JP WO2016031067 A1 JPWO2016031067 A1 JP WO2016031067A1
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- solder
- less
- sno
- layer
- film
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
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Abstract
Description
そこで、黄色度が所定値以下、すなわち、酸化膜が所定値以下のはんだボールを使用し、加熱によって酸化膜を破壊して、接合できるようにした技術が提案されている(例えば、特許文献1参照)。この特許文献1においては、先ず、製造後に表面の黄化度が10以下となるはんだボールを選別し、保管状態を厳密に管理することにより、はんだボール表面の黄化を防止、すなわち、はんだボール表面のSnO酸化膜の成長を抑制すると共に、このはんだボールを用いて形成されたはんだバンプの表面に、SnO酸化膜及びSnO2酸化膜が形成されることが開示されている。
図1は、本実施の形態のはんだ材料の一例としてのはんだボールの模式的な構造を示す断面図である。なお、本明細書において、はんだ材料の組成に関する単位(ppm、ppb、及び%)は、特に指定しない限り質量に対する割合(質量ppm、質量ppb、及び質量%)を表す。
図2A、図2B及び図2Cは、本実施の形態のはんだ材料の一例としてのはんだボールの製造方法を模式的に示した断面図である。
Agが3%、Cuが0.5%、残部がSnからなる金属材料で、滴下法によりはんだ層2に相当する金属球を作成した。この金属球に、プラズマ照射法で被覆層3に相当する被膜を形成して実施例のはんだボールを生成した。プラズマ照射法は、溶融した金属材料が滴下するまでの間に高濃度のO2-Arプラズマを照射した。
測定条件:Beam Voltage:10kV, 試料電流:10nA(Arイオン銃を用いたスパッタ深さの測定方法は、ISO/TR 15969に準拠。)
2・・・はんだ層
3・・・被膜層
3a・・・SnO膜
3b・・・SnO2膜
し易いことに着目して、はんだと電極端子の接合性を向上させているが、保管状態の管理以外に、酸化膜の組成で酸化膜の成長を抑制することについての開示は一切ない。更に、特許文献2に関しては、SnO酸化膜の成長を抑制することについての開示は一切ない。
[0010]
そこで、本発明は、酸化膜の成長を抑制できるようにし、これにより、保管性及び濡れ性の良好なるはんだ材料、はんだ継手及びはんだ材料の製造方法を提供することを目的とする。
課題を解決するための手段
[0011]
本発明者らは、Snを主成分とするはんだ層を、SnO及びSnO2を有する被覆層で被覆することで、酸化膜の成長を抑制できることを見出した。なお、SnO及びSnO2を有する被覆層とは、SnOを主成分とする酸化錫からなる酸化被膜層、及び、SnO2を主成分とする酸化錫からなる酸化被膜層を意味する。以下の説明においても同様である。
[0012]
そこで、請求項1に記載の発明は、Snの含有量が40%以上の合金からなる金属材料またはSnの含有量が100%である金属材料からなるはんだ層と、はんだ層の表面を被覆する被覆層を備えた直径が1〜1000μmの球体であり、被覆層は、はんだ層の外側にSnO膜が形成され、SnO膜の外側にSnO2膜が形成され、被覆層の厚さは、0nmより大きく4.5nm以下であるはんだ材料である。
[0013]
請求項2に記載の発明は、黄色度が5.7以下である請求項1に記載のはんだ材料である。
[0014]
請求項3に記載の発明は、Snの含有量が40%以上の合金からなる金属材料またはSnの含有量が100%である金属材料からなるはんだ層と、はんだ層の表面を被覆する被覆層を備えた直径が1〜1000μmの球体であり、被覆層は、はんだ層の外側にSnO膜が形成され、SnO膜の外側にSnO2膜が形成され、黄色度が5.7以下であるはんだ材料である。
[0015]
請求項4に記載の発明は、はんだ層は、Agを0%以上4%未満、Cuを0%以上1%未満、Pを0ppm以上5ppm未満、Geを0ppm以上20ppm未満で含む請求項1〜請求項3のいずれか1項に記載のはんだ材料
である。
[0016]
請求項5に記載の発明は、はんだ層は、Snの含有量が40%以上となるように、(i)Ni、Co、Fe、Sbから選ばれる少なくとも1つの元素を、全体で1%未満あるいはそれぞれを1%未満含有し、及び、In、Biから選ばれる少なくとも1つ以上の元素を、全体で40%未満あるいはIn、Biの一方を40%未満、他方を20%未満含有し、あるいは、(ii)Ni、Co、Fe、Sbから選ばれる少なくとも1つの元素を、全体で1%未満あるいはそれぞれを1%未満含有するか、または、In、Biから選ばれる少なくとも1つ以上の元素を、全体で40%未満あるいはIn、Biの一方を40%未満、他方を20%未満含有した請求項1〜請求項4のいずれか1項に記載のはんだ材料である。
[0017]
請求項6に記載の発明は、放射されるα線量が0.0200cph/cm2以下である請求項1〜請求項5のいずれか1項に記載のはんだ材料である。
[0018]
[0019]
請求項8に記載の発明は、請求項1〜6のいずれか1項に記載のはんだ材料を使用して得たはんだ継手である。
[0020]
請求項9に記載の発明は、Snの含有量が40%以上の合金からなる金属材料またはSnの含有量が100%である金属材料からなるはんだ層を形成するはんだ層形成工程と、はんだ層の外側にSnO膜を形成し、SnO膜の外側にSnO2膜を形成して、厚さが0nmより大きく4.5nm以下の被覆層を、はんだ層の表面に形成する酸化膜形成工程を含み、直径が1〜1000μmの球体を製造するはんだ材料の製造方法である。
[0021]
請求項10に記載の発明は、酸化膜形成工程で、被覆層表面の黄色度が5.7以下に形成される請求項9に記載のはんだ材料の製造方法である。
[0022]
請求項11に記載の発明は、酸化膜形成工程は、はんだ層の表面にO2−Arプラズマを照射する請求項9または請求項10に記載のはんだ材料の製造方法である。
Claims (11)
- Snの含有量が40%以上の合金からなる金属材料またはSnの含有量が100%である金属材料からなるはんだ層と、
前記はんだ層の表面を被覆する被覆層を備え、
前記被覆層は、前記はんだ層の外側にSnO膜が形成され、前記SnO膜の外側にSnO2膜が形成され、前記被覆層の厚さは、0nmより大きく4.5nm以下である
ことを特徴とするはんだ材料。 - 黄色度が5.7以下である
ことを特徴とする請求項1に記載のはんだ材料。 - Snの含有量が40%以上の合金からなる金属材料またはSnの含有量が100%である金属材料からなるはんだ層と、
前記はんだ層の表面を被覆する被覆層を備え、
前記被覆層は、前記はんだ層の外側にSnO膜が形成され、前記SnO膜の外側にSnO2膜が形成され、
黄色度が5.7以下である
ことを特徴とするはんだ材料。 - 前記はんだ層は、Agを0%以上4%未満、Cuを0%以上1%未満、Pを0ppm以上5ppm未満、Geを0ppm以上20ppm未満で含む
ことを特徴とする請求項1〜請求項3のいずれか1項に記載のはんだ材料。 - 前記はんだ層は、Snの含有量が40%以上となるように、
(i)Ni、Co、Fe、Sbから選ばれる少なくとも1つの元素を、全体で1%未満あるいはそれぞれを1%未満含有し、及び、In、Biから選ばれる少なくとも1つ以上の元素を、全体で40%未満あるいはIn、Biの一方を40%未満、他方を20%未満含有し、
あるいは、
(ii)Ni、Co、Fe、Sbから選ばれる少なくとも1つの元素を、全体で1%未満あるいはそれぞれを1%未満含有するか、または、In、Biから選ばれる少なくとも1つ以上の元素を、全体で40%未満あるいはIn、Biの一方を40%未満、他方を20%未満含有した
ことを特徴とする請求項1〜請求項4のいずれか1項に記載のはんだ材料。 - 放射されるα線量が0.0200cph/cm2以下である
ことを特徴とする請求項1〜請求項5のいずれか1項に記載のはんだ材料。 - 直径が1〜1000μmの球体である
ことを特徴とする請求項1〜請求項6のいずれか1項に記載のはんだ材料。 - 請求項1〜7のいずれか1項に記載のはんだ材料を使用して得た
ことを特徴とするはんだ継手。 - Snの含有量が40%以上の合金からなる金属材料またはSnの含有量が100%である金属材料からなるはんだ層を形成するはんだ層形成工程と、
前記はんだ層の外側にSnO膜を形成し、前記SnO膜の外側にSnO2膜を形成して、厚さが0nmより大きく4.5nm以下の被覆層を、前記はんだ層の表面に形成する酸化膜形成工程を含む
ことを特徴とするはんだ材料の製造方法。 - 前記酸化膜形成工程で、前記被覆層表面の黄色度が5.7以下に形成される
ことを特徴とする請求項9に記載のはんだ材料の製造方法。 - 前記酸化膜形成工程は、前記はんだ層の表面にO2-Arプラズマを照射する
ことを特徴とする請求項9または請求項10に記載のはんだ材料の製造方法。
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US11344976B2 (en) | 2017-11-24 | 2022-05-31 | Senju Metal Industry Co., Ltd. | Solder material, solder paste, and solder joint |
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JP5807733B1 (ja) | 2015-11-10 |
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